USD 14.87 billion
Global System in Package (Sip) Technology Market Size, Share, Growth Analysis, By Package(Flat Packages, Pin Grid Arrays), By Packaging Technology(2D IC Packaging, 2.5D IC Packaging), By Packaging Method(Wire Bond, Flip Chip), By Device(Power Management Integrated Circuit (PMIC), Microelectromechanical Systems (MEMS)), By End User(Consumer Electronics, Automotive) - Industry Forecast 2024-2031
Report ID:
SQMIG15A2134 |
Region:
Global |
Published Date: February, 2024
Pages:
260
|
Tables:
152 |
Figures:
78
Global System in Package (Sip) Technology Market Insights
System in Package (Sip) Technology Market size was valued at USD 14.87 billion in 2019 and is poised to grow from USD 34.2 billion in 2023 to USD 16.31 billion by 2031, growing at a CAGR of 9.7% in the forecast period (2024-2031).
The market is predicted to grow as result of the increased use of smartphones and smart wearables. The necessity for system in package technology has also expanded with the availability of 5G network-connected gadgets. The market is also anticipated to expand favourably due to the rise in demand for high-performance electronic devices, the development of sophisticated and small consumer electronics, and the price of traditional IC packaging, which includes packaging with a variety of IC sizes.
However, during the forecast period, the system in package (Sip) technology market growth may be challenged by the limited availability of resources and skills. In contrast, high cost of Sip and increase in the level of integration leading to thermal issues are anticipated to act as the major limitations for the growth of the market.
Additionally, it is expected that the pervasive use of internet-connected, small-sized electronics devices will open up a number of new opportunities for the system in package (Sip) technology market during the forecast period. Sip technology enables the integration of the biggest number of parts into a single package.
US System in Package (Sip) Technology Market is poised to grow at a sustainable CAGR for the next forecast year.
Market snapshot - 2024-2031
Global Market Size
Largest Segment
Fan-Out Wafer Level Packaging
Fastest Growth
Fan-Out Wafer Level Packaging
Growth Rate
9.7% CAGR
Global System In Package (Sip) Technology Market ($ Bn)
Country Share for North America Region (%)
Global System In Package (Sip) Technology Market By Packaging Method ($ Bn)
Global System In Package (Sip) Technology Market By Packaging Method (%)
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Global System in Package (Sip) Technology Market Segmental Analysis
Global System in Package (Sip) Technology market is segmented on the basis of Package, Packaging Technology, Packaging Method, Device, End User, and region. By Package, the market is segmented into Flat Packages, Pin Grid Arrays, Surface Mount, Small Outline. By Packaging Technology, the market is segmented into 2D IC Packaging, 2.5D IC Packaging, 3D IC Packaging. By Packaging Method, the market is segmented into Wire Bond, Flip Chip, Fan-Out Wafer Leve. By Device, the market is segmented into Power Management Integrated Circuit (PMIC), Microelectromechanical Systems (MEMS), RF Front-End, RF Power Amplifier, Application Processor, Baseband Processor. By End User, the market is segmented into Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, Automotive and Transportation, Healthcare. By region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.
System in Package (Sip) Technology Market Analysis by End User
Based on end-user industry, the market is divided into automotive, aerospace & military, consumer electronics, telecommunications, and others. With new end-user innovations like smartphones obtaining 5G modules, cars getting advanced electronics, digital cockpits, and others, smartphones are becoming a requirement for people in both developed and developing countries, which is driving up demand for tiny electronics. Additionally, smart wearables are a crucial component of human health monitors. This shift in end user behavior fuels demand for compact electronic devices and drives market growth.
System in Package (Sip) Technology Market Analysis by Packaging Method
Based on the packaging technique, the market is divided into Fan-Out Wafer Level Packaging, Wire Bond and Die Attach, and Flip Chip segments. The Fan-Out Wafer Level Packaging (FOWLP) segment dominated the global market share. To enhance the electrical and thermal performance of its basic CPUs, Intel was one of the first businesses to employ flip chip packaging. FOWLP is a common packaging method for heterogeneous electronics such as baseband CPUs, RF transceivers, and power management ICs. The adoption of flip chip packaging technology in baseband and application processors for mobile platforms was driven by the growing demand for functionality and smaller package sizes (PMICS). Furthermore, it is anticipated that demand for the FOWLP packaging method will increase as a result of the rising need for semiconductor devices with numerous 1/O points.
Global System In Package (Sip) Technology Market By Packaging Method, 2023 (%)
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Global System in Package (Sip) Technology Market Regional Insights
The rapid investment in the growth of 5G, growing use of connected devices, and adoption of robots across all sectors to automate various workflows for higher efficiency in North America are all expected to increase demand for system in package technology. The market for microelectromechanical systems (MEMS) is growing fast in the United States as a result of the rise in chronic diseases. MEMS are used in medical systems such pacemakers, muscle stimulators, drug delivery systems, implanted pressure sensors, and miniature analytical equipment. Due to a number of chronic conditions, there is an increasing demand for microelectromechanical systems (MEMS) in medical devices such pacemakers, muscle stimulators, implantable pressure sensors, and drug delivery systems. According to a survey, chronic diseases are some of the most common and expensive health illnesses in the United States. Approximately 45% of all Americans, or 133 million people, have at least one chronic disease, and the number is rising.
Asia-Pacific accounted for the largest market share in terms of revenue, making up close to half of the global system in package (Sip) technology market. By 2030, it is anticipated that Asia-Pacific would continue to dominate the market in terms of revenue. Additionally, during the projected period, this area is anticipated to have the fastest CAGR of 11.0%. This is due to major players investing more in Sip package-based solutions in the region.
Global System In Package (Sip) Technology Market By Region, 2024-2031
- Largest
- Fastest
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Global System in Package (Sip) Technology Market Dynamics
System in Package (Sip) Technology Market Drivers
Increasing demand for electronic device miniaturization
- Small form factor electronics components are being used in the development of electronic devices to increase available space and improve the final product design. Customers choose handheld electronic gadgets that are tiny, small in size, and packed with functions. Companies are creating tiny electronics to combine the most components possible into a single package in order to improve the user experience. Integrating the most components possible into a single box, such as sensors, processors, and others, offers customers more functionality.
System in Package (Sip) Technology Market Restraints
Initial investment commitment required
- Establishing manufacturing and printing facilities requires a significant upfront financial investment. For the construction of factories and the acquisition of printing machinery, investment is needed. A rotogravure press, for instance, is more expensive than a lithographic press by about USD 1 million. Compared to a cost-effective lithographic plate, a single rotogravure cylinder costs roughly USD 5,000. However, lithographic printing is being phased out by technologies that are necessary to meet the demands of businesses in a market that is becoming more and more competitive. The equipment and setup costs for the offset printing process are also rather high.
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Global System in Package (Sip) Technology Market Competitive Landscape
These large market players are focusing on growing their consumer base globally. To increase their market share and profitability, these companies are using strategic collaborative initiatives. Mid-size and smaller businesses are, however, increasing their market presence by securing new contracts and by tapping into new markets as a result of technological advancements and product innovations.
System in Package (Sip) Technology Market Top Player’s Company Profiles
- ASE Technology Holding Co., Ltd.
- Amkor Technology, Inc.
- Siliconware Precision Industries Co., Ltd.
- Powertech Technology Inc.
- Taiwan Semiconductor Manufacturing Company Limited
- STATS ChipPAC Pte. Ltd.
- ChipMOS Technologies Inc.
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- Intel Corporation
- Samsung Electronics Co., Ltd.
- Fujitsu Limited
- Texas Instruments Incorporated
- Infineon Technologies AG
- Toshiba Corporation
- STMicroelectronics N.V.
- Broadcom Inc.
- Microchip Technology Inc.
- NXP Semiconductors N.V.
- Qualcomm Technologies, Inc.
- Analog Devices, Inc.
System in Package (Sip) Technology Market Recent Developments
- In March 2021, Toshiba Corporation introduced 80V N-channel power MOSFETs made using the most recent generation of manufacturing technology. The new MOSFETs can be employed in industrial equipment found in data centers and telecom base stations as switching power sources. The "TPH2R408QM" package, which is a surface-mount kind, and the "TPN19008QM" package, both belong to the extended line-up.
- In September 2021, in order to give customers even more insight into their overall wellbeing, Apple launched the Apple Watch Series 6, which incorporates the revolutionary Blood Oxygen function. A faster processor, the S6 System in Package (Sip), and a new generation of always-on altimeter are just a few of the notable hardware improvements that the Apple Watch Series 6 delivers. It also has the most colorful selection of case materials and band hues.
Global System in Package (Sip) Technology Key Market Trends
- The automobile industry, particularly electric vehicles, will have development during the forecast period due to the increasing sensitivity of fossil fuels and the growth of governmental initiatives aimed at a cleaner environment. Manufacturers are being driven to create various integrated circuits (ICs) with a high standard of safety, a quick time to market, and cost effectiveness for various functions that smart automotive needs. The demand for small, integrated sensors with integrated packaging technologies, such as image sensors, environment sensors, and controllers, has been growing. Due to the availability of high bandwidth technology in the coming five years, wireless networks would encounter severe congestion. As a result, the switch from the current 3G and 4G LTE technology to 5G would happen more quickly. In comparison to the existing 3G and 4G data rates, it is projected that the 5G technology would offer aggregate data rates that are significantly faster. High-bandwidth RF components, such as front-end modules (FEM), power amplifier modules (PAM), antenna switch modules (ASM), RFID modules, and local interconnect network (LIN) transceiver Sip modules, would present design challenges because they would need to simulate multiple chips, passive circuits, and interconnects simultaneously in a single package. In turn, this would give Sip-based RF component manufacturers the opportunity to participate in developing cutting-edge 5G infrastructure.
Global System in Package (Sip) Technology Market SkyQuest Analysis
SkyQuest’s ABIRAW (Advanced Business Intelligence, Research & Analysis Wing) is our Business Information Services team that Collects, Collates, Co-relates and Analyses the Data collected by means of Primary Exploratory Research backed by the robust Secondary Desk research.
According to our global System in Package (Sip) Technology Market analysis, growing market demand will be boosted by more businesses adopting digitalization, businesses investing more in electronics like smartphones, televisions, computers, drones, microphones, and global positioning systems, as well as technological advancements like 5G, the Internet of Things (IoT), and the fast global development of smart robots. Most cutting-edge consumer electronic devices are now using system in package technology because it maximizes system performance through higher integration and reduces repackaging with shorter development cycles at lower costs. Increased concentrations of integration lead to thermal issues that can jeopardize the efficiency of devices and impede market expansion. However, the market is anticipated to boost by rising demand for compact size and improved electrical component durability in smartphones.
| Report Metric | Details |
|---|---|
| Market size value in 2023 | USD 14.87 billion |
| Market size value in 2031 | USD 16.31 billion |
| Growth Rate | 9.7% |
| Forecast period | 2024-2031 |
| Forecast Unit (Value) | USD Billion |
| Segments covered |
|
| Regions covered | North America (US, Canada), Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe), Asia Pacific (China, India, Japan, Rest of Asia-Pacific), Latin America (Brazil, Rest of Latin America), Middle East & Africa (South Africa, GCC Countries, Rest of MEA) |
| Companies covered |
|
| Customization scope | Free report customization with purchase. Customization includes:-
|
| Historical Year | 2019 |
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Table Of Content
Executive Summary
Market overview
- Exhibit: Executive Summary – Chart on Market Overview
- Exhibit: Executive Summary – Data Table on Market Overview
- Exhibit: Executive Summary – Chart on Global System in Package (Sip) Technology Market Characteristics
- Exhibit: Executive Summary – Chart on Market by Geography
- Exhibit: Executive Summary – Chart on Market Segmentation
- Exhibit: Executive Summary – Chart on Incremental Growth
- Exhibit: Executive Summary – Data Table on Incremental Growth
- Exhibit: Executive Summary – Chart on Vendor Market Positioning
Parent Market Analysis
Market overview
Market size
- Market Dynamics
- Exhibit: Impact analysis of DROC, 2021
- Drivers
- Opportunities
- Restraints
- Challenges
- Exhibit: Impact analysis of DROC, 2021
- SWOT Analysis
KEY MARKET INSIGHTS
- Technology Analysis
- (Exhibit: Data Table: Name of technology and details)
- Pricing Analysis
- (Exhibit: Data Table: Name of technology and pricing details)
- Supply Chain Analysis
- (Exhibit: Detailed Supply Chain Presentation)
- Value Chain Analysis
- (Exhibit: Detailed Value Chain Presentation)
- Ecosystem Of the Market
- Exhibit: Parent Market Ecosystem Market Analysis
- Exhibit: Market Characteristics of Parent Market
- IP Analysis
- (Exhibit: Data Table: Name of product/technology, patents filed, inventor/company name, acquiring firm)
- Trade Analysis
- (Exhibit: Data Table: Import and Export data details)
- Startup Analysis
- (Exhibit: Data Table: Emerging startups details)
- Raw Material Analysis
- (Exhibit: Data Table: Mapping of key raw materials)
- Innovation Matrix
- (Exhibit: Positioning Matrix: Mapping of new and existing technologies)
- Pipeline product Analysis
- (Exhibit: Data Table: Name of companies and pipeline products, regional mapping)
- Macroeconomic Indicators
COVID IMPACT
- Introduction
- Impact On Economy—scenario Assessment
- Exhibit: Data on GDP - Year-over-year growth 2016-2022 (%)
- Revised Market Size
- Exhibit: Data Table on Global System in Package (Sip) Technology Market size and forecast 2021-2027 ($ million)
- Impact Of COVID On Key Segments
- Exhibit: Data Table on Segment Market size and forecast 2021-2027 ($ million)
- COVID Strategies By Company
- Exhibit: Analysis on key strategies adopted by companies
MARKET DYNAMICS & OUTLOOK
- Market Dynamics
- Exhibit: Impact analysis of DROC, 2021
- Drivers
- Opportunities
- Restraints
- Challenges
- Exhibit: Impact analysis of DROC, 2021
- Regulatory Landscape
- Exhibit: Data Table on regulation from different region
- SWOT Analysis
- Porters Analysis
- Competitive rivalry
- Exhibit: Competitive rivalry Impact of key factors, 2021
- Threat of substitute products
- Exhibit: Threat of Substitute Products Impact of key factors, 2021
- Bargaining power of buyers
- Exhibit: buyers bargaining power Impact of key factors, 2021
- Threat of new entrants
- Exhibit: Threat of new entrants Impact of key factors, 2021
- Bargaining power of suppliers
- Exhibit: Threat of suppliers bargaining power Impact of key factors, 2021
- Competitive rivalry
- Skyquest special insights on future disruptions
- Political Impact
- Economic impact
- Social Impact
- Technical Impact
- Environmental Impact
- Legal Impact
Market Size by Region
- Chart on Market share by geography 2021-2027 (%)
- Data Table on Market share by geography 2021-2027(%)
- North America
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- USA
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Canada
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Europe
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- Germany
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Spain
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- France
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- UK
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of Europe
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Asia Pacific
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- China
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- India
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Japan
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- South Korea
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of Asia Pacific
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Latin America
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- Brazil
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of South America
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Middle East & Africa (MEA)
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- GCC Countries
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- South Africa
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of MEA
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
KEY COMPANY PROFILES
- Competitive Landscape
- Total number of companies covered
- Exhibit: companies covered in the report, 2021
- Top companies market positioning
- Exhibit: company positioning matrix, 2021
- Top companies market Share
- Exhibit: Pie chart analysis on company market share, 2021(%)
- Total number of companies covered
Methodology
For the Global System in Package (Sip) Technology Market, our research methodology involved a mixture of primary and secondary data sources. Key steps involved in the research process are listed below:
1. Information Procurement: This stage involved the procurement of Market data or related information via primary and secondary sources. The various secondary sources used included various company websites, annual reports, trade databases, and paid databases such as Hoover's, Bloomberg Business, Factiva, and Avention. Our team did 45 primary interactions Globally which included several stakeholders such as manufacturers, customers, key opinion leaders, etc. Overall, information procurement was one of the most extensive stages in our research process.
2. Information Analysis: This step involved triangulation of data through bottom-up and top-down approaches to estimate and validate the total size and future estimate of the Global System in Package (Sip) Technology Market.
3. Report Formulation: The final step entailed the placement of data points in appropriate Market spaces in an attempt to deduce viable conclusions.
4. Validation & Publishing: Validation is the most important step in the process. Validation & re-validation via an intricately designed process helped us finalize data points to be used for final calculations. The final Market estimates and forecasts were then aligned and sent to our panel of industry experts for validation of data. Once the validation was done the report was sent to our Quality Assurance team to ensure adherence to style guides, consistency & design.
Analyst Support
Customization Options
With the given market data, our dedicated team of analysts can offer you the following customization options are available for the Global System in Package (Sip) Technology Market:
Product Analysis: Product matrix, which offers a detailed comparison of the product portfolio of companies.
Regional Analysis: Further analysis of the Global System in Package (Sip) Technology Market for additional countries.
Competitive Analysis: Detailed analysis and profiling of additional Market players & comparative analysis of competitive products.
Go to Market Strategy: Find the high-growth channels to invest your marketing efforts and increase your customer base.
Innovation Mapping: Identify racial solutions and innovation, connected to deep ecosystems of innovators, start-ups, academics, and strategic partners.
Category Intelligence: Customized intelligence that is relevant to their supply Markets will enable them to make smarter sourcing decisions and improve their category management.
Public Company Transcript Analysis: To improve the investment performance by generating new alpha and making better-informed decisions.
Social Media Listening: To analyze the conversations and trends happening not just around your brand, but around your industry as a whole, and use those insights to make better Marketing decisions.
Global System in Package (Sip) Technology Market Report Snapshots
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