What is the Global market size of the Wi-Fi 6 And Wi-Fi 6E Chipset Market?

Global Wi-Fi 6 And Wi-Fi 6E Chipset Market size was valued at USD 12.24 billion in 2021 and is poised to grow from USD 13.3 billion in 2022 to USD 34.5 billion by 2030, growing at a CAGR of 13.83% in the forecast period (2023-2030).

Wi-Fi 6 And Wi-Fi 6E Chipset Market Size

Wi-Fi 6 And Wi-Fi 6E Chipset Market Insights

Global Wi-Fi 6 And Wi-Fi 6E Chipset Market size was valued at USD 13.3 billion in 2023 and is poised to grow from USD 15.14 billion in 2024 to USD 42.57 billion by 2032, growing at a CAGR of 13.8% during the forecast period (2025-2032).

Wi-Fi 6 is the most recent Wi-Fi technology standard, and it was created in response to the ever-increasing number of connected devices throughout the world. If you have a virtual reality (VR) device, several smart home gadgets, or just a large number of devices in your home, a Wi-Fi 6 router may be the best solution for you. Wi-Fi 6 use both 1024-QAM and a 160 MHz channel to create a signal with more data and a wider channel, respectively, in order to make your Wi-Fi faster. This means there will be no stuttering whether utilising virtual reality or streaming video in 4K or even 8K quality. More importantly, Wi-Fi 6 technologies such as MU-MIMO and OFDMA provide up to four times the capacity of previous generations and can manage more devices. Hosting house parties would be a snap with Wi-Fi 6 since the network could easily accommodate all of your visitors and the electrical devices they bring. Wi-Fi 6E is the same as Wi-Fi 6, with the exception of an "E" that stands for "Expanded." This refers to an increased number of wireless bands, specifically the 6 GHz frequency. In other words, Wi-Fi 6E is Wi-Fi 6 that has been stretched to the 6 GHz spectrum.

During the projection period, the market is expected to be driven by the rising requirement for increased network, low latency, and bandwidth communications across companies. The considerable increase in data traffic has pushed the demand for enhanced network connection across a variety of industries, including corporate and industrial. Thus, during the next seven years, it is projected that the installation of wi-fi 6 and 6E devices will expand, as will the need for their chipsets. Broadcom Inc. launched the BCM4389, the world's first Wi-Fi 6E consumer product, in 2019. The device raises the level to support the soon-to-be-operational 6 GHz spectrum as well as wider 160 MHz channel bandwidths, tripling speeds and lowering latency in half when compared to the prior device. The BCM4389 provides over 2 Gbps real-world speeds and up to 5 times better energy usage, making it a fantastic solution for future Augmented Reality/Virtual Reality (AR/VR) devices and flagship smartphones. The advantages of the new chipset technology over the legacy wireless standard are predicted to greatly accelerate its adoption from 2021 to 2028.

US Wi-Fi 6 And Wi-Fi 6E Chipset Market is poised to grow at a sustainable CAGR for the next forecast year.

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To deliver Wi-Fi 6 chipsets, key manufacturers are strategically focused on cooperating with end-use clients such as smartphone makers. Cisco and Apple, for example, partnered on Wi-Fi 6 in 2021 to increase uplink performance for real-time interactive video and audio apps like FaceTime and Webex. The collaboration resulted in the 'Fastlane+' feature, which alters Wi-Fi protocols to enable far more effective uplink scheduling. Broadcom Inc. formed a collaboration and agreement with Apple Inc. in January 2021. Broadcom Inc.'s Wi-Fi 6 chipsets will be used in Apple Inc.'s smartphones, laptops, and iPads as part of the strategic alliance. The supply arrangement for the chipset was valued USD 15 billion. 'Qualcomm Technologies, Inc. (United States) ', 'Intel Corporation (United States) ', 'Broadcom Inc. (United States) ', 'Marvell Technology Group Ltd. (United States) ', 'Samsung Electronics Co., Ltd. (South Korea) ', 'NXP Semiconductors N.V. (Netherlands) ', 'MediaTek Inc. (Taiwan) ', 'Texas Instruments Incorporated (United States) ', 'ON Semiconductor Corporation (United States) ', 'Qorvo, Inc. (United States) ', 'Renesas Electronics Corporation (Japan) ', 'Advanced Micro Devices, Inc. (AMD) (United States) ', 'Microchip Technology Inc. (United States) ', 'Infineon Technologies AG (Germany) ', 'Realtek Semiconductor Corp. (Taiwan) ', 'STMicroelectronics N.V. (Switzerland) ', 'Synaptics Incorporated (United States) ', 'Skyworks Solutions, Inc. (United States) ', 'Analog Devices, Inc. (United States) ', 'Lattice Semiconductor Corporation (United States) '

The market is expected to be driven by the increased need for enhanced network communications across enterprises, including low latency and high bandwidth, throughout the forecast period. The volume of data traffic has increased significantly, which has accelerated the need for improved network connectivity across a wide range of businesses, including corporate and industrial. As a result, it is expected that the number of Wi-Fi 6 and Wi-Fi 6E devices installed would rise, resulting in an increase in demand for respective chipsets during the next seven years. Broadcom Inc. demonstrated the BCM4389, the first consumer device to enable Wi-Fi 6E, to the public in 2020. When compared to the previous model, this one has a higher Wi-Fi 6 level to handle the soon-to-be-operational 6 GHz spectrum as well as broader 160 MHz channel bandwidths. As a result, speeds rise by a factor of two and latency decreases by a factor of two. The BCM4389 is a suitable choice for the upcoming Augmented Reality and Virtual Reality (AR/VR) devices as well as premium smartphones since it enables real-world speeds of over 2 Gbps and up to 5 times better energy use. It is expected that the advantages provided by the new chipset technology would outweigh the disadvantages.

The ability to access uninterrupted material while using online video streaming services has accelerated the installation of wi-fi 6 and wi-fi 6E devices throughout the world. As a result, it is predicted to accelerate the need for wi-fi 6 and wi-fi 6E chipsets from 2021 to 2028. Large and medium-sized firms, such as Ford Motor Company, Ericsson, General Motors Company, and BMW Group, are heavily deploying new technology to turn their facilities into smart factories as industry 4.0 evolves.

In 2021, Asia Pacific had the largest volume share—more than 35.0%. This is explained by the significant rise in financing for the development of products including as laptops, routers, and cellphones that use wi-fi 6 and 6E chipsets. These devices deliver a unified network experience while also supporting next-generation wireless frequency bands. The Asia Pacific market is expected to grow considerably between 2022 and 2028 as a consequence of the presence of large wi-fi 6 and 6E chipset manufacturing facilities in key countries like as China, Japan, South Korea, and Singapore.