Advanced Packaging Market Size, Share, Growth Analysis, By Type(Flip Chip CSP, and Flip-Chip Ball Grid Array), By End-Use(Consumer Electronics, and Automotive) - Industry Forecast 2024-2031

Report ID: SQMIG15H2036 | Region: Global | Published Date: March, 2024
Pages: 184 | Tables: 61 | Figures: 72

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Advanced Packaging Market size was valued at USD 30.60 billion in 2022 and is poised to grow from USD 33 billion in 2023 to USD 60.36 billion by 2031, growing at a CAGR of 7.84% during the forecast period (2024-2031).

The Advanced Packaging Market is characterized by intense competition and a dynamic landscape with several key players vying for market dominance. Companies operating in this market continuously strive to develop innovative packaging solutions and stay ahead in the race to meet evolving customer demands. ' Intel Corporation (United States) ', ' Advanced Micro Devices (AMD) (United States) ', ' Taiwan Semiconductor Manufacturing Company (TSMC) (Taiwan) ', ' Samsung Electronics (South Korea) ', ' ASE Group (Taiwan) ', ' Amkor Technology (United States) ', ' JCET Group (China) ', ' Powertech Technology (Taiwan) ', ' Siliconware Precision Industries Co., Ltd. (SPIL) (Taiwan) ', ' ChipMOS Technologies Inc. (Taiwan) ', ' UTAC Holdings Ltd. (Singapore) ', ' Tokyo Electron Limited (Japan) ', ' SCHOTT AG (Germany) ', ' Palomar Technologies (United States) ', ' Rudolph Technologies (United States) ', ' BESI Group (Netherlands) ', ' STATS ChipPAC Ltd. (Singapore) '

With the continuous trend of miniaturization in electronics, advanced packaging techniques are essential to integrate multiple components into a single package, improving overall performance and functionality.

Fan-Out Wafer-Level Packaging (FOWLP) Adoption: Fan-Out Wafer-Level Packaging has gained significant traction due to its ability to enable thinner and more cost-effective packages, making it a popular choice for mobile devices and high-performance applications.

Asia-Pacific emerges as the world's most rapidly growing region in the advanced packaging market. This remarkable growth is attributed to the availability of cutting-edge technologies, surging demand for smart devices, and the continuous expansion of manufacturing industries in the region. Contributing to the evolution of packaging technology are various non-profit organizations that actively invest in developing enhanced power infrastructure, further propelling the expansion of the advanced packaging market in Asia-Pacific.

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Advanced Packaging Market Size, Share, Growth Analysis, By Type(Flip Chip CSP, and Flip-Chip Ball Grid Array), By End-Use(Consumer Electronics, and Automotive) - Industry Forecast 2024-2031

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