Global IC Packaging Market

Global IC Packaging Market Size, Share, Growth Analysis, By Type(DIP, SOP), By Bonding Techniques(Wire Bonding, Flip Chips), By Application(Memory IC, Logic IC) - Industry Forecast 2023-2030


Report ID: SQSG45N2002 | Region: Global | Published Date: November, 2022 | Pages: 221 | Tables: 100 | Figures: 76

Global IC Packaging Market Insights

IC Packaging Market size was valued at USD 37.76 billion in 2021 and is poised to grow from USD 40.94 billion in 2022 to USD 77.89 billion by 2030, growing at a CAGR of 8.37% in the forecast period (2023-2030).

The IC packaging protects IC chips from the environment and ensures a secure electrical connection for chip mounting on printed circuit boards. The rapid advancement of electronics technology, such as AI and cloud computing, is complemented by a high demand for high-speed, high-integration, and low-power ICs. During the last stages of the semiconductor manufacturing process, it is a supporting case that protects silicon wafers, logic units, and memory from physical damage and corrosion. It makes it possible to connect the chip to a circuit board. Various ICs have different packaging needs, resulting in IC Packaging market growth prospects.

US IC Packaging Market is poised to grow at a sustainable CAGR for the next forecast year.

Market snapshot - 2023-2030

Global Market Size

USD 37.76 billion

Largest Segment

Wire Bonding

Fastest Growth

Flip Chips

Growth Rate

8.37% CAGR

Global IC Packaging Market, 2021-2028 ($ Bn)
Country Share for North America Region- 2021 (%)
Global IC Packaging Market Size By Bonding Techniques , 2021-2028 ($ Bn)
Global IC Packaging Market Size By Bonding Techniques , 2021-2028 (%)

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Global IC Packaging Market Segmental Analysis

Global IC Packaging Market is segmented based on the Type, Bonding Techniques, Application and region. Based on the Type, the IC Packaging Market is segmented as DIP, SOP, QFP, QFN, BGA, CSP, LGA, WLP, FC, and Others. Based On Bonding Techniques, the IC Packaging Market is segmented as Wire Bonding, Flip Chips, Wafer Level Packaging and Others. Based On Application, the IC Packaging Market is segmented as Memory IC, Logic IC, Discrete, SIP, and Other. Based on Region, IC Packaging Market is categorized into North America, Europe, Asia-Pacific, Latin America, and MEA.

IC Packaging Market Analysis by Type

The global IC packaging market is segmented based on the package type as DIP (Double In-line Package), SOP (Small Outline Package), QFP (Quad Flat Package), QFN (Quad Flat Non-leaded Package), BGA (Ball Grid Array Package), CSP (Chip Scale Package), LGA (Land Grid Array), WLP (Wafer Level Packaging), FC (Flip Chip), and Others. The others segment of the market includes PGA, SOJ, and many. Among these types, the DIP segment of the market is projected to hold the most substantial share in the market and grow at a CAGR of 9.7% during the forecast period. The DIP package type is the traditional way of a package of ICs and is more cost-effective than others. However, the size is bigger when compared to other package types. Whereas, the WLP, BGA, and FC are among some of the fastest-growing package types in the market. As the industry players are shifting towards the miniaturization of devices, smaller internal parts such as small-sized ICs are required.

IC Packaging Market Analysis By Bonding Technique

The global IC packaging market is segmented based on the bonding technique as Wire Bonding, Flip Chips, Wafer Level Packaging, and Others. The other segment of the market includes Tape Automated Bonding (TAB). Among these types, the wire bonding segment of the market is projected to hold the most substantial share in the market. Wire bonding includes gold wire bonding, copper wire bonding, and aluminum wire bonding. The wire bonding technique is the traditional and most common way of bonding ICs and is more cost-effective than others. However, the advent of other advanced bonding techniques is projected to limit the segment’s growth. Whereas, the water level packaging bonding technique is projected to grow fastest in the market. wafer-level packaging bonding technique is projected to grow at the fastest CAGR of 10.1% during the forecast period. The industry manufacturers are shifting toward advanced bonding techniques that include wafer-level packaging and flip-chip bonding techniques, as it possesses various advantages over the traditional bonding techniques. Hence, this drives the segmental market growth.

Global IC Packaging Market By Bonding Techniques , 2021(%), 2021 (%)

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Global IC Packaging Market Regional Insights

The global IC packaging market is segmented based on the geography of North America, Europe, and Asia-Pacific. Among these regions, the Asia-Pacific region is projected to hold the most dominating share of more than 90% in the market. The major aspect that drives the regional growth of the market includes the presence of major IC packaging and assembly companies in the region. The Asia-Pacific region is considered the major hub for IC assembly and packaging across the globe. Countries such as Taiwan, China, Japan, and South Korea are among the key contributors to the regional growth of the market.

Global IC Packaging Market By Geography, 2021 - 2028, 2023-2030
  • Largest
  • Fastest

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Global IC Packaging Market Dynamics

IC Packaging Market Driver

  • Rising government support is anticipated to drive the semiconductor and IC packaging market. For instance, Creating Helpful Incentives to Produce Semiconductors for America Act or the CHIPS for America Act establishes investments and incentives to support U.S. semiconductor manufacturing, research and development, and supply chain security.
  • The growing demand for AI-based applications across various industries (such as healthcare, telecommunications, energy, finance, transportation, agriculture, manufacturing, aerospace, and defense) will open up new prospects for semiconductor manufacturers and suppliers. AI will also improve semiconductor manufacturing by speeding up the process, enhancing chip performance, lowering production costs, and increasing output. Hence, propelling the growth of IC packaging and the semiconductor industry.
  • Semiconductors will play a critical role in the development and advancement of automotive technologies utilized in connected automobiles and electrified vehicles. The rapidly changing automotive sector will offer tremendous opportunities for automotive semiconductors to support increased connectivity, battery performance in EVs, enhanced sensors, and other technologies.

IC Packaging Market Restraint

  • The industry is not dispersed equally and is controlled by a few nations, primarily the United States, Taiwan, South Korea, Japan, China, and Europe. No one region has a hold on the entire production stack. Asian nations produce 57% of semiconductor materials, 56% of wafer fabrications, and 70% of memory. The United States is a world leader in electronic design automation (EDA), logic, equipment, discrete and analogue. Because of this interconnection, no single country can sustain global leadership throughout the whole value chain.

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Global IC Packaging Market Competitive Landscape

The Global IC Packaging market is relatively fragmented, with a high level of competition. The prominent players operating in the market are constantly adopting various growth strategies to stay afloat in the market. Product launches, innovations, mergers, and acquisitions, collaborations and partnerships, and intensive R&D are some of the growth strategies that are adopted by these key players to thrive in the competitive market. The key market players are also constantly focused on R&D to supply industries with the most efficient and cost-effective solutions.

IC Packaging Market Top Player's Company Profiles

  • Amkor Technology
  • ASE Group
  • STATS ChipPAC
  • Siliconware Precision Industries Co. Ltd.
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Powertech Technology Inc.
  • UTAC Holdings Ltd.
  • Chipbond Technology Corporation
  • King Yuan Electronics Co., Ltd.
  • TongFu Microelectronics Co., Ltd.
  • Nepes Corporation
  • Advanced Semiconductor Engineering Inc.
  • Shinko Electric Industries Co. Ltd.
  • Kyocera Corporation
  • Samsung Electro-Mechanics Co. Ltd.
  • Fujitsu Limited
  • JCET Group Co., Ltd.
  • Texas Instruments Incorporated
  • Infineon Technologies AG
  • NXP Semiconductors N.V.

IC Packaging Market Recent Developments

  • In June 2022, Advanced Semiconductor Engineering, Inc. (ASE), introduced VI Pack™, an advanced packaging platform designed to enable vertically integrated package solutions. VI Pack™ represents ASE’s next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance.
  • In June 2022, Tera View is announced the release of the EOTPR 4500, a purpose-built integrated circuit package inspection machine. The auto prober technology of the EOTPR 4500 was created to tackle the demands of the most modern IC packaging technology by accepting substrate sizes up to 150mmx150mm while maintaining probe tip placement precision of +/- 0.5m.

Global IC Packaging Key Market Trends

  • This strong demand for ICs for various applications across the globe has led to the shortage of ICs. The global IC packaging industry may face challenges in the future. Apart from these, natural calamities such as drought in Taiwan also led to a crisis in the IC industry in the country. Hence, these are some of the factors that challenge the growth of the market.
  • The growth of the IC packaging market is significantly influenced by the growth of the semiconductor market, as packaging is an early stage in the electronics value chain. Foundries can either do their packaging in-house or outsource it. For an instance, Qualcomm, a semiconductor and telecommunications equipment manufacturer, conducts its packaging operations through the OSATs.

Global IC Packaging Market SkyQuest Analysis

SkyQuest’s ABIRAW (Advanced Business Intelligence, Research & Analysis Wing) is our Business Information Services team that Collects, Collates, Co-relates, and Analyses the Data collected utilizing Primary Exploratory Research backed by the robust Secondary Desk research.

According to our Global IC Packaging Market Analysis, among these types, the DIP segment of the market is projected to hold the most substantial share in the market and grow at a CAGR of 9.7% during the forecast period. the wire bonding segment of the market is projected to hold the most substantial share the market. Wire bonding includes gold wire bonding, copper wire bonding, and aluminum wire bonding. The wire bonding technique is the traditional and most common way of bonding ICs and is more cost-effective than others. the Asia-Pacific region is projected to hold the most dominating share of more than 90% in the market. The major aspect that drives the regional growth of the market includes the presence of major IC packaging and assembly companies in the region.

Report Metric Details
Market size value in 2021 USD 37.76 billion
Market size value in 2030 USD 77.89 billion
Growth Rate 8.37%
Base year 2021
Forecast period 2023-2030
Forecast Unit (Value) USD Billion
Segments covered
  • Type
    • DIP, SOP, QFP, QFN, BGA, CSP, LGA, WLP, FC, Others
  • Bonding Techniques
    • Wire Bonding, Flip Chips, Wafer Level Packaging, Others
  • Application
    • Memory IC, Logic IC, Discrete, SIP, Other
Regions covered North America (US, Canada), Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe), Asia Pacific (China, India, Japan, Rest of Asia-Pacific), Latin America (Brazil, Rest of Latin America), Middle East & Africa (South Africa, GCC Countries, Rest of MEA)
Companies covered
  • Amkor Technology
  • ASE Group
  • STATS ChipPAC
  • Siliconware Precision Industries Co. Ltd.
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Powertech Technology Inc.
  • UTAC Holdings Ltd.
  • Chipbond Technology Corporation
  • King Yuan Electronics Co., Ltd.
  • TongFu Microelectronics Co., Ltd.
  • Nepes Corporation
  • Advanced Semiconductor Engineering Inc.
  • Shinko Electric Industries Co. Ltd.
  • Kyocera Corporation
  • Samsung Electro-Mechanics Co. Ltd.
  • Fujitsu Limited
  • JCET Group Co., Ltd.
  • Texas Instruments Incorporated
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
Customization scope

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Table Of Content

Executive Summary

Market overview

  • Exhibit: Executive Summary – Chart on Market Overview
  • Exhibit: Executive Summary – Data Table on Market Overview
  • Exhibit: Executive Summary – Chart on Global IC Packaging Market Characteristics
  • Exhibit: Executive Summary – Chart on Market by Geography
  • Exhibit: Executive Summary – Chart on Market Segmentation
  • Exhibit: Executive Summary – Chart on Incremental Growth
  • Exhibit: Executive Summary – Data Table on Incremental Growth
  • Exhibit: Executive Summary – Chart on Vendor Market Positioning

Parent Market Analysis

Market overview

Market size

  • Market Dynamics
    • Exhibit: Impact analysis of DROC, 2021
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
  • SWOT Analysis

KEY MARKET INSIGHTS

  • Technology Analysis
    • (Exhibit: Data Table: Name of technology and details)
  • Pricing Analysis
    • (Exhibit: Data Table: Name of technology and pricing details)
  • Supply Chain Analysis
    • (Exhibit: Detailed Supply Chain Presentation)
  • Value Chain Analysis
    • (Exhibit: Detailed Value Chain Presentation)
  • Ecosystem Of the Market
    • Exhibit: Parent Market Ecosystem Market Analysis
    • Exhibit: Market Characteristics of Parent Market
  • IP Analysis
    • (Exhibit: Data Table: Name of product/technology, patents filed, inventor/company name, acquiring firm)
  • Trade Analysis
    • (Exhibit: Data Table: Import and Export data details)
  • Startup Analysis
    • (Exhibit: Data Table: Emerging startups details)
  • Raw Material Analysis
    • (Exhibit: Data Table: Mapping of key raw materials)
  • Innovation Matrix
    • (Exhibit: Positioning Matrix: Mapping of new and existing technologies)
  • Pipeline product Analysis
    • (Exhibit: Data Table: Name of companies and pipeline products, regional mapping)
  • Macroeconomic Indicators

COVID IMPACT

  • Introduction
  • Impact On Economy—scenario Assessment
    • Exhibit: Data on GDP - Year-over-year growth 2016-2022 (%)
  • Revised Market Size
    • Exhibit: Data Table on Global IC Packaging Market size and forecast 2021-2027 ($ million)
  • Impact Of COVID On Key Segments
    • Exhibit: Data Table on Segment Market size and forecast 2021-2027 ($ million)
  • COVID Strategies By Company
    • Exhibit: Analysis on key strategies adopted by companies

MARKET DYNAMICS & OUTLOOK

  • Market Dynamics
    • Exhibit: Impact analysis of DROC, 2021
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
  • Regulatory Landscape
    • Exhibit: Data Table on regulation from different region
  • SWOT Analysis
  • Porters Analysis
    • Competitive rivalry
      • Exhibit: Competitive rivalry Impact of key factors, 2021
    • Threat of substitute products
      • Exhibit: Threat of Substitute Products Impact of key factors, 2021
    • Bargaining power of buyers
      • Exhibit: buyers bargaining power Impact of key factors, 2021
    • Threat of new entrants
      • Exhibit: Threat of new entrants Impact of key factors, 2021
    • Bargaining power of suppliers
      • Exhibit: Threat of suppliers bargaining power Impact of key factors, 2021
  • Skyquest special insights on future disruptions
    • Political Impact
    • Economic impact
    • Social Impact
    • Technical Impact
    • Environmental Impact
    • Legal Impact

Market Size by Region

  • Chart on Market share by geography 2021-2027 (%)
  • Data Table on Market share by geography 2021-2027(%)
  • North America
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • USA
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Canada
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Europe
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • Germany
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Spain
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • France
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • UK
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of Europe
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Asia Pacific
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • China
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • India
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Japan
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • South Korea
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of Asia Pacific
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Latin America
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • Brazil
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of South America
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Middle East & Africa (MEA)
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • GCC Countries
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • South Africa
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of MEA
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)

KEY COMPANY PROFILES

  • Competitive Landscape
    • Total number of companies covered
      • Exhibit: companies covered in the report, 2021
    • Top companies market positioning
      • Exhibit: company positioning matrix, 2021
    • Top companies market Share
      • Exhibit: Pie chart analysis on company market share, 2021(%)

Methodology

For the Global IC Packaging Market, our research methodology involved a mixture of primary and secondary data sources. Key steps involved in the research process are listed below:

1. Information Procurement: This stage involved the procurement of Market data or related information via primary and secondary sources. The various secondary sources used included various company websites, annual reports, trade databases, and paid databases such as Hoover's, Bloomberg Business, Factiva, and Avention. Our team did 45 primary interactions Globally which included several stakeholders such as manufacturers, customers, key opinion leaders, etc. Overall, information procurement was one of the most extensive stages in our research process.

2. Information Analysis: This step involved triangulation of data through bottom-up and top-down approaches to estimate and validate the total size and future estimate of the Global IC Packaging Market.

3. Report Formulation: The final step entailed the placement of data points in appropriate Market spaces in an attempt to deduce viable conclusions.

4. Validation & Publishing: Validation is the most important step in the process. Validation & re-validation via an intricately designed process helped us finalize data points to be used for final calculations. The final Market estimates and forecasts were then aligned and sent to our panel of industry experts for validation of data. Once the validation was done the report was sent to our Quality Assurance team to ensure adherence to style guides, consistency & design.

Analyst Support

Customization Options

With the given market data, our dedicated team of analysts can offer you the following customization options are available for the Global IC Packaging Market:

Product Analysis: Product matrix, which offers a detailed comparison of the product portfolio of companies.

Regional Analysis: Further analysis of the Global IC Packaging Market for additional countries.

Competitive Analysis: Detailed analysis and profiling of additional Market players & comparative analysis of competitive products.

Go to Market Strategy: Find the high-growth channels to invest your marketing efforts and increase your customer base.

Innovation Mapping: Identify racial solutions and innovation, connected to deep ecosystems of innovators, start-ups, academics, and strategic partners.

Category Intelligence: Customized intelligence that is relevant to their supply Markets will enable them to make smarter sourcing decisions and improve their category management.

Public Company Transcript Analysis: To improve the investment performance by generating new alpha and making better-informed decisions.

Social Media Listening: To analyze the conversations and trends happening not just around your brand, but around your industry as a whole, and use those insights to make better Marketing decisions.

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FAQ's

IC Packaging Market size was valued at USD 37.76 billion in 2021 and is poised to grow from USD 40.94 billion in 2022 to USD 77.89 billion by 2030, growing at a CAGR of 8.37% in the forecast period (2023-2030).

The Global IC Packaging market is relatively fragmented, with a high level of competition. The prominent players operating in the market are constantly adopting various growth strategies to stay afloat in the market. Product launches, innovations, mergers, and acquisitions, collaborations and partnerships, and intensive R&D are some of the growth strategies that are adopted by these key players to thrive in the competitive market. The key market players are also constantly focused on R&D to supply industries with the most efficient and cost-effective solutions. 'Amkor Technology', 'ASE Group', 'STATS ChipPAC', 'Siliconware Precision Industries Co. Ltd.', 'Jiangsu Changjiang Electronics Technology Co. Ltd.', 'Powertech Technology Inc.', 'UTAC Holdings Ltd.', 'Chipbond Technology Corporation', 'King Yuan Electronics Co., Ltd.', 'TongFu Microelectronics Co., Ltd.', 'Nepes Corporation', 'Advanced Semiconductor Engineering Inc.', 'Shinko Electric Industries Co. Ltd.', 'Kyocera Corporation', 'Samsung Electro-Mechanics Co. Ltd.', 'Fujitsu Limited', 'JCET Group Co., Ltd.', 'Texas Instruments Incorporated', 'Infineon Technologies AG', 'NXP Semiconductors N.V.'

Rising government support is anticipated to drive the semiconductor and IC packaging market. For instance, Creating Helpful Incentives to Produce Semiconductors for America Act or the CHIPS for America Act establishes investments and incentives to support U.S. semiconductor manufacturing, research and development, and supply chain security.

This strong demand for ICs for various applications across the globe has led to the shortage of ICs. The global IC packaging industry may face challenges in the future. Apart from these, natural calamities such as drought in Taiwan also led to a crisis in the IC industry in the country. Hence, these are some of the factors that challenge the growth of the market.

The global IC packaging market is segmented based on the geography of North America, Europe, and Asia-Pacific. Among these regions, the Asia-Pacific region is projected to hold the most dominating share of more than 90% in the market. The major aspect that drives the regional growth of the market includes the presence of major IC packaging and assembly companies in the region. The Asia-Pacific region is considered the major hub for IC assembly and packaging across the globe. Countries such as Taiwan, China, Japan, and South Korea are among the key contributors to the regional growth of the market.

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Global IC Packaging Market

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