Global Electronic Packaging Market

Electronic Packaging Market Size, Share, Growth Analysis, By Type Sub-SegmentsCorrugated Boxes, Paperboard Boxes, Thermoformed Trays, Bags and Pouches, Blister packs and Clamshell, and Protective Packaging(Plastic, Metal), By Material(Semiconductor & IC, PCB), By Application(Consumer Electronics, Aerospace & Defense), By End-User(Electronic Article Surveillance (EAS), and Radio-frequency Identification) - Industry Forecast 2024-2031


Report ID: SQMIG15F2168 | Region: Global | Published Date: March, 2024
Pages: 184 | Tables: 119 | Figures: 72

Electronic Packaging Market Insights

Global Electronic Packaging Market size was valued at USD 1.46 billion in 2022 and is poised to grow from USD 1.72 billion in 2023 to USD 9.04 billion by 2031, growing at a CAGR of 18.03% in the forecast period (2024-2031).

The rise of IoT and AI and the proliferation of complex electronics are driving the higher applications in the consumer electronics and automotive industries and due to these factors, electronic packaging is being adopted more advanced technology has been adopted to meet the demand. Additionally, Amcor Technology partnered with Samsung Electronics to develop the state-of-the-art H-Cube solution. Samsung Electronics announced the development of Hybrid-Substrate Cube technology, its modern 2.5D packaging solution built expressly for semiconductors for HPC, AI, data center, and network devices requiring high performance and large area packaging technologies.

Since then, the global market has undergone a transition to the 5th generation of wi-fi, 802.11ac with MIMO. A growing number of customers are likely to adopt the technology due to speeds up to 1.3 GHz over long distances, driving demand.

Recent developments in the market include innovative, unique, vibrant and memorable designs with minimal aesthetics driving the market growth. In February 2022, the Smurfit Kappa Group announced a $33 million expansion of its Brazilian facility. This will help the company expand its portfolio of home packaging, fresh produce and shelf-ready pharmaceuticals. Furthermore, the automotive industry accounts for the largest segment of the market studied, mainly due to the increasing adoption of electric vehicles (EVs) and hybrid vehicles as electric and hybrid vehicles use large amounts of memory devices. processors, analog circuits, discrete power devices are used therefore and sensors. The demand is expected to grow rapidly over the forecast period.

According to the IBEF, the Indian electric vehicle (EV) market is expected to reach Rs 50,000 crore (US$7.09 billion (about $22 per person in the US)) by 2025. Moreover, a study by the Center for Energy Finance CEEW sees opportunities in India of $206 billion for electric vehicles by 2030. Such developments are electronic packaging. It will continue to grow its market.

 

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FAQs

Electronic Packaging Market size was valued at USD 1.46 billion in 2022 and is poised to grow from USD 1.72 billion in 2023 to USD 9.04 billion by 2031, growing at a CAGR of 18.03% in the forecast period (2024-2031).

The competitive environment of the Electronic Packaging Market is dynamic and characterized by the presence of a mix of well-established brands, emerging players, and niche producers. Innovation is a key competitive factor. The market competitive landscape provides detailed information from competitors. Detailed information includes company overview, company financials, earnings, market potential, investment in research and development, new market strategy, presence, manufacturing regions and locations of production, manufacturing capacity, company strengths and weaknesses, product launches, product expansion and expansion, application authority. 'STATS ChipPAC Pte. Ltd. (Singapore)', 'Samsung Electronics Co., Ltd. (South Korea)', 'UTAC Holdings Ltd. (Singapore)', 'ChipMOS Technologies Inc. (Taiwan)', 'Intel Corporation (United States)', 'Advanced Semiconductor Engineering, Inc. (Taiwan)', 'Siliconware Precision Industries Co., Ltd. (Taiwan)', 'Jiangsu Changjiang Electronics Technology (China)', 'Powertech Technology Inc. (Taiwan)', 'Amkor Technology, Inc. (United States)', 'STATS ChipPAC Pte. Ltd. (Singapore)', 'Samsung Electronics Co., Ltd. (South Korea)', 'Tongfu Microelectronics Co., Ltd. (China)', 'Unisem Group (Malaysia)', 'Nepes Corporation (South Korea)'

Rising Advances in Miniaturization

According to the National Investment Promotion and Facilitation Agency (NIPFA), the demand for electronics in India has surged. The electronics sector is expected to reach USS 220 billion by 2025 due to strong regulatory support, capital flows from mass participation and increasing demand for electronic products. Significant growth in domestic demand, technological development and high-quality products have been the major drivers for China’s industrial growth Such a large production of paper and paper in China creates a favorable environment for the sale of electronic products packaging of materials.

North America is the dominating region in the electronic packaging market, with a CAGR of more than 10% during the forecast period. The regional growth is driven by increasing demand for semiconductor equipment in the automotive, industrial and healthcare industries. North America, particularly California’s Silicon Valley, is a hub for technological innovation and research. Many major semiconductor companies, electronics manufacturers and research institutes are headquartered or have a large presence in the region. This drives advances in electronic packaging technology, enabling improvements such as miniaturization, higher component density and improved thermal management.

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Global Electronic Packaging Market

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