What is the global market size of System in Package (Sip) Technology Market?

System in Package (Sip) Technology Market size was valued at USD 14.87 billion in 2021 and is poised to grow from USD 34.2 billion in 2022 to USD 16.31 billion by 2030, growing at a CAGR of 9.7% in the forecast period (2023-2030).

Who are the key vendors in the Global System in Package (Sip) Technology Market?

These large market players are focusing on growing their consumer base globally. To increase their market share and profitability, these companies are using strategic collaborative initiatives. Mid-size and smaller businesses are, however, increasing their market presence by securing new contracts and by tapping into new markets as a result of technological advancements and product innovations. 'ASE Technology Holding Co., Ltd.', 'Amkor Technology, Inc.', 'Siliconware Precision Industries Co., Ltd.', 'Powertech Technology Inc.', 'Taiwan Semiconductor Manufacturing Company Limited', 'STATS ChipPAC Pte. Ltd.', 'ChipMOS Technologies Inc.', 'Jiangsu Changjiang Electronics Technology Co., Ltd.', 'Intel Corporation', 'Samsung Electronics Co., Ltd.', 'Fujitsu Limited', 'Texas Instruments Incorporated', 'Infineon Technologies AG', 'Toshiba Corporation', 'STMicroelectronics N.V.', 'Broadcom Inc.', 'Microchip Technology Inc.', 'NXP Semiconductors N.V.', 'Qualcomm Technologies, Inc.', 'Analog Devices, Inc.'

System in Package (Sip) Technology Market Size

System in Package (Sip) Technology Market Insights

System in Package (Sip) Technology Market size was valued at USD 19.23 billion in 2023 and is poised to grow from USD 21.06 billion in 2024 to USD 43.52 billion by 2032, growing at a CAGR of 9.5% during the forecast period (2025-2032).

The market is predicted to grow as result of the increased use of smartphones and smart wearables. The necessity for system in package technology has also expanded with the availability of 5G network-connected gadgets. The market is also anticipated to expand favourably due to the rise in demand for high-performance electronic devices, the development of sophisticated and small consumer electronics, and the price of traditional IC packaging, which includes packaging with a variety of IC sizes.

However, during the forecast period, the system in package (Sip) technology market growth may be challenged by the limited availability of resources and skills. In contrast, high cost of Sip and increase in the level of integration leading to thermal issues are anticipated to act as the major limitations for the growth of the market.

Additionally, it is expected that the pervasive use of internet-connected, small-sized electronics devices will open up a number of new opportunities for the system in package (Sip) technology market during the forecast period. Sip technology enables the integration of the biggest number of parts into a single package.

US System in Package (Sip) Technology Market is poised to grow at a sustainable CAGR for the next forecast year.

FAQs

These large market players are focusing on growing their consumer base globally. To increase their market share and profitability, these companies are using strategic collaborative initiatives. Mid-size and smaller businesses are, however, increasing their market presence by securing new contracts and by tapping into new markets as a result of technological advancements and product innovations. 'ASE Technology Holding Co., Ltd. (Taiwan) ', 'Amkor Technology, Inc. (United States) ', 'Taiwan Semiconductor Manufacturing Company Limited (TSMC) (Taiwan) ', 'Intel Corporation (United States) ', 'Texas Instruments Incorporated (United States) ', 'Samsung Electronics Co., Ltd. (South Korea) ', 'Qualcomm Technologies, Inc. (United States) ', 'Broadcom Inc. (United States) ', 'STMicroelectronics N.V. (Switzerland) ', 'NXP Semiconductors N.V. (Netherlands) ', 'Infineon Technologies AG (Germany) ', 'Micron Technology, Inc. (United States) ', 'SK Hynix Inc. (South Korea) ', 'Toshiba Corporation (Japan) ', 'Sony Corporation (Japan) ', 'MediaTek Inc. (Taiwan) ', 'Marvell Technology Group Ltd. (United States) ', 'ON Semiconductor Corporation (United States) ', 'Renesas Electronics Corporation (Japan) ', 'Advanced Micro Devices, Inc. (AMD) (United States)'

Small form factor electronics components are being used in the development of electronic devices to increase available space and improve the final product design. Customers choose handheld electronic gadgets that are tiny, small in size, and packed with functions. Companies are creating tiny electronics to combine the most components possible into a single package in order to improve the user experience. Integrating the most components possible into a single box, such as sensors, processors, and others, offers customers more functionality.

The automobile industry, particularly electric vehicles, will have development during the forecast period due to the increasing sensitivity of fossil fuels and the growth of governmental initiatives aimed at a cleaner environment. Manufacturers are being driven to create various integrated circuits (ICs) with a high standard of safety, a quick time to market, and cost effectiveness for various functions that smart automotive needs. The demand for small, integrated sensors with integrated packaging technologies, such as image sensors, environment sensors, and controllers, has been growing. Due to the availability of high bandwidth technology in the coming five years, wireless networks would encounter severe congestion. As a result, the switch from the current 3G and 4G LTE technology to 5G would happen more quickly. In comparison to the existing 3G and 4G data rates, it is projected that the 5G technology would offer aggregate data rates that are significantly faster. High-bandwidth RF components, such as front-end modules (FEM), power amplifier modules (PAM), antenna switch modules (ASM), RFID modules, and local interconnect network (LIN) transceiver Sip modules, would present design challenges because they would need to simulate multiple chips, passive circuits, and interconnects simultaneously in a single package. In turn, this would give Sip-based RF component manufacturers the opportunity to participate in developing cutting-edge 5G infrastructure.

The rapid investment in the growth of 5G, growing use of connected devices, and adoption of robots across all sectors to automate various workflows for higher efficiency in North America are all expected to increase demand for system in package technology. The market for microelectromechanical systems (MEMS) is growing fast in the United States as a result of the rise in chronic diseases. MEMS are used in medical systems such pacemakers, muscle stimulators, drug delivery systems, implanted pressure sensors, and miniature analytical equipment. Due to a number of chronic conditions, there is an increasing demand for microelectromechanical systems (MEMS) in medical devices such pacemakers, muscle stimulators, implantable pressure sensors, and drug delivery systems. According to a survey, chronic diseases are some of the most common and expensive health illnesses in the United States. Approximately 45% of all Americans, or 133 million people, have at least one chronic disease, and the number is rising.