What is the global market size of Advanced Packaging Market?

Advanced Packaging Market size was valued at USD 26.31 billion in 2021 and is poised to grow from USD 30.60 billion in 2022 to USD 56 billion by 2030, growing at a CAGR of 7.84% in the forecast period (2023-2030).

Advanced Packaging Market Size, Share, Growth Analysis, By Type(Flip Chip CSP, and Flip-Chip Ball Grid Array), By End-Use(Consumer Electronics, and Automotive) - Industry Forecast 2024-2031

Q: Who are the key vendors in the Global Advanced Packaging Market?

The Global Advanced Packaging Market is characterized by intense competition and a dynamic landscape with several key players vying for market dominance. Companies operating in this market continuously strive to develop innovative packaging solutions and stay ahead in the race to meet evolving customer demands. ' Intel Corporation (United States) ', ' Advanced Micro Devices (AMD) (United States) ', ' Taiwan Semiconductor Manufacturing Company (TSMC) (Taiwan) ', ' Samsung Electronics (South Korea) ', ' ASE Group (Taiwan) ', ' Amkor Technology (United States) ', ' JCET Group (China) ', ' Powertech Technology (Taiwan) ', ' Siliconware Precision Industries Co., Ltd. (SPIL) (Taiwan) ', ' ChipMOS Technologies Inc. (Taiwan) ', ' UTAC Holdings Ltd. (Singapore) ', ' Tokyo Electron Limited (Japan) ', ' SCHOTT AG (Germany) ', ' Palomar Technologies (United States) ', ' Rudolph Technologies (United States) ', ' BESI Group (Netherlands) ', ' STATS ChipPAC Ltd. (Singapore) '.

Report ID: SQMIG15H2036 | Region: Global | Published Date: March, 2024
Pages: 184 | Tables: 61 | Figures: 72

Advanced Packaging Market News

June 2023: Intel announced that it is using its own EMIB packaging technology for its new Xeon Scalable processors. EMIB is a 2.5D packaging technology that can integrate multiple dies on a single substrate.
May 2023: AMD announced that it is using TSMC's InFO-X packaging technology for its new Ryzen 7000 series processors. The Ryzen 7000 series processors are the first mainstream processors to use 3D packaging technology.
April 2023: Samsung Electronics announced that it has developed a new packaging technology called Fan-Out Wafer Level Packaging (FOWLP). FOWLP is a high-density packaging technology that can be used to pack more dies on a single substrate.
March 2023: TSMC announced that it has begun mass production of its InFO-X packaging technology. InFO-X is a 3D packaging technology that can integrate multiple dies on a single substrate.
February 2023: Intel announced that it is investing $1 billion in a new advanced packaging research and development facility in Israel. The facility will focus on developing new technologies for 3D packaging, chiplets, and heterogeneous integration.

Advanced Packaging Market Report Snapshots

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Advanced Packaging Market size was valued at USD 30.60 billion in 2022 and is poised to grow from USD 33 billion in 2023 to USD 60.36 billion by 2031, growing at a CAGR of 7.84% during the forecast period (2024-2031).

The Advanced Packaging Market is characterized by intense competition and a dynamic landscape with several key players vying for market dominance. Companies operating in this market continuously strive to develop innovative packaging solutions and stay ahead in the race to meet evolving customer demands. ' Intel Corporation (United States) ', ' Advanced Micro Devices (AMD) (United States) ', ' Taiwan Semiconductor Manufacturing Company (TSMC) (Taiwan) ', ' Samsung Electronics (South Korea) ', ' ASE Group (Taiwan) ', ' Amkor Technology (United States) ', ' JCET Group (China) ', ' Powertech Technology (Taiwan) ', ' Siliconware Precision Industries Co., Ltd. (SPIL) (Taiwan) ', ' ChipMOS Technologies Inc. (Taiwan) ', ' UTAC Holdings Ltd. (Singapore) ', ' Tokyo Electron Limited (Japan) ', ' SCHOTT AG (Germany) ', ' Palomar Technologies (United States) ', ' Rudolph Technologies (United States) ', ' BESI Group (Netherlands) ', ' STATS ChipPAC Ltd. (Singapore) '

With the continuous trend of miniaturization in electronics, advanced packaging techniques are essential to integrate multiple components into a single package, improving overall performance and functionality.

Fan-Out Wafer-Level Packaging (FOWLP) Adoption: Fan-Out Wafer-Level Packaging has gained significant traction due to its ability to enable thinner and more cost-effective packages, making it a popular choice for mobile devices and high-performance applications.

Asia-Pacific emerges as the world's most rapidly growing region in the advanced packaging market. This remarkable growth is attributed to the availability of cutting-edge technologies, surging demand for smart devices, and the continuous expansion of manufacturing industries in the region. Contributing to the evolution of packaging technology are various non-profit organizations that actively invest in developing enhanced power infrastructure, further propelling the expansion of the advanced packaging market in Asia-Pacific.

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Advanced Packaging Market Size, Share, Growth Analysis, By Type(Flip Chip CSP, and Flip-Chip Ball Grid Array), By End-Use(Consumer Electronics, and Automotive) - Industry Forecast 2024-2031

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