Curing Adhesives Market Size

SkyQuest Technology's Curing adhesives market size, share and forecast Report is based on the analysis of market data and Industry trends impacting the global Curing Adhesives Market and the revenue of top companies operating in it. Market Size Data and Statistics are based on the comprehensive research by our Team of Analysts and Industry experts.

Curing Adhesives Market Insights

Global Curing Adhesives Market size was valued at USD 13.6 billion in 2023 and is poised to grow from USD 14.61 billion in 2024 to USD 25.86 billion by 2032, growing at a CAGR of 7.4% during the forecast period (2025-2032).

Curing adhesives are reactive materials which need chemical reactions for converting them from liquid to solid. The adhesives generally provide high strength, flexible to rigid bond lines that resist temperature, humidity, and others after getting cured. They possess a high range of elasticity and are compatible for bonding with high need to the finished product’s aesthetics. The curing adhesives are commonly used in the electronics manufacturing industry due to their properties and process advantages, which are perfect for the manufacturing needs that are required by the current electronic industry players, which includes environmental and health & safety demands, miniaturization, minimizing total product cost, and manufacturing yield improvement. 

US Curing Adhesives Market is poised to grow at a sustainable CAGR for the next forecast year.

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Global Curing Adhesives Market size was valued at USD 13.6 billion in 2023 and is poised to grow from USD 14.61 billion in 2024 to USD 25.86 billion by 2032, growing at a CAGR of 7.4% during the forecast period (2025-2032).

Global curing adhesives market is highly competitive and somewhat fragmented. To maintain a competitive edge, the major industry participants are continually implementing various growth strategies. Innovations, mergers, and acquisitions, collaborations and partnerships are adopted by these players to thrive in the competitive market. In order to provide industries with the most effective and economical solutions, the major market players are also continually concentrating on R&D. 'Henkel GmbH & Co. KGaA (Germany) ', '3M (United States) ', 'Avery Dennison Corp. (United States) ', 'H.B. Fuller (United States) ', 'Arkema Group (France) ', 'Sika AG (Switzerland) ', 'RPM International Inc. (United States) ', 'LINTEC Corp. (Japan) ', 'Huntsman Corp. (United States) ', 'Illinois Tool Works Inc. (United States) ', 'Wacker Chemie AG (Germany) ', 'Pidilite Industries Ltd. (India) ', 'Berry Global, Inc. (United States) ', 'DuPont (United States) ', 'Mactac (United States) ', 'Nan Pao Resins Chemical Co., Ltd. (Taiwan) ', 'Jowat Corp. (Germany) ', 'DELO Industrial Adhesives (Germany) ', 'Toagosei Group (Japan) ', 'General Sealants, Inc. (United States)'

Stringent regulations and emission control systems by various governing bodies are predicted to hamper the growth of the curing adhesives market during the aforementioned forecast period.

The electronics manufacturing industry is using curing adhesives in many key areas such as wire and parts tacking, strain relief, tamper-proofing, coil terminating, temporary masking, structural bonding, encapsulation, potting, conformal coating, surface mount component attachment, and glob topping. 

Asia Pacific region held the largest share of the global curing adhesive market in 2021 and expected to retain the largest consumer due to the rising product utilization in construction and electronic industries in the region. Also, the demand in this region is expected to reach a net volume crossing 2,560 kilo tons by 2028.

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Global Curing Adhesives Market
Curing Adhesives Market

Report ID: SQMIG15E2365

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