Wi-Fi 6 And Wi-Fi 6E Chipset Market Updates

Global Wi-Fi 6 And Wi-Fi 6E Chipset Market size was valued at USD 13.3 billion in 2023 and is poised to grow from USD 15.14 billion in 2024 to USD 42.57 billion by 2032, growing at a CAGR of 13.8% during the forecast period (2025-2032). 

To deliver Wi-Fi 6 chipsets, key manufacturers are strategically focused on cooperating with end-use clients such as smartphone makers. Cisco and Apple, for example, partnered on Wi-Fi 6 in 2021 to increase uplink performance for real-time interactive video and audio apps like FaceTime and Webex. The collaboration resulted in the 'Fastlane+' feature, which alters Wi-Fi protocols to enable far more effective uplink scheduling. Broadcom Inc. formed a collaboration and agreement with Apple Inc. in January 2021. Broadcom Inc.'s Wi-Fi 6 chipsets will be used in Apple Inc.'s smartphones, laptops, and iPads as part of the strategic alliance. The supply arrangement for the chipset was valued USD 15 billion. 'Qualcomm Technologies, Inc. (United States) ', 'Intel Corporation (United States) ', 'Broadcom Inc. (United States) ', 'Marvell Technology Group Ltd. (United States) ', 'Samsung Electronics Co., Ltd. (South Korea) ', 'NXP Semiconductors N.V. (Netherlands) ', 'MediaTek Inc. (Taiwan) ', 'Texas Instruments Incorporated (United States) ', 'ON Semiconductor Corporation (United States) ', 'Qorvo, Inc. (United States) ', 'Renesas Electronics Corporation (Japan) ', 'Advanced Micro Devices, Inc. (AMD) (United States) ', 'Microchip Technology Inc. (United States) ', 'Infineon Technologies AG (Germany) ', 'Realtek Semiconductor Corp. (Taiwan) ', 'STMicroelectronics N.V. (Switzerland) ', 'Synaptics Incorporated (United States) ', 'Skyworks Solutions, Inc. (United States) ', 'Analog Devices, Inc. (United States) ', 'Lattice Semiconductor Corporation (United States) '

The market is expected to be driven by the increased need for enhanced network communications across enterprises, including low latency and high bandwidth, throughout the forecast period. The volume of data traffic has increased significantly, which has accelerated the need for improved network connectivity across a wide range of businesses, including corporate and industrial. As a result, it is expected that the number of Wi-Fi 6 and Wi-Fi 6E devices installed would rise, resulting in an increase in demand for respective chipsets during the next seven years. Broadcom Inc. demonstrated the BCM4389, the first consumer device to enable Wi-Fi 6E, to the public in 2020. When compared to the previous model, this one has a higher Wi-Fi 6 level to handle the soon-to-be-operational 6 GHz spectrum as well as broader 160 MHz channel bandwidths. As a result, speeds rise by a factor of two and latency decreases by a factor of two. The BCM4389 is a suitable choice for the upcoming Augmented Reality and Virtual Reality (AR/VR) devices as well as premium smartphones since it enables real-world speeds of over 2 Gbps and up to 5 times better energy use. It is expected that the advantages provided by the new chipset technology would outweigh the disadvantages.

The ability to access uninterrupted material while using online video streaming services has accelerated the installation of wi-fi 6 and wi-fi 6E devices throughout the world. As a result, it is predicted to accelerate the need for wi-fi 6 and wi-fi 6E chipsets from 2021 to 2028. Large and medium-sized firms, such as Ford Motor Company, Ericsson, General Motors Company, and BMW Group, are heavily deploying new technology to turn their facilities into smart factories as industry 4.0 evolves.

In 2021, Asia Pacific had the largest volume share—more than 35.0%. This is explained by the significant rise in financing for the development of products including as laptops, routers, and cellphones that use wi-fi 6 and 6E chipsets. These devices deliver a unified network experience while also supporting next-generation wireless frequency bands. The Asia Pacific market is expected to grow considerably between 2022 and 2028 as a consequence of the presence of large wi-fi 6 and 6E chipset manufacturing facilities in key countries like as China, Japan, South Korea, and Singapore.