Global Curing Adhesives Market

Curing Adhesives Market Size, Share, Growth Analysis, By Product(UV curing adhesives, moisture curing adhesives), By Resin(Epoxy, silicone) - Industry Forecast 2024-2031

Report ID: SQMIG15E2365 | Region: Global | Published Date: February, 2024
Pages: 157 | Tables: 65 | Figures: 66

Curing Adhesives Market Competitive Landscape

Global curing adhesives market is highly competitive and somewhat fragmented. To maintain a competitive edge, the major industry participants are continually implementing various growth strategies. Innovations, mergers, and acquisitions, collaborations and partnerships are adopted by these players to thrive in the competitive market. In order to provide industries with the most effective and economical solutions, the major market players are also continually concentrating on R&D.

Curing Adhesives Market Top Player's Company Profiles

  • KGaA
  • Henkel AG & Co.
  • H.B. Fuller
  • Bostik SA
  • 3M Company
  • Jowat SE
  • Dow Corning
  • Tosoh
  • Dymax Corporation
  • Ashland Inc.
  • BASF

Curing Adhesives Market

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FAQs

Curing Adhesives Market size was valued at USD 44.29 million in 2019 and is poised to grow from USD 46.68 million in 2023 to USD 71.10 billion by 2031, growing at a CAGR of 6% in the forecast period (2024-2031).

curing adhesives market is highly competitive and somewhat fragmented. To maintain a competitive edge, the major industry participants are continually implementing various growth strategies. Innovations, mergers, and acquisitions, collaborations and partnerships are adopted by these players to thrive in the competitive market. In order to provide industries with the most effective and economical solutions, the major market players are also continually concentrating on R&D. 'KGaA', 'Henkel AG & Co.', 'H.B. Fuller', 'Bostik SA', '3M Company', 'Jowat SE', 'Dow Corning', 'Tosoh', 'Dymax Corporation', 'Ashland Inc.', 'BASF'

Stringent regulations and emission control systems by various governing bodies are predicted to hamper the growth of the curing adhesives market during the aforementioned forecast period.

The electronics manufacturing industry is using curing adhesives in many key areas such as wire and parts tacking, strain relief, tamper-proofing, coil terminating, temporary masking, structural bonding, encapsulation, potting, conformal coating, surface mount component attachment, and glob topping. 

Asia Pacific region held the largest share of the curing adhesive market in 2021 and expected to retain the largest consumer due to the rising product utilization in construction and electronic industries in the region. Also, the demand in this region is expected to reach a net volume crossing 2,560 kilo tons by 2028.

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