Global Advanced Packaging Market

Advanced Packaging Market Size, Share, Growth Analysis, By Type(Flip Chip CSP, and Flip-Chip Ball Grid Array), By End-Use(Consumer Electronics, and Automotive), By Region - Industry Forecast 2024-2031


Report ID: SQMIG15H2036 | Region: Global | Published Date: March, 2024
Pages: 184 |Tables: 61 |Figures: 72

Advanced Packaging Market Insights

Global Advanced Packaging Market size was valued at USD 30.60 billion in 2022 and is poised to grow from USD 33 billion in 2023 to USD 60.36 billion by 2031, growing at a CAGR of 7.84% during the forecast period (2024-2031).

Advanced packaging serves as a protective enclosure that safeguards silicon wafers, logic units, and memory from physical damage and corrosion during the final stage of semiconductor manufacturing. This packaging technique facilitates the connection of the chip to a circuit board. It encompasses various innovative methods like 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package.

The advanced packaging market has witnessed rapid growth, particularly in fan-out wafer level packaging, driven by the increasing demand for smartphones, IoT devices, and high-end products. As a result, suppliers in this industry are actively developing cost-effective processes to enhance operational efficiency.

While currently mainly utilized for high-end products and niche-market applications due to its higher operational costs, advanced packaging offers immense potential in accommodating the diverse packaging requirements of different integrated circuits (ICs). This diversity in packaging needs presents growth opportunities for advanced packaging, superseding traditional packaging methods.

Moreover, advanced packaging is expected to outperform conventional packaging solutions by offering enhanced capabilities, creating lucrative opportunities for market trends and further advancement in the field in the coming years.

US Advanced Packaging Market is poised to grow at a sustainable CAGR for the next forecast year.

Market Snapshot - 2024-2031

Global Market Size

USD 30.60 billion

Largest Segment

Consumer Electronics

Fastest Growth

Consumer Electronics

Growth Rate

7.84% CAGR

Global Advanced Packaging Market ($ Bn)
Country Share for Asia Pacific Region (%)

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Advanced Packaging Market Segmental Analysis

The Global Advanced Packaging Market is segmented on the basis of Type, End - Use, and Region. By Type the market is segmented into Flip Chip CSP, Flip-Chip Ball Grid Array. By End – User, the market is segmented into Consumer Electronics, Automotive. By Region, the market is segmented into North America, Europe, Latin America, Asia- Pacific, Middle East and Africa.

Advanced Packaging Market Analysis By Type

The market is categorized into various types, including flip-chip CSP, flip-chip ball grid array, wafer-level CSP, 2.5D/3D, fan-out WLP, and others. Among these, flip-chip ball grid array stands as the dominant type in the programmable logic controller market and is expected to grow at a significant CAGR.

The flip-chip ball grid array type employs the controlled collapse chip connection method for die-to-substrate connection, offering a cost-effective and high-performance semiconductor packaging solution. This type enables the design freedom to incorporate substantially better signal density and functionality into a smaller die and packaging footprint. Although flip-chip BGA is relatively more expensive, it provides superior performance, making it a preferred choice in applications like ASICs, DSPs, and other high-performance electronic devices. With its excellent signal density and performance capabilities, flip-chip BGA is expected to maintain its leading position in the programmable logic controller market and contribute significantly to its growth in the forecast period.

Advanced Packaging Market Analysis By End - Use

The market is divided into various end-use segments, including consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others. Among these, consumer electronics hold the largest market share, and this segment is projected to grow at a significant growth rate.

The widespread use of smartphones, televisions, DVD players, and other consumer gadgets for both commercial and personal purposes has contributed to the significant growth of the consumer electronics market. Moreover, the increasing adoption of smart devices across various industry verticals and the advent of the Internet of Things (IoT) have further accelerated the growth of this market at a rapid pace.

Embedded processors, which are microprocessors utilized in various electronic devices like digital watches, digital cameras, MP3 players, and home appliances, play a crucial role in processing data at high speed. These processors ensure the efficient performance of system operations, facilitating continuous and repetitive tasks with enhanced precision and effectiveness.

As consumer electronics continue to play a central role in modern lifestyles and businesses, the demand for embedded processors is expected to remain robust, driving the growth of the consumer electronics segment in the programmable logic controller market in the forecast period.

Global Advanced Packaging Market By End - User, 2022 (%)

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Advanced Packaging Market Regional Insights

Asia-Pacific emerges as the world's most rapidly growing region in the advanced packaging market. This remarkable growth is attributed to the availability of cutting-edge technologies, surging demand for smart devices, and the continuous expansion of manufacturing industries in the region. Contributing to the evolution of packaging technology are various non-profit organizations that actively invest in developing enhanced power infrastructure, further propelling the expansion of the advanced packaging market in Asia-Pacific.

On the other hand, the North American region holds the second-largest share in the Global Advanced Packaging Market, projected to achieve a CAGR of 10% and generate revenue of USD 10,625 million by 2030. The United States, Canada, and Mexico collectively form North America, where the increase in disposable income among the population has spurred the demand for advanced packaging solutions. The diverse sectors in the region, including intelligent and smart equipment, have amplified the adoption of innovative packaging techniques. Furthermore, the energy and power industry's integration of improved technology has positively impacted market growth. Additionally, the growing utilization of microcontrollers and microprocessors in consumer electronics and electric vehicles is expected to drive the demand for sophisticated packaging solutions during the forecast period in the North American market.

Global Advanced Packaging Market By Geography, 2024-2031
  • Largest
  • Fastest

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Advanced Packaging Market Dynamics

Advanced Packaging Market Drivers

Miniaturization and Integration of Electronic Components

  • With the continuous trend of miniaturization in electronics, advanced packaging techniques are essential to integrate multiple components into a single package, improving overall performance and functionality.

Advancements in Semiconductor Technology

  • Rapid advancements in semiconductor technology, such as 5G, IoT, artificial intelligence (AI), and automotive electronics, are fueling the need for sophisticated packaging solutions to meet the performance and reliability requirements of these applications.

Advanced Packaging Market Restraints

Intellectual Property and Standards Issues

  • Intellectual property concerns and the lack of standardized advanced packaging solutions can create uncertainties and slow down market growth as companies may be hesitant to invest in proprietary technologies.

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Advanced Packaging Market Competitive Landscape

The Global Advanced Packaging Market is characterized by intense competition and a dynamic landscape with several key players vying for market dominance. Companies operating in this market continuously strive to develop innovative packaging solutions and stay ahead in the race to meet evolving customer demands.

Major players in the Global Advanced Packaging Market include prominent semiconductor packaging companies such as Intel Corporation, Advanced Micro Devices (AMD), Taiwan Semiconductor Manufacturing Company (TSMC), and Samsung Electronics. These giants are known for their extensive research and development efforts to introduce cutting-edge technologies and advanced packaging techniques, driving market growth.

Additionally, there are several other players like ASE Group, Amkor Technology, JCET Group, and Powertech Technology, which play a significant role in the market's competitive landscape. These companies specialize in offering diverse packaging solutions tailored to the specific needs of various industries and applications.

Furthermore, partnerships, collaborations, and mergers & acquisitions are common strategies adopted by market players to expand their product portfolios, global presence, and customer base. The focus on strategic alliances enables companies to leverage each other's strengths and enhance their competitiveness in the Global Advanced Packaging Market.

As the demand for miniaturization, enhanced performance, and power efficiency rises, competition among companies to deliver efficient and cost-effective advanced packaging solutions is expected to intensify. Market players are likely to focus on technological advancements, product differentiation, and customer-centric approaches to maintain their competitive edge in this rapidly evolving and highly competitive market.

Advanced Packaging Market Top Player’s Company Profile

  • Intel Corporation (United States)

  • Advanced Micro Devices (AMD) (United States)

  • Taiwan Semiconductor Manufacturing Company (TSMC) (Taiwan)

  • Samsung Electronics (South Korea)

  • ASE Group (Taiwan)

  • Amkor Technology (United States)

  • JCET Group (China)

  • Powertech Technology (Taiwan)

  • Siliconware Precision Industries Co., Ltd. (SPIL) (Taiwan)

  • ChipMOS Technologies Inc. (Taiwan)

  • UTAC Holdings Ltd. (Singapore)

  • Tokyo Electron Limited (Japan)

  • SCHOTT AG (Germany)

  • Palomar Technologies (United States)

  • Rudolph Technologies (United States)

  • BESI Group (Netherlands)

  • STATS ChipPAC Ltd. (Singapore)

Advanced Packaging Market Recent Developments

  • June 2023: Intel announced that it is using its own EMIB packaging technology for its new Xeon Scalable processors. EMIB is a 2.5D packaging technology that can integrate multiple dies on a single substrate.

  • May 2023: AMD announced that it is using TSMC's InFO-X packaging technology for its new Ryzen 7000 series processors. The Ryzen 7000 series processors are the first mainstream processors to use 3D packaging technology.

  • April 2023: Samsung Electronics announced that it has developed a new packaging technology called Fan-Out Wafer Level Packaging (FOWLP). FOWLP is a high-density packaging technology that can be used to pack more dies on a single substrate.

  • March 2023: TSMC announced that it has begun mass production of its InFO-X packaging technology. InFO-X is a 3D packaging technology that can integrate multiple dies on a single substrate.

  • February 2023: Intel announced that it is investing $1 billion in a new advanced packaging research and development facility in Israel. The facility will focus on developing new technologies for 3D packaging, chiplets, and heterogeneous integration.

Advanced Packaging Key Market Trends

  • Fan-Out Wafer-Level Packaging (FOWLP) Adoption: Fan-Out Wafer-Level Packaging has gained significant traction due to its ability to enable thinner and more cost-effective packages, making it a popular choice for mobile devices and high-performance applications.
  • System-in-Package (SiP) Integration: System-in-Package integration is becoming increasingly popular as it allows multiple chips, diverse technologies, and passive components to be integrated into a single package, improving system performance and reducing form factor.

Advanced Packaging Market SkyQuest Analysis

SkyQuest’s ABIRAW (Advanced Business Intelligence, Research & Analysis Wing) is our Business Information Product types team that Collects, Collates, Correlates, and Analyzes the Data collected by means of Primary Exploratory Research backed by robust Secondary Desk research.

According to our advanced packaging market Analysis, the increasing demand for smart devices, advancements in semiconductor technology, and the trend of miniaturization and integration of electronic components. The adoption of advanced packaging solutions is essential to meet the performance and efficiency requirements of emerging technologies like 5G, IoT, AI, and automotive electronics.

However, challenges related to the high cost of advanced packaging, integration complexities, and intellectual property concerns may pose restraints to market growth. Nonetheless, ongoing trends such as the adoption of Fan-Out Wafer-Level Packaging (FOWLP), System-in-Package (SiP) integration, and heterogeneous integration are propelling market advancements.

With a focus on sustainable and green packaging solutions, the industry is also addressing environmental concerns. As companies strive to develop innovative packaging techniques and forge strategic partnerships, the Global Advanced Packaging Market is poised for continued expansion, catering to the demands of modern electronic applications across various industries.

Report Metric Details
Market size value in 2022 USD 30.60 billion
Market size value in 2031 USD 60.36 billion
Growth Rate 7.84%
Base year 2023
Forecast period 2024-2031
Forecast Unit (Value) USD Billion
Segments covered
  • Type
    • Flip Chip CSP, and Flip-Chip Ball Grid Array
  • End-Use
    • Consumer Electronics, and Automotive
Regions covered North America (US, Canada), Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe), Asia Pacific (China, India, Japan, Rest of Asia-Pacific), Latin America (Brazil, Rest of Latin America), Middle East & Africa (South Africa, GCC Countries, Rest of MEA)
Companies covered
  • Intel Corporation (United States)

  • Advanced Micro Devices (AMD) (United States)

  • Taiwan Semiconductor Manufacturing Company (TSMC) (Taiwan)

  • Samsung Electronics (South Korea)

  • ASE Group (Taiwan)

  • Amkor Technology (United States)

  • JCET Group (China)

  • Powertech Technology (Taiwan)

  • Siliconware Precision Industries Co., Ltd. (SPIL) (Taiwan)

  • ChipMOS Technologies Inc. (Taiwan)

  • UTAC Holdings Ltd. (Singapore)

  • Tokyo Electron Limited (Japan)

  • SCHOTT AG (Germany)

  • Palomar Technologies (United States)

  • Rudolph Technologies (United States)

  • BESI Group (Netherlands)

  • STATS ChipPAC Ltd. (Singapore)

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Table Of Content

Executive Summary

Market overview

  • Exhibit: Executive Summary – Chart on Market Overview
  • Exhibit: Executive Summary – Data Table on Market Overview
  • Exhibit: Executive Summary – Chart on Advanced Packaging Market Characteristics
  • Exhibit: Executive Summary – Chart on Market by Geography
  • Exhibit: Executive Summary – Chart on Market Segmentation
  • Exhibit: Executive Summary – Chart on Incremental Growth
  • Exhibit: Executive Summary – Data Table on Incremental Growth
  • Exhibit: Executive Summary – Chart on Vendor Market Positioning

Parent Market Analysis

Market overview

Market size

  • Market Dynamics
    • Exhibit: Impact analysis of DROC, 2021
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
  • SWOT Analysis

KEY MARKET INSIGHTS

  • Technology Analysis
    • (Exhibit: Data Table: Name of technology and details)
  • Pricing Analysis
    • (Exhibit: Data Table: Name of technology and pricing details)
  • Supply Chain Analysis
    • (Exhibit: Detailed Supply Chain Presentation)
  • Value Chain Analysis
    • (Exhibit: Detailed Value Chain Presentation)
  • Ecosystem Of the Market
    • Exhibit: Parent Market Ecosystem Market Analysis
    • Exhibit: Market Characteristics of Parent Market
  • IP Analysis
    • (Exhibit: Data Table: Name of product/technology, patents filed, inventor/company name, acquiring firm)
  • Trade Analysis
    • (Exhibit: Data Table: Import and Export data details)
  • Startup Analysis
    • (Exhibit: Data Table: Emerging startups details)
  • Raw Material Analysis
    • (Exhibit: Data Table: Mapping of key raw materials)
  • Innovation Matrix
    • (Exhibit: Positioning Matrix: Mapping of new and existing technologies)
  • Pipeline product Analysis
    • (Exhibit: Data Table: Name of companies and pipeline products, regional mapping)
  • Macroeconomic Indicators

COVID IMPACT

  • Introduction
  • Impact On Economy—scenario Assessment
    • Exhibit: Data on GDP - Year-over-year growth 2016-2022 (%)
  • Revised Market Size
    • Exhibit: Data Table on Advanced Packaging Market size and forecast 2021-2027 ($ million)
  • Impact Of COVID On Key Segments
    • Exhibit: Data Table on Segment Market size and forecast 2021-2027 ($ million)
  • COVID Strategies By Company
    • Exhibit: Analysis on key strategies adopted by companies

MARKET DYNAMICS & OUTLOOK

  • Market Dynamics
    • Exhibit: Impact analysis of DROC, 2021
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
  • Regulatory Landscape
    • Exhibit: Data Table on regulation from different region
  • SWOT Analysis
  • Porters Analysis
    • Competitive rivalry
      • Exhibit: Competitive rivalry Impact of key factors, 2021
    • Threat of substitute products
      • Exhibit: Threat of Substitute Products Impact of key factors, 2021
    • Bargaining power of buyers
      • Exhibit: buyers bargaining power Impact of key factors, 2021
    • Threat of new entrants
      • Exhibit: Threat of new entrants Impact of key factors, 2021
    • Bargaining power of suppliers
      • Exhibit: Threat of suppliers bargaining power Impact of key factors, 2021
  • Skyquest special insights on future disruptions
    • Political Impact
    • Economic impact
    • Social Impact
    • Technical Impact
    • Environmental Impact
    • Legal Impact

Market Size by Region

  • Chart on Market share by geography 2021-2027 (%)
  • Data Table on Market share by geography 2021-2027(%)
  • North America
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • USA
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Canada
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Europe
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • Germany
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Spain
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • France
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • UK
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of Europe
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Asia Pacific
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • China
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • India
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Japan
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • South Korea
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of Asia Pacific
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Latin America
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • Brazil
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of South America
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Middle East & Africa (MEA)
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • GCC Countries
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • South Africa
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of MEA
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)

KEY COMPANY PROFILES

  • Competitive Landscape
    • Total number of companies covered
      • Exhibit: companies covered in the report, 2021
    • Top companies market positioning
      • Exhibit: company positioning matrix, 2021
    • Top companies market Share
      • Exhibit: Pie chart analysis on company market share, 2021(%)

Methodology

For the Advanced Packaging Market, our research methodology involved a mixture of primary and secondary data sources. Key steps involved in the research process are listed below:

1. Information Procurement: This stage involved the procurement of Market data or related information via primary and secondary sources. The various secondary sources used included various company websites, annual reports, trade databases, and paid databases such as Hoover's, Bloomberg Business, Factiva, and Avention. Our team did 45 primary interactions Globally which included several stakeholders such as manufacturers, customers, key opinion leaders, etc. Overall, information procurement was one of the most extensive stages in our research process.

2. Information Analysis: This step involved triangulation of data through bottom-up and top-down approaches to estimate and validate the total size and future estimate of the Advanced Packaging Market.

3. Report Formulation: The final step entailed the placement of data points in appropriate Market spaces in an attempt to deduce viable conclusions.

4. Validation & Publishing: Validation is the most important step in the process. Validation & re-validation via an intricately designed process helped us finalize data points to be used for final calculations. The final Market estimates and forecasts were then aligned and sent to our panel of industry experts for validation of data. Once the validation was done the report was sent to our Quality Assurance team to ensure adherence to style guides, consistency & design.

Analyst Support

Customization Options

With the given market data, our dedicated team of analysts can offer you the following customization options are available for the Advanced Packaging Market:

Product Analysis: Product matrix, which offers a detailed comparison of the product portfolio of companies.

Regional Analysis: Further analysis of the Advanced Packaging Market for additional countries.

Competitive Analysis: Detailed analysis and profiling of additional Market players & comparative analysis of competitive products.

Go to Market Strategy: Find the high-growth channels to invest your marketing efforts and increase your customer base.

Innovation Mapping: Identify racial solutions and innovation, connected to deep ecosystems of innovators, start-ups, academics, and strategic partners.

Category Intelligence: Customized intelligence that is relevant to their supply Markets will enable them to make smarter sourcing decisions and improve their category management.

Public Company Transcript Analysis: To improve the investment performance by generating new alpha and making better-informed decisions.

Social Media Listening: To analyze the conversations and trends happening not just around your brand, but around your industry as a whole, and use those insights to make better Marketing decisions.

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FAQs

Advanced Packaging Market size was valued at USD 30.60 billion in 2022 and is poised to grow from USD 33 billion in 2023 to USD 60.36 billion by 2031, growing at a CAGR of 7.84% during the forecast period (2024-2031).

The Advanced Packaging Market is characterized by intense competition and a dynamic landscape with several key players vying for market dominance. Companies operating in this market continuously strive to develop innovative packaging solutions and stay ahead in the race to meet evolving customer demands. ' Intel Corporation (United States) ', ' Advanced Micro Devices (AMD) (United States) ', ' Taiwan Semiconductor Manufacturing Company (TSMC) (Taiwan) ', ' Samsung Electronics (South Korea) ', ' ASE Group (Taiwan) ', ' Amkor Technology (United States) ', ' JCET Group (China) ', ' Powertech Technology (Taiwan) ', ' Siliconware Precision Industries Co., Ltd. (SPIL) (Taiwan) ', ' ChipMOS Technologies Inc. (Taiwan) ', ' UTAC Holdings Ltd. (Singapore) ', ' Tokyo Electron Limited (Japan) ', ' SCHOTT AG (Germany) ', ' Palomar Technologies (United States) ', ' Rudolph Technologies (United States) ', ' BESI Group (Netherlands) ', ' STATS ChipPAC Ltd. (Singapore) '

With the continuous trend of miniaturization in electronics, advanced packaging techniques are essential to integrate multiple components into a single package, improving overall performance and functionality.

Fan-Out Wafer-Level Packaging (FOWLP) Adoption: Fan-Out Wafer-Level Packaging has gained significant traction due to its ability to enable thinner and more cost-effective packages, making it a popular choice for mobile devices and high-performance applications.

Asia-Pacific emerges as the world's most rapidly growing region in the advanced packaging market. This remarkable growth is attributed to the availability of cutting-edge technologies, surging demand for smart devices, and the continuous expansion of manufacturing industries in the region. Contributing to the evolution of packaging technology are various non-profit organizations that actively invest in developing enhanced power infrastructure, further propelling the expansion of the advanced packaging market in Asia-Pacific.

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