USD 25.25 billion
Report ID: SQMIG45O2022 | Region: Global | Published Date: June, 2023 | Pages: 157 | Tables: 65 | Figures: 74
Global Semiconductor Packaging Market size was valued at USD 25.25 billion in 2021 and is poised to grow from USD 26.90 billion in 2022 to USD 41.85 billion by 2030, at a CAGR of 6.52% during the forecast period (2023-2030).
The demand for semiconductor devices is increasing in a variety of applications, such as consumer electronics, automotive, industrial, and healthcare. This is due to the rising adoption of new technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT). These technologies require semiconductor devices with high processing power and memory capacity, which is driving the growth of the semiconductor packaging market.
By preserving overall performance and bringing down the cost of the package, semiconductor packaging technology increases the value of semiconductor products. For high-standard performance chips used in virtual products, semiconductor packaging is becoming more widely adopted. In addition, companies are creating semiconductor chips using graphene and tin oxide, which is anticipated to spur market product innovation.
One of the key elements fuelling the expansion of the semiconductor packaging market is the expansion of the semiconductor industry globally. Due to increasing demand from a variety of end-user industries and the use of packaging to enhance the performance, reliability, and cost-effectiveness of electronics systems, the market is growing at an accelerated rate due to continuous improvements in terms of integration, energy efficiency, and product characteristics.
Global Market Size
USD 25.25 billion
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Global Semiconductor Packaging Market is segmented on the basis of material, application and region. By material, the market is segmented into organic packaging, organic packaging, compound semiconductor packaging. By application, market is segmented into consumer electronics, automotive, industrial, healthcare, others. By region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.
Semiconductor Packaging Market Analysis by Product
The organic packaging segment is the dominant segment of the market and is expected to retain its dominance during the forecast period. This is due to the low cost and high flexibility of organic packages. Organic substrates are made from polymers such as epoxy and silicone. They are used in a variety of semiconductor packaging applications, including lead frame packages, flip chip packages, and ball grid array (BGA) packages.
During the projected period, the inorganic packaging category is anticipated to expand more quickly. This is due to the increasing demand for high-performance and high-reliability packages in applications such as automotive, aerospace, and defense. Inorganic packaging is made from materials such as ceramics, glass, and metal. It is used in applications where high-performance, high-reliability, or high-temperature performance is required. They are also more resistant to heat and chemicals, making them suitable for use in harsh environments. However, inorganic packages are more expensive to manufacture than organic packages.
Semiconductor Packaging Market Analysis by Application
The consumer electronics segment is the dominant segment of the global semiconductor packaging market, accounting for a market share of over 38% in 2022. The consumer electronics segment is the dominant segment of the market and is expected to retain its dominance during the forecast period. This is due to the high demand for semiconductor devices in consumer electronics such as smartphones, tablets, and laptops.
The automotive segment is the fastest growing segment of the global semiconductor packaging market, with a CAGR of over 12% during the forecast period. The automotive segment is expected to grow at a faster rate during the forecast period. This is due to the increasing demand for semiconductor devices in automotive applications such as advanced driver assistance systems (ADAS), infotainment systems, and powertrain control systems.
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Asia-Pacific is the dominant region in the global semiconductor packaging market, accounting for a market share of over 50% in 2022. The growth of this region is being driven by the presence of large semiconductor manufacturing companies in countries. Asia-Pacific is home to some of the largest semiconductor manufacturing companies in the world, such as Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics, and Intel. These companies are investing heavily in research and development, which is driving the growth of the semiconductor packaging market in the region.
North America is the fastest growing region in the global semiconductor packaging market, with a CAGR of over 10% during the forecast period. The growth of this region is being driven by the increasing demand for semiconductor devices in the automotive, industrial, and healthcare sectors.
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Semiconductor Packaging Market Drivers
Advancements in Miniaturization
Demand for Enhanced Thermal Management
Semiconductor Packaging Market Restraints
Cost and Economic Factors
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Details about each company are provided by the semiconductor packaging market competitive landscape. Included information includes the company's executive summary, financials, revenue generated, market potential, investments in R&D, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product breadth and depth, and application dominance
Semiconductor Packaging Market Top Player’s Company Profiles
Semiconductor Packaging Market Recent Developments
High-Speed and High-Bandwidth Applications
SkyQuest’s ABIRAW (Advanced Business Intelligence, Research & Analysis Wing) is our Business Information Services team that Collects, Collates, Co-relates and Analyses the Data collected by means of Primary Exploratory Research backed by the robust Secondary Desk research.
According to our analyses, the global semiconductor packaging market plays a crucial role in enabling the functionality and performance of electronic devices. It involves the process of encapsulating semiconductor chips to protect them from external influences, provide electrical connections, and dissipate heat efficiently. The market has been experiencing significant growth due to advancements in technology, increasing demand for compact and high-performance devices, and the proliferation of emerging applications. One of the key drivers of the semiconductor packaging market is the trend towards miniaturization and high-density packaging. Consumers and industries alike demand smaller, lighter, and more powerful devices, which require advanced packaging techniques to accommodate more components within a limited space. Industry players must navigate these trends and challenges to capitalize on the opportunities presented by the evolving semiconductor packaging landscape.
|Market size value in 2021||USD 25.25 billion|
|Market size value in 2030||USD 26.90 billion|
|Forecast Unit (Value)||USD Billion|
|Regions covered||North America (US, Canada), Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe), Asia Pacific (China, India, Japan, Rest of Asia-Pacific), Latin America (Brazil, Rest of Latin America), Middle East & Africa (South Africa, GCC Countries, Rest of MEA)|
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Parent Market Analysis
KEY MARKET INSIGHTS
MARKET DYNAMICS & OUTLOOK
Market Size by Region
KEY COMPANY PROFILES
For the Global Semiconductor Packaging Market, our research methodology involved a mixture of primary and secondary data sources. Key steps involved in the research process are listed below:
1. Information Procurement: This stage involved the procurement of Market data or related information via primary and secondary sources. The various secondary sources used included various company websites, annual reports, trade databases, and paid databases such as Hoover's, Bloomberg Business, Factiva, and Avention. Our team did 45 primary interactions Globally which included several stakeholders such as manufacturers, customers, key opinion leaders, etc. Overall, information procurement was one of the most extensive stages in our research process.
2. Information Analysis: This step involved triangulation of data through bottom-up and top-down approaches to estimate and validate the total size and future estimate of the Global Semiconductor Packaging Market.
3. Report Formulation: The final step entailed the placement of data points in appropriate Market spaces in an attempt to deduce viable conclusions.
4. Validation & Publishing: Validation is the most important step in the process. Validation & re-validation via an intricately designed process helped us finalize data points to be used for final calculations. The final Market estimates and forecasts were then aligned and sent to our panel of industry experts for validation of data. Once the validation was done the report was sent to our Quality Assurance team to ensure adherence to style guides, consistency & design.
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