Global Electronic Packaging Market

Electronic Packaging Market Size, Share, Growth Analysis, By Type Sub-SegmentsCorrugated Boxes, Paperboard Boxes, Thermoformed Trays, Bags and Pouches, Blister packs and Clamshell, and Protective Packaging(Plastic, Metal, Glass, and Others), By Material(Semiconductor & IC, PCB, and Others), By Application(Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication), By End-User(Electronic Article Surveillance (EAS), and Radio-frequency Identification), By Region - Industry Forecast 2024-2031


Report ID: SQMIG15F2168 | Region: Global | Published Date: March, 2024
Pages: 184 |Tables: 119 |Figures: 72

Electronic Packaging Market Insights

Global Electronic Packaging Market size was valued at USD 1.46 billion in 2022 and is poised to grow from USD 1.72 billion in 2023 to USD 9.04 billion by 2031, growing at a CAGR of 18.03% in the forecast period (2024-2031).

The rise of IoT and AI and the proliferation of complex electronics are driving the higher applications in the consumer electronics and automotive industries and due to these factors, electronic packaging is being adopted more advanced technology has been adopted to meet the demand. Additionally, Amcor Technology partnered with Samsung Electronics to develop the state-of-the-art H-Cube solution. Samsung Electronics announced the development of Hybrid-Substrate Cube technology, its modern 2.5D packaging solution built expressly for semiconductors for HPC, AI, data center, and network devices requiring high performance and large area packaging technologies.

Since then, the global market has undergone a transition to the 5th generation of wi-fi, 802.11ac with MIMO. A growing number of customers are likely to adopt the technology due to speeds up to 1.3 GHz over long distances, driving demand.

Recent developments in the market include innovative, unique, vibrant and memorable designs with minimal aesthetics driving the market growth. In February 2022, the Smurfit Kappa Group announced a $33 million expansion of its Brazilian facility. This will help the company expand its portfolio of home packaging, fresh produce and shelf-ready pharmaceuticals. Furthermore, the automotive industry accounts for the largest segment of the market studied, mainly due to the increasing adoption of electric vehicles (EVs) and hybrid vehicles as electric and hybrid vehicles use large amounts of memory devices. processors, analog circuits, discrete power devices are used therefore and sensors. The demand is expected to grow rapidly over the forecast period.

According to the IBEF, the Indian electric vehicle (EV) market is expected to reach Rs 50,000 crore (US$7.09 billion (about $22 per person in the US)) by 2025. Moreover, a study by the Center for Energy Finance CEEW sees opportunities in India of $206 billion for electric vehicles by 2030. Such developments are electronic packaging. It will continue to grow its market.

 

Market Snapshot - 2024-2031

Global Market Size

USD 1.46 billion

Largest Segment

PCB

Fastest Growth

Growth Rate

18.03% CAGR

Global Electronic Packaging Market ($ Bn)
Country Share for North America Region (%)

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Electronic Packaging Market Segmental Analysis

Based on type, the electronic packaging market can be segmented into Corrugated Boxes, Paperboard Boxes, Thermoformed Trays, Bags and Pouches, Blister packs and Clamshell, Protective Packaging. Based on material, the electronic packaging market can be segmented into Plastic, Metal, Glass, Others. Based on application, the electronic packaging market can be segmented into Semiconductor & IC, PCB, Others. Based on end-user, the electronic packaging market can be segmented into Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, Others. Based on technology, the electronic packaging market can be segmented into Electronic Article Surveillance (EAS), Radio-frequency Identification. By region, the study provides market insights into North America, Europe, Asia-Pacific, and the Rest of the World.

Analysis by Application

The semiconductor and IC segment dominated the market by 2022 and is expected to continue its dominance during the forecast period. Semiconductor packaging is a metal, glass, plastic or ceramic enclosure that contains one or more isolated semiconductor devices or integrated circuits. In semiconductor packaging, individual or discrete features are produced on semiconductor wafers such as silicon before being diced, tested, and packaged as dies electronic packaging protects against hazards such as chemical injections, light exposure, and mechanical attachment. High demand for semiconductor processing technologies in electronics applications in healthcare, electronics and aerospace and defense industries is driving the market growth.

The PCB segment provides a platform for connecting and interconnecting various electronic components, allowing electrical signals to flow between them. The copper layer on the PCB facilitates the transmission of signals and power throughout the electronic system. PCBs are substrates for electronic components such as resistors, capacitors, integrated circuits, and other active and passive devices. This mechanical support is essential for the structural integrity of the electronic assembly.

Analysis by End-User

The consumer electronics segment is the dominant segment of the global electronic packaging market, with a market share of over 38% by 2022. This is due to the high demand for semiconductor devices in consumer electronics such as smartphones, tablets and laptops.

 

The automotive segment is the fastest growing segment of the global electronic packaging market, with a CAGR of over 12% during the forecast period. The automotive segment is expected to grow at the fastest pace during the forecast period. This is due to the increasing demand for semiconductor devices in automotive applications such as advanced driver assistance systems (ADAS), infotainment systems and powertrain control systems.

Global Electronic Packaging Market By Application, 2022 (%)

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Electronic Packaging Market Regional Insights

North America is the dominating region in the global electronic packaging market, with a CAGR of more than 10% during the forecast period. The regional growth is driven by increasing demand for semiconductor equipment in the automotive, industrial and healthcare industries. North America, particularly California’s Silicon Valley, is a global hub for technological innovation and research. Many major semiconductor companies, electronics manufacturers and research institutes are headquartered or have a large presence in the region. This drives advances in electronic packaging technology, enabling improvements such as miniaturization, higher component density and improved thermal management.

The Asia-Pacific region is estimated to hold the largest market share during the forecast period owing to rising vehicle infrastructure and rise in electric vehicles, rising middle class income, youth and population increasing numbers can lead to increased demand in the automotive industry. According to IBEF, the total production of passenger cars, three-wheelers, two-wheelers and four-wheelers by June 2022 is 2,081,148 units, which will drive the studied market growth future. The Asia-Pacific region in the global electronic packaging market is expected to grow significantly by 2029 due to demand from the electronics industry, technological advancements, and availability of more electronic components and electronic devices in important consumption areas role in healthcare devices and packaging solutions, along with increase in smaller components are expected to propel the market growth in the near future China is a major contributor to the market.

Global Electronic Packaging Market By Region, 2024-2031
  • Largest
  • Fastest

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Electronic Packaging Market Dynamics

Drivers

  • Rising Advances in Miniaturization

Enhanced semiconductor packaging techniques are driven by the desire for smaller and smaller electronics, including smartphones and wearable IoT devices. Miniaturization reduces both the size and weight of electronic devices for better performance, and increases performance improve. Advanced packaging technology allows multiple functions and features to be integrated in a small step.

  • Rapid Technological Advances

The continued development of electronic devices, including smartphones, tablets, wearables, and IoT devices, is driving the demand for innovative and efficient electronic packaging solutions to accommodate smaller volumes, increased productivity, and improved productivity. Consumers are looking for smaller, lighter and more portable electronic devices with greater functionality. This trend is pushing manufacturers to develop electronic packaging solutions that allow for smaller sizes without compromising on performance, reliability or durability.

Restraints

  • Debt and Financial Resources

Cost is an important restraint in the electronic packaging market. Advanced packaging technologies often require complex components, specialized equipment, and high-quality materials, which can increase production costs. Furthermore, the need for continued investment in advanced packaging technology and equipment can present financial challenges for manufacturers. Market competition and pricing pressures from customers affect profitability and may restrict the adoption of improved packaging solutions.

  • Cost Constraints

The development and implementation of advanced electronic packaging solutions typically involves higher costs due to specialized materials, manufacturing processes, and technical constraints a Cost barrier can hinder the adoption of advanced packaging solutions, especially in cost-constrained markets. Advanced packaging technologies such as 3D integration, wafer-level packaging, heterogeneous fit pose technical challenges related to complex design, temperature control, signal integrity, and reliability It is important to invest significantly in R&D and knowledge to overcome these challenges.

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Electronic Packaging Market Competitive Landscape

The competitive environment of the Global Electronic Packaging Market is dynamic and characterized by the presence of a mix of well-established brands, emerging players, and niche producers. Innovation is a key competitive factor. The global market competitive landscape provides detailed information from competitors. Detailed information includes company overview, company financials, earnings, market potential, investment in research and development, new market strategy, global presence, manufacturing regions and locations of production, manufacturing capacity, company strengths and weaknesses, product launches, product expansion and expansion, application authority.

Top Player’s Company Profiles

  • STATS ChipPAC Pte. Ltd. (Singapore)
  • Samsung Electronics Co., Ltd. (South Korea)
  • UTAC Holdings Ltd. (Singapore)
  • ChipMOS Technologies Inc. (Taiwan)
  • Intel Corporation (United States)
  • Advanced Semiconductor Engineering, Inc. (Taiwan)
  • Siliconware Precision Industries Co., Ltd. (Taiwan)
  • Jiangsu Changjiang Electronics Technology (China)
  • Powertech Technology Inc. (Taiwan)
  • Amkor Technology, Inc. (United States)
  • STATS ChipPAC Pte. Ltd. (Singapore)
  • Samsung Electronics Co., Ltd. (South Korea)
  • Tongfu Microelectronics Co., Ltd. (China)
  • Unisem Group (Malaysia)
  • Nepes Corporation (South Korea)

Recent Developments

  • In September 2023, International Paper celebrated the grand opening of its state-of-the-art corrugated packaging facility in Attglen, PA. The new $100 million company stands as a testament to the company’s commitment to excellence. Its primary focus is on manufacturing premium packaging products designed to serve a variety of industries, including manufacturing, processed foods, beverages, shipping, products distribution, and the rapid expansion of e-commerce.
  • June 2022 - Digimark Corporation announces a partnership with SealedAir, a global leader in digital printing and packaging, to bring digital products to market such as e-commerce fulfillment, technology and products through smart packaging.
  • March 2022 - Intel unveils the first phase of its efforts to invest up to 80 billion euros (US$84 billion in the EU over the next decade) in the semiconductor value chain, from research and development from manufacturing to advanced packaging technology.

Electronic Packaging Key Market Trends

Rising Demand for Electronics

  • According to the National Investment Promotion and Facilitation Agency (NIPFA), the demand for electronics in India has surged. The electronics sector is expected to reach USS 220 billion by 2025 due to strong regulatory support, capital flows from mass participation and increasing demand for electronic products. Significant growth in domestic demand, technological development and high-quality products have been the major drivers for China’s industrial growth Such a large production of paper and paper in China creates a favorable environment for the sale of electronic products packaging of materials.

Electronic Packaging Market SkyQuest Analysis

SkyQuest’s ABIRAW (Advanced Business Intelligence, Research & Analysis Wing) is our Business Information Services team that Collects, Collates, Correlates, and Analyzes the Data collected by means of Primary Exploratory Research backed by robust Secondary Desk research.

The global spread of the epidemic has led to a loss of sales of electronic packaging solutions and consumer electronic packaging. Mobile phone and computer industries drive the demand for consumer electronics packaging. Even during the pandemic, production in these industries has not been severely affected by suspended production, raw material shortages and supply chain disruptions.

The auto industry is going through a period of technological change. The demand for electronics and semiconductor products is expected to increase in the future. The trend towards electric vehicles calls for more lightweight vehicles, which can be achieved by packaging even lighter to aggressive packaging solutions in the automotive industry today is gearing up for the challenges of the future. Packaging is now widespread in the electronics industry, contributing to the longevity and durability of electronics Printed circuit boards and major installations in the electronics industry. PCB bonding uses adhesives in surface mounting. The combination of chip and PCB board is expected to drive the demand for electronic packaging.

Report Metric Details
Market size value in 2022 USD 1.46 billion
Market size value in 2031 USD 9.04 billion
Growth Rate 18.03%
Base year 2023
Forecast period 2024-2031
Forecast Unit (Value) USD Billion
Segments covered
  • Type Sub-SegmentsCorrugated Boxes, Paperboard Boxes, Thermoformed Trays, Bags and Pouches, Blister packs and Clamshell, and Protective Packaging
    • Plastic, Metal, Glass, and Others
  • Material
    • Semiconductor & IC, PCB, and Others
  • Application
    • Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, and Others
  • End-User
    • Electronic Article Surveillance (EAS), and Radio-frequency Identification
Regions covered North America (US, Canada), Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe), Asia Pacific (China, India, Japan, Rest of Asia-Pacific), Latin America (Brazil, Rest of Latin America), Middle East & Africa (South Africa, GCC Countries, Rest of MEA)
Companies covered
  • STATS ChipPAC Pte. Ltd. (Singapore)
  • Samsung Electronics Co., Ltd. (South Korea)
  • UTAC Holdings Ltd. (Singapore)
  • ChipMOS Technologies Inc. (Taiwan)
  • Intel Corporation (United States)
  • Advanced Semiconductor Engineering, Inc. (Taiwan)
  • Siliconware Precision Industries Co., Ltd. (Taiwan)
  • Jiangsu Changjiang Electronics Technology (China)
  • Powertech Technology Inc. (Taiwan)
  • Amkor Technology, Inc. (United States)
  • STATS ChipPAC Pte. Ltd. (Singapore)
  • Samsung Electronics Co., Ltd. (South Korea)
  • Tongfu Microelectronics Co., Ltd. (China)
  • Unisem Group (Malaysia)
  • Nepes Corporation (South Korea)
Customization scope

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Table Of Content

Executive Summary

Market overview

  • Exhibit: Executive Summary – Chart on Market Overview
  • Exhibit: Executive Summary – Data Table on Market Overview
  • Exhibit: Executive Summary – Chart on Electronic Packaging Market Characteristics
  • Exhibit: Executive Summary – Chart on Market by Geography
  • Exhibit: Executive Summary – Chart on Market Segmentation
  • Exhibit: Executive Summary – Chart on Incremental Growth
  • Exhibit: Executive Summary – Data Table on Incremental Growth
  • Exhibit: Executive Summary – Chart on Vendor Market Positioning

Parent Market Analysis

Market overview

Market size

  • Market Dynamics
    • Exhibit: Impact analysis of DROC, 2021
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
  • SWOT Analysis

KEY MARKET INSIGHTS

  • Technology Analysis
    • (Exhibit: Data Table: Name of technology and details)
  • Pricing Analysis
    • (Exhibit: Data Table: Name of technology and pricing details)
  • Supply Chain Analysis
    • (Exhibit: Detailed Supply Chain Presentation)
  • Value Chain Analysis
    • (Exhibit: Detailed Value Chain Presentation)
  • Ecosystem Of the Market
    • Exhibit: Parent Market Ecosystem Market Analysis
    • Exhibit: Market Characteristics of Parent Market
  • IP Analysis
    • (Exhibit: Data Table: Name of product/technology, patents filed, inventor/company name, acquiring firm)
  • Trade Analysis
    • (Exhibit: Data Table: Import and Export data details)
  • Startup Analysis
    • (Exhibit: Data Table: Emerging startups details)
  • Raw Material Analysis
    • (Exhibit: Data Table: Mapping of key raw materials)
  • Innovation Matrix
    • (Exhibit: Positioning Matrix: Mapping of new and existing technologies)
  • Pipeline product Analysis
    • (Exhibit: Data Table: Name of companies and pipeline products, regional mapping)
  • Macroeconomic Indicators

COVID IMPACT

  • Introduction
  • Impact On Economy—scenario Assessment
    • Exhibit: Data on GDP - Year-over-year growth 2016-2022 (%)
  • Revised Market Size
    • Exhibit: Data Table on Electronic Packaging Market size and forecast 2021-2027 ($ million)
  • Impact Of COVID On Key Segments
    • Exhibit: Data Table on Segment Market size and forecast 2021-2027 ($ million)
  • COVID Strategies By Company
    • Exhibit: Analysis on key strategies adopted by companies

MARKET DYNAMICS & OUTLOOK

  • Market Dynamics
    • Exhibit: Impact analysis of DROC, 2021
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
  • Regulatory Landscape
    • Exhibit: Data Table on regulation from different region
  • SWOT Analysis
  • Porters Analysis
    • Competitive rivalry
      • Exhibit: Competitive rivalry Impact of key factors, 2021
    • Threat of substitute products
      • Exhibit: Threat of Substitute Products Impact of key factors, 2021
    • Bargaining power of buyers
      • Exhibit: buyers bargaining power Impact of key factors, 2021
    • Threat of new entrants
      • Exhibit: Threat of new entrants Impact of key factors, 2021
    • Bargaining power of suppliers
      • Exhibit: Threat of suppliers bargaining power Impact of key factors, 2021
  • Skyquest special insights on future disruptions
    • Political Impact
    • Economic impact
    • Social Impact
    • Technical Impact
    • Environmental Impact
    • Legal Impact

Market Size by Region

  • Chart on Market share by geography 2021-2027 (%)
  • Data Table on Market share by geography 2021-2027(%)
  • North America
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • USA
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Canada
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Europe
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • Germany
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Spain
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • France
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • UK
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of Europe
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Asia Pacific
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • China
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • India
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Japan
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • South Korea
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of Asia Pacific
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Latin America
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • Brazil
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of South America
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Middle East & Africa (MEA)
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • GCC Countries
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • South Africa
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of MEA
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)

KEY COMPANY PROFILES

  • Competitive Landscape
    • Total number of companies covered
      • Exhibit: companies covered in the report, 2021
    • Top companies market positioning
      • Exhibit: company positioning matrix, 2021
    • Top companies market Share
      • Exhibit: Pie chart analysis on company market share, 2021(%)

Methodology

For the Electronic Packaging Market, our research methodology involved a mixture of primary and secondary data sources. Key steps involved in the research process are listed below:

1. Information Procurement: This stage involved the procurement of Market data or related information via primary and secondary sources. The various secondary sources used included various company websites, annual reports, trade databases, and paid databases such as Hoover's, Bloomberg Business, Factiva, and Avention. Our team did 45 primary interactions Globally which included several stakeholders such as manufacturers, customers, key opinion leaders, etc. Overall, information procurement was one of the most extensive stages in our research process.

2. Information Analysis: This step involved triangulation of data through bottom-up and top-down approaches to estimate and validate the total size and future estimate of the Electronic Packaging Market.

3. Report Formulation: The final step entailed the placement of data points in appropriate Market spaces in an attempt to deduce viable conclusions.

4. Validation & Publishing: Validation is the most important step in the process. Validation & re-validation via an intricately designed process helped us finalize data points to be used for final calculations. The final Market estimates and forecasts were then aligned and sent to our panel of industry experts for validation of data. Once the validation was done the report was sent to our Quality Assurance team to ensure adherence to style guides, consistency & design.

Analyst Support

Customization Options

With the given market data, our dedicated team of analysts can offer you the following customization options are available for the Electronic Packaging Market:

Product Analysis: Product matrix, which offers a detailed comparison of the product portfolio of companies.

Regional Analysis: Further analysis of the Electronic Packaging Market for additional countries.

Competitive Analysis: Detailed analysis and profiling of additional Market players & comparative analysis of competitive products.

Go to Market Strategy: Find the high-growth channels to invest your marketing efforts and increase your customer base.

Innovation Mapping: Identify racial solutions and innovation, connected to deep ecosystems of innovators, start-ups, academics, and strategic partners.

Category Intelligence: Customized intelligence that is relevant to their supply Markets will enable them to make smarter sourcing decisions and improve their category management.

Public Company Transcript Analysis: To improve the investment performance by generating new alpha and making better-informed decisions.

Social Media Listening: To analyze the conversations and trends happening not just around your brand, but around your industry as a whole, and use those insights to make better Marketing decisions.

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FAQs

Electronic Packaging Market size was valued at USD 1.46 billion in 2022 and is poised to grow from USD 1.72 billion in 2023 to USD 9.04 billion by 2031, growing at a CAGR of 18.03% in the forecast period (2024-2031).

The competitive environment of the Electronic Packaging Market is dynamic and characterized by the presence of a mix of well-established brands, emerging players, and niche producers. Innovation is a key competitive factor. The market competitive landscape provides detailed information from competitors. Detailed information includes company overview, company financials, earnings, market potential, investment in research and development, new market strategy, presence, manufacturing regions and locations of production, manufacturing capacity, company strengths and weaknesses, product launches, product expansion and expansion, application authority. 'STATS ChipPAC Pte. Ltd. (Singapore)', 'Samsung Electronics Co., Ltd. (South Korea)', 'UTAC Holdings Ltd. (Singapore)', 'ChipMOS Technologies Inc. (Taiwan)', 'Intel Corporation (United States)', 'Advanced Semiconductor Engineering, Inc. (Taiwan)', 'Siliconware Precision Industries Co., Ltd. (Taiwan)', 'Jiangsu Changjiang Electronics Technology (China)', 'Powertech Technology Inc. (Taiwan)', 'Amkor Technology, Inc. (United States)', 'STATS ChipPAC Pte. Ltd. (Singapore)', 'Samsung Electronics Co., Ltd. (South Korea)', 'Tongfu Microelectronics Co., Ltd. (China)', 'Unisem Group (Malaysia)', 'Nepes Corporation (South Korea)'

Rising Advances in Miniaturization

According to the National Investment Promotion and Facilitation Agency (NIPFA), the demand for electronics in India has surged. The electronics sector is expected to reach USS 220 billion by 2025 due to strong regulatory support, capital flows from mass participation and increasing demand for electronic products. Significant growth in domestic demand, technological development and high-quality products have been the major drivers for China’s industrial growth Such a large production of paper and paper in China creates a favorable environment for the sale of electronic products packaging of materials.

North America is the dominating region in the electronic packaging market, with a CAGR of more than 10% during the forecast period. The regional growth is driven by increasing demand for semiconductor equipment in the automotive, industrial and healthcare industries. North America, particularly California’s Silicon Valley, is a hub for technological innovation and research. Many major semiconductor companies, electronics manufacturers and research institutes are headquartered or have a large presence in the region. This drives advances in electronic packaging technology, enabling improvements such as miniaturization, higher component density and improved thermal management.

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