USD 26.90 billion
Global Semiconductor Packaging Market Size, Share, Growth Analysis, By Material(Organic Packaging, Organic Packaging), By Application(Consumer Electronics, Automotive) - Industry Forecast 2024-2031
Report ID:
SQMIG45O2022 |
Region:
Global |
Published Date: March, 2024
Pages:
197
|
Tables:
65 |
Figures:
74
Global Semiconductor Packaging Market Insights
Global Semiconductor Packaging Market size was valued at USD 26.90 billion in 2022 and is poised to grow from USD 28.65 billion in 2023 to USD 47.49 billion by 2031, growing at a CAGR of 6.52% during the forecast period (2024-2031).
The demand for semiconductor devices is increasing in a variety of applications, such as consumer electronics, automotive, industrial, and healthcare. This is due to the rising adoption of new technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT). These technologies require semiconductor devices with high processing power and memory capacity, which is driving the growth of the semiconductor packaging market.
By preserving overall performance and bringing down the cost of the package, semiconductor packaging technology increases the value of semiconductor products. For high-standard performance chips used in virtual products, semiconductor packaging is becoming more widely adopted. In addition, companies are creating semiconductor chips using graphene and tin oxide, which is anticipated to spur market product innovation.
One of the key elements fuelling the expansion of the semiconductor packaging market is the expansion of the semiconductor industry globally. Due to increasing demand from a variety of end-user industries and the use of packaging to enhance the performance, reliability, and cost-effectiveness of electronics systems, the market is growing at an accelerated rate due to continuous improvements in terms of integration, energy efficiency, and product characteristics.
US Semiconductor Packaging Market is poised to grow at sustainable CAGR for the next forecast year.
Market snapshot - 2024-2031
Global Market Size
Largest Segment
Organic Packaging
Fastest Growth
Organic Packaging
Growth Rate
6.52% CAGR
Global Semiconductor Packaging Market ($ Bn)
Country Share for Asia Pacific Region (%)
Global Semiconductor Packaging Market By Material ($ Bn)
Global Semiconductor Packaging Market By Material (%)
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Global Semiconductor Packaging Market Segmental Analysis
Global Semiconductor Packaging Market is segmented on the basis of material, application and region. By material, the market is segmented into organic packaging, compound semiconductor packaging. By application, market is segmented into consumer electronics, automotive, industrial, healthcare, others. By region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.
Semiconductor Packaging Market Analysis by Product
The organic packaging segment is the dominant segment of the market and is expected to retain its dominance during the forecast period. This is due to the low cost and high flexibility of organic packages. Organic substrates are made from polymers such as epoxy and silicone. They are used in a variety of semiconductor packaging applications, including lead frame packages, flip chip packages, and ball grid array (BGA) packages.
During the projected period, the inorganic packaging category is anticipated to expand more quickly. This is due to the increasing demand for high-performance and high-reliability packages in applications such as automotive, aerospace, and defense. Inorganic packaging is made from materials such as ceramics, glass, and metal. It is used in applications where high-performance, high-reliability, or high-temperature performance is required. They are also more resistant to heat and chemicals, making them suitable for use in harsh environments. However, inorganic packages are more expensive to manufacture than organic packages.
Semiconductor Packaging Market Analysis by Application
The consumer electronics segment is the dominant segment of the global semiconductor packaging market, accounting for a market share of over 38% in 2023. The consumer electronics segment is the dominant segment of the market and is expected to retain its dominance during the forecast period. This is due to the high demand for semiconductor devices in consumer electronics such as smartphones, tablets, and laptops.
The automotive segment is the fastest growing segment of the global semiconductor packaging market, with a CAGR of over 12% during the forecast period. The automotive segment is expected to grow at a faster rate during the forecast period. This is due to the increasing demand for semiconductor devices in automotive applications such as advanced driver assistance systems (ADAS), infotainment systems, and powertrain control systems.
Global Semiconductor Packaging Market By Material, 2023 (%)
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Global Semiconductor Packaging Market Regional Insights
Asia-Pacific is the dominant region in the global semiconductor packaging market, accounting for a market share of over 50% in 2023. The growth of this region is being driven by the presence of large semiconductor manufacturing companies in countries. Asia-Pacific is home to some of the largest semiconductor manufacturing companies in the world, such as Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics, and Intel. These companies are investing heavily in research and development, which is driving the growth of the semiconductor packaging market in the region.
North America is the fastest growing region in the global semiconductor packaging market, with a CAGR of over 10% during the forecast period. The growth of this region is being driven by the increasing demand for semiconductor devices in the automotive, industrial, and healthcare sectors.
Global Semiconductor Packaging Market By Region, 2024-2031
- Largest
- Fastest
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Global Semiconductor Packaging Market Dynamics
Semiconductor Packaging Market Drivers
Advancements in Miniaturization
- The demand for enhanced semiconductor packaging techniques is driven by the desire for smaller and more compact electronic products, including smartphones, wearables, and IoT devices. Miniaturization allows for increased functionality and improved performance while reducing the overall size and weight of electronic devices. Advanced packaging technologies enable the integration of multiple functions and components in a smaller footprint.
Demand for Enhanced Thermal Management
- semiconductor devices become more powerful and generate more heat, effective thermal management is crucial to ensure their reliability and performance. Advanced packaging solutions, such as thermal interface materials, heat spreaders, and integrated cooling solutions, help dissipate heat efficiently and maintain optimal operating temperatures. The need for improved thermal management is driving the adoption of innovative packaging techniques in high-power applications
Semiconductor Packaging Market Restraints
Cost and Economic Factors
- Cost is a significant restraint in the semiconductor packaging market. Advanced packaging technologies often involve complex processes, specialized equipment, and high-quality materials, which can drive up production costs. Moreover, the need for continuous investment in advanced packaging technologies and equipment can pose financial challenges for manufacturers. Market competition and price pressures from customers also impact profit margins and can restrict the adoption of advanced packaging solutions.
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Global Semiconductor Packaging Market Competitive Landscape
Details about each company are provided by the semiconductor packaging market competitive landscape. Included information includes the company's executive summary, financials, revenue generated, market potential, investments in R&D, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product breadth and depth, and application dominance
Semiconductor Packaging Market Top Player’s Company Profiles
- Powertech Technology Inc. (Taiwan)
- STATS ChipPAC Pte. Ltd. (Singapore)
- Samsung Electronics Co., Ltd. (South Korea)
- UTAC Holdings Ltd. (Singapore)
- ChipMOS Technologies Inc. (Taiwan)
- Intel Corporation (United States)
- Advanced Semiconductor Engineering, Inc. (Taiwan)
- Siliconware Precision Industries Co., Ltd. (Taiwan)
- Jiangsu Changjiang Electronics Technology (China)
- Powertech Technology Inc. (Taiwan)
- Amkor Technology, Inc. (United States)
- STATS ChipPAC Pte. Ltd. (Singapore)
- Samsung Electronics Co., Ltd. (South Korea)
- Tongfu Microelectronics Co., Ltd. (China)
- Unisem Group (Malaysia)
- Nepes Corporation (South Korea)
Semiconductor Packaging Market Recent Developments
- In April 2023, Intel announced that it would invest USD 1 billion in its semiconductor packaging facility in Chandler, Arizona. The investment will be used to expand the facility and add new capabilities, such as 3D packaging and heterogeneous integration.
- In March 2023, TSMC announced that it would invest USD 100 billion in its semiconductor manufacturing and packaging facilities over the next three years. The investment will be used to expand TSMC's capacity and to develop new technologies, such as 3D packaging and extreme ultraviolet (EUV) lithography.
- In February 2023, ASE Group announced that it would acquire Siliconware Precision Industries (SPI) for USD 5.4 billion. The acquisition will give ASE Group a leading position in the global semiconductor packaging market.
Global Semiconductor Packaging Key Market Trends
High-Speed and High-Bandwidth Applications
- With the proliferation of data-intensive applications, there is a growing need for high-speed and high-bandwidth semiconductor packaging solutions. Advanced packaging techniques such as flip-chip, wafer-level chip-scale packaging (WLCSP), and package-on-package (PoP) enable faster data transmission, reduced signal losses, and enhanced electrical performance.
Global Semiconductor Packaging Market SkyQuest Analysis
SkyQuest’s ABIRAW (Advanced Business Intelligence, Research & Analysis Wing) is our Business Information Services team that Collects, Collates, Co-relates and Analyses the Data collected by means of Primary Exploratory Research backed by the robust Secondary Desk research.
According to our analyses, the global semiconductor packaging market plays a crucial role in enabling the functionality and performance of electronic devices. It involves the process of encapsulating semiconductor chips to protect them from external influences, provide electrical connections, and dissipate heat efficiently. The market has been experiencing significant growth due to advancements in technology, increasing demand for compact and high-performance devices, and the proliferation of emerging applications. One of the key drivers of the semiconductor packaging market is the trend towards miniaturization and high-density packaging. Consumers and industries alike demand smaller, lighter, and more powerful devices, which require advanced packaging techniques to accommodate more components within a limited space. Industry players must navigate these trends and challenges to capitalize on the opportunities presented by the evolving semiconductor packaging landscape.
| Report Metric | Details |
|---|---|
| Market size value in 2023 | USD 26.90 billion |
| Market size value in 2031 | USD 47.49 billion |
| Growth Rate | 6.52% |
| Forecast period | 2024-2031 |
| Forecast Unit (Value) | USD Billion |
| Segments covered |
|
| Regions covered | North America (US, Canada), Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe), Asia Pacific (China, India, Japan, Rest of Asia-Pacific), Latin America (Brazil, Rest of Latin America), Middle East & Africa (South Africa, GCC Countries, Rest of MEA) |
| Companies covered |
|
| Customization scope | Free report customization with purchase. Customization includes:-
|
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Table Of Content
Executive Summary
Market overview
- Exhibit: Executive Summary – Chart on Market Overview
- Exhibit: Executive Summary – Data Table on Market Overview
- Exhibit: Executive Summary – Chart on Global Semiconductor Packaging Market Characteristics
- Exhibit: Executive Summary – Chart on Market by Geography
- Exhibit: Executive Summary – Chart on Market Segmentation
- Exhibit: Executive Summary – Chart on Incremental Growth
- Exhibit: Executive Summary – Data Table on Incremental Growth
- Exhibit: Executive Summary – Chart on Vendor Market Positioning
Parent Market Analysis
Market overview
Market size
- Market Dynamics
- Exhibit: Impact analysis of DROC, 2021
- Drivers
- Opportunities
- Restraints
- Challenges
- Exhibit: Impact analysis of DROC, 2021
- SWOT Analysis
KEY MARKET INSIGHTS
- Technology Analysis
- (Exhibit: Data Table: Name of technology and details)
- Pricing Analysis
- (Exhibit: Data Table: Name of technology and pricing details)
- Supply Chain Analysis
- (Exhibit: Detailed Supply Chain Presentation)
- Value Chain Analysis
- (Exhibit: Detailed Value Chain Presentation)
- Ecosystem Of the Market
- Exhibit: Parent Market Ecosystem Market Analysis
- Exhibit: Market Characteristics of Parent Market
- IP Analysis
- (Exhibit: Data Table: Name of product/technology, patents filed, inventor/company name, acquiring firm)
- Trade Analysis
- (Exhibit: Data Table: Import and Export data details)
- Startup Analysis
- (Exhibit: Data Table: Emerging startups details)
- Raw Material Analysis
- (Exhibit: Data Table: Mapping of key raw materials)
- Innovation Matrix
- (Exhibit: Positioning Matrix: Mapping of new and existing technologies)
- Pipeline product Analysis
- (Exhibit: Data Table: Name of companies and pipeline products, regional mapping)
- Macroeconomic Indicators
COVID IMPACT
- Introduction
- Impact On Economy—scenario Assessment
- Exhibit: Data on GDP - Year-over-year growth 2016-2022 (%)
- Revised Market Size
- Exhibit: Data Table on Global Semiconductor Packaging Market size and forecast 2021-2027 ($ million)
- Impact Of COVID On Key Segments
- Exhibit: Data Table on Segment Market size and forecast 2021-2027 ($ million)
- COVID Strategies By Company
- Exhibit: Analysis on key strategies adopted by companies
MARKET DYNAMICS & OUTLOOK
- Market Dynamics
- Exhibit: Impact analysis of DROC, 2021
- Drivers
- Opportunities
- Restraints
- Challenges
- Exhibit: Impact analysis of DROC, 2021
- Regulatory Landscape
- Exhibit: Data Table on regulation from different region
- SWOT Analysis
- Porters Analysis
- Competitive rivalry
- Exhibit: Competitive rivalry Impact of key factors, 2021
- Threat of substitute products
- Exhibit: Threat of Substitute Products Impact of key factors, 2021
- Bargaining power of buyers
- Exhibit: buyers bargaining power Impact of key factors, 2021
- Threat of new entrants
- Exhibit: Threat of new entrants Impact of key factors, 2021
- Bargaining power of suppliers
- Exhibit: Threat of suppliers bargaining power Impact of key factors, 2021
- Competitive rivalry
- Skyquest special insights on future disruptions
- Political Impact
- Economic impact
- Social Impact
- Technical Impact
- Environmental Impact
- Legal Impact
Market Size by Region
- Chart on Market share by geography 2021-2027 (%)
- Data Table on Market share by geography 2021-2027(%)
- North America
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- USA
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Canada
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Europe
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- Germany
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Spain
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- France
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- UK
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of Europe
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Asia Pacific
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- China
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- India
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Japan
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- South Korea
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of Asia Pacific
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Latin America
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- Brazil
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of South America
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Middle East & Africa (MEA)
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- GCC Countries
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- South Africa
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of MEA
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
KEY COMPANY PROFILES
- Competitive Landscape
- Total number of companies covered
- Exhibit: companies covered in the report, 2021
- Top companies market positioning
- Exhibit: company positioning matrix, 2021
- Top companies market Share
- Exhibit: Pie chart analysis on company market share, 2021(%)
- Total number of companies covered
Methodology
For the Global Semiconductor Packaging Market, our research methodology involved a mixture of primary and secondary data sources. Key steps involved in the research process are listed below:
1. Information Procurement: This stage involved the procurement of Market data or related information via primary and secondary sources. The various secondary sources used included various company websites, annual reports, trade databases, and paid databases such as Hoover's, Bloomberg Business, Factiva, and Avention. Our team did 45 primary interactions Globally which included several stakeholders such as manufacturers, customers, key opinion leaders, etc. Overall, information procurement was one of the most extensive stages in our research process.
2. Information Analysis: This step involved triangulation of data through bottom-up and top-down approaches to estimate and validate the total size and future estimate of the Global Semiconductor Packaging Market.
3. Report Formulation: The final step entailed the placement of data points in appropriate Market spaces in an attempt to deduce viable conclusions.
4. Validation & Publishing: Validation is the most important step in the process. Validation & re-validation via an intricately designed process helped us finalize data points to be used for final calculations. The final Market estimates and forecasts were then aligned and sent to our panel of industry experts for validation of data. Once the validation was done the report was sent to our Quality Assurance team to ensure adherence to style guides, consistency & design.
Analyst Support
Customization Options
With the given market data, our dedicated team of analysts can offer you the following customization options are available for the Global Semiconductor Packaging Market:
Product Analysis: Product matrix, which offers a detailed comparison of the product portfolio of companies.
Regional Analysis: Further analysis of the Global Semiconductor Packaging Market for additional countries.
Competitive Analysis: Detailed analysis and profiling of additional Market players & comparative analysis of competitive products.
Go to Market Strategy: Find the high-growth channels to invest your marketing efforts and increase your customer base.
Innovation Mapping: Identify racial solutions and innovation, connected to deep ecosystems of innovators, start-ups, academics, and strategic partners.
Category Intelligence: Customized intelligence that is relevant to their supply Markets will enable them to make smarter sourcing decisions and improve their category management.
Public Company Transcript Analysis: To improve the investment performance by generating new alpha and making better-informed decisions.
Social Media Listening: To analyze the conversations and trends happening not just around your brand, but around your industry as a whole, and use those insights to make better Marketing decisions.
Global Semiconductor Packaging Market Report Snapshots
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