Global Curing Adhesives Market

Curing Adhesives Market Size, Share, Growth Analysis, By Product(UV curing adhesives, moisture curing adhesives), By Resin(Epoxy, silicone) - Industry Forecast 2024-2031


Report ID: SQMIG15E2365 | Region: Global | Published Date: February, 2024
Pages: 157 | Tables: 65 | Figures: 66

Curing Adhesives Market News

  • In June 2023, Dymax introduced the inaugural product in its Hybrid Light-Curable (HLC) adhesive series, known as HLC-M-1000. This innovative formulation, based on a patented technology, merges anionic and free radical chemistries to create a groundbreaking adhesive solution.

  • In April 2023, Dymax introduced the 1045-M adhesive. This light-curable material, known as MD®, is specifically engineered for the purpose of adhering glass, stainless steel (SS), acrylonitrile butadiene styrene (ABS), and polycarbonate (PC) substrates commonly employed in the assembly of medical devices, such as syringes, single-use apparatus, and injectors.

  • In December 2022, Dow introduced a new iteration of its V PLUS Perform polyurethane technology for insulated metal panels, known as V PLUS Perform next, with the aim of enhancing its capabilities. This product integrates the excellent fire safety and energy efficiency characteristics of V PLUS Perform while incorporating customized low-carbon and circular ingredients to meet the specific requirements of the customer.

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FAQs

Curing Adhesives Market size was valued at USD 44.29 million in 2019 and is poised to grow from USD 46.68 million in 2023 to USD 71.10 billion by 2031, growing at a CAGR of 6% in the forecast period (2024-2031).

curing adhesives market is highly competitive and somewhat fragmented. To maintain a competitive edge, the major industry participants are continually implementing various growth strategies. Innovations, mergers, and acquisitions, collaborations and partnerships are adopted by these players to thrive in the competitive market. In order to provide industries with the most effective and economical solutions, the major market players are also continually concentrating on R&D. 'KGaA', 'Henkel AG & Co.', 'H.B. Fuller', 'Bostik SA', '3M Company', 'Jowat SE', 'Dow Corning', 'Tosoh', 'Dymax Corporation', 'Ashland Inc.', 'BASF'

Stringent regulations and emission control systems by various governing bodies are predicted to hamper the growth of the curing adhesives market during the aforementioned forecast period.

The electronics manufacturing industry is using curing adhesives in many key areas such as wire and parts tacking, strain relief, tamper-proofing, coil terminating, temporary masking, structural bonding, encapsulation, potting, conformal coating, surface mount component attachment, and glob topping. 

Asia Pacific region held the largest share of the curing adhesive market in 2021 and expected to retain the largest consumer due to the rising product utilization in construction and electronic industries in the region. Also, the demand in this region is expected to reach a net volume crossing 2,560 kilo tons by 2028.

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Global Curing Adhesives Market

Product ID: SQMIG15E2365

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