Thermally Conductive Filler Dispersants Market

Thermally Conductive Filler Dispersants Market Size, Share, Growth Analysis, By K(Shin-Etsu Chemical, Dow Chemical Company) - Industry Forecast 2024-2031


Report ID: UCMIG20D2154 | Region: Global | Published Date: Upcoming |
Pages: 165 | Tables: 55 | Figures: 60

Thermally Conductive Filler Dispersants Market Insights

Market Overview:

The size of the global market for thermally conductive filler dispersants is anticipated to increase by 10.2% CAGR from 2023 to 2028, from USD 0.3 billion. Growing demand for electronics items is one of the main factors driving the market for thermally conductive filler dispersants. In order to improve the thermal conductivity and mechanical properties of thermal interface materials (TIMs) application, it is essential to be able to manage the dispersion of thermally conductive fillers.

Thermally Conductive Filler Dispersants Market, Forecast & Y-O-Y Growth Rate, 2020 - 2028
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This report is being written to illustrate the market opportunity by region and by segments, indicating opportunity areas for the vendors to tap upon. To estimate the opportunity, it was very important to understand the current market scenario and the way it will grow in future.

Production and consumption patterns are being carefully compared to forecast the market. Other factors considered to forecast the market are the growth of the adjacent market, revenue growth of the key market vendors, scenario-based analysis, and market segment growth.

The market size was determined by estimating the market through a top-down and bottom-up approach, which was further validated with industry interviews. Considering the nature of the market we derived the Electrical Components & Equipment by segment aggregation, the contribution of the Electrical Components & Equipment in Capital Goods and vendor share.

To determine the growth of the market factors such as drivers, trends, restraints, and opportunities were identified, and the impact of these factors was analyzed to determine the market growth. To understand the market growth in detail, we have analyzed the year-on-year growth of the market. Also, historic growth rates were compared to determine growth patterns.

Segmentation Analysis:

The Thermally Conductive Filler Dispersants Market is segmented by K. We are analyzing the market of these segments to identify which segment is the largest now and in the future, which segment has the highest growth rate, and the segment which offers the opportunity in the future.

Thermally Conductive Filler Dispersants Market Basis Point Share Analysis, 2021 Vs. 2028
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  • Based on K the market is segmented as, Shin-Etsu Chemical, Dow Chemical Company, JNC Corporation, Momentive Performance Materials, Kusumoto Chemicals, Evonik, Croda International, Lubrizol Corporation, Wacker Chemie

Regional Analysis:

Thermally Conductive Filler Dispersants Market is being analyzed by North America, Europe, Asia-Pacific (APAC), Latin America (LATAM), Middle East & Africa (MEA) regions. Key countries including the U.S., Canada, Germany, France, UK, Italy, Spain, China, India, Japan, Brazil, GCC Countries, and South Africa among others were analyzed considering various micro and macro trends.

Thermally Conductive Filler Dispersants Market Attractiveness Analysis, By Region 2020-2028
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Thermally Conductive Filler Dispersants Market : Risk Analysis

SkyQuest's expert analysts have conducted a risk analysis to understand the impact of external extremities on Thermally Conductive Filler Dispersants Market. We analyzed how geopolitical influence, natural disasters, climate change, legal scenario, economic impact, trade & economic policies, social & ethnic concerns, and demographic changes might affect Thermally Conductive Filler Dispersants Market's supply chain, distribution, and total revenue growth.

Competitive landscaping:

To understand the competitive landscape, we are analyzing key Thermally Conductive Filler Dispersants Market vendors in the market. To understand the competitive rivalry, we are comparing the revenue, expenses, resources, product portfolio, region coverage, market share, key initiatives, product launches, and any news related to the Thermally Conductive Filler Dispersants Market.

To validate our hypothesis and validate our findings on the market ecosystem, we are also conducting a detailed porter's five forces analysis. Competitive Rivalry, Supplier Power, Buyer Power, Threat of Substitution, and Threat of New Entry each force is analyzed by various parameters governing those forces.

Key Players Covered in the Report:

  • thermally conductive filler dispersants market size is projected to reach USD 0.4 billion by 2028 from USD 0.3 billion in 2023, at a CAGR of 10.2% during the forecast period. The growth of the global thermally conductive filler dispersants market can be attributed to the increasing demand for high-performance and lightweight products. Thermally conductive filler dispersants play a crucial role in achieving the desired thermal properties in these high-performance products. Additionally, ongoing research and development activities aimed at improving the thermal conductivity of polymer composites drive the demand for thermally conductive filler dispersants.
  • Thermally Conductive Filler Dispersants Market Dynamics
  • Driver: Increasing demand for consumer electronics products
  • Consumer electronics, such as smartphones, tablets, laptops, and gaming consoles, generate significant amounts of heat during operation. Efficient heat dissipation is crucial to ensure the optimal performance and longevity of these devices. Thermally conductive filler dispersants play a vital role in enhancing the thermal conductivity of polymer composites used in electronic components and heat sinks. Effective heat dissipation through the use of thermally conductive filler dispersants helps to prevent overheating, which can lead to performance degradation and reduced reliability of electronic components.
  • Restraint: Higher cost consideration
  • Cost is a significant factor that impacts on the thermally conductive filler dispersants market. The cost of thermally conductive filler dispersants can be a restraint for some applications. Certain high-performance fillers, such as silver or graphene, can be expensive, which can increase the overall cost of the thermally conductive polymer composites. The cost of high-performance fillers like silver or graphene is influenced by factors such as production methods, availability, and demand. These fillers often require specialized manufacturing processes and have limited availability, which can drive up their cost. Additionally, the demand for these high-performance fillers in various industries, including electronics and automotive, can further contribute to their higher price.
  • Opportunity: Increasing demand for fuel-efficient and high-end home appliance products
  • The demand for high-performance and lightweight products is driving the growth of the thermally conductive polymer composites market. Thermally conductive filler dispersants play a crucial role in achieving the desired thermal properties in these high-performance products. Polymer-based thermal interface materials consisting of polymer and thermally conductive fillers occupy the most commercial markets because of their thermal conductivity and mechanical properties. Thermally conductive filler dispersants play a crucial role in achieving optimal thermal conductivity in these materials. In addition, the demand for fuel-efficient products is driving the development of high-thermal-conductivity fillers such as aluminum nitride for use in polymer/ceramic composites. These fillers can be used in conjunction with thermally conductive filler dispersants to achieve optimal thermal conductivity.
  • Challenges: Compatibility with different polymers
  • Thermally conductive filler dispersants need to be compatible with a wide range of polymer matrices to ensure effective dispersion and interfacial interaction. Achieving compatibility with different polymers can be a challenge due to differences in chemical composition and processing conditions. The interfacial compatibility between fillers and the polymer matrix is crucial for effective dispersion and interfacial interaction, which ultimately affects the heat transfer efficiency of the composites. Surface modification techniques can be employed to improve the interface compatibility, but their effectiveness in improving overall thermal conductivity is limited. The thermal conductivity of polymer composites with dispersed fillers is influenced by several factors, including filler type, size, and aspect ratios. These factors need to be considered when selecting the appropriate thermally conductive filler dispersants for different polymer matrices. In addition, the quality of dispersion plays a significant role in achieving compatibility between fillers and polymers. For a single polymer, the dispersion quality may influence the outcome with the same filler.
  • By dispersant type, non-silicone is the largest in thermally conductive filler dispersants market, in 2022.
  • The rising demand for non-silicone thermally conductive filler dispersants is driven by their compatibility with different polymers, form-in-place gap fillers, enhanced thermal conductivity, high thermal conductivity paste, and improved mechanical properties. These advantages make non-silicone thermally conductive filler dispersants a preferred choice for various industries, including electronics, automotive, healthcare, aerospace, and telecommunication.
  • By filler material, carbon-based are the second largest in thermally conductive filler dispersants market, in 2022.
  • Carbon-based fillers, such as carbon black, carbon fibers, synthetic graphite particles, and carbon nanotubes, exhibit high thermal conductivity. This makes them attractive for enhancing the thermal conductivity of polymer composites. Carbon-based fillers, particularly carbon fibers, offer a high strength-to-weight ratio, making them suitable for applications where weight reduction is important. In addition, surface modification techniques can be employed to enhance the interfacial compatibility between carbon-based fillers and the polymer matrix, improving dispersion and interfacial interaction. All these factors contribute to the growth of carbon-based filler materials in the thermally conductive filler dispersants market.
  • By application, heat dissipation accounts for the largest share in the thermally conductive filler dispersants market, in 2022.
  • In general, higher filler loadings are needed to achieve higher thermal conductivity in pastes used for heat transfer applications. This highlights the importance of thermally conductive filler dispersants in achieving efficient heat dissipation. High thermal conductivity pastes, which serve as heat transfer means for cooling electronic components like VLSI chips, rely on thermally conductive filler dispersants to enhance their thermal conductivity. Adding high thermal conductivity fillers into polymer matrices is an effective way to improve the heat transfer performance of polymer materials. Thermally conductive filler dispersants facilitate the dispersion and interaction of these fillers, contributing to enhanced heat dissipation.
  • By end-use industry, electronics is the largest in thermally conductive filler dispersants market, in 2022.
  • Electronics is the largest end-use segment. TIMs are commonly used for transferring thermal conductivity from the CPU or GPU to heat sink coolers. Electronic products such as CPUs, chipsets, graphics cards, and hard disk drives, are susceptible to failure in case of overheating. Thermally conductive filler dispersants for TIMs are used in computers to remove the excess heat to maintain the components operating temperature limits. They are used in computers to optimize performance and reliability for smooth functioning. They are used for improving the heat flow in computers by filling voids or irregularities between the heat sink and SSE base plate mounting surfaces. The increased demand for electronic products is driving the market for thermally conductive filler dispersants.
  • Asia Pacific is projected to be fastest growing amongst other regions in the thermally conductive filler dispersants market, in terms of value.
  • Based on the region, the thermally conductive filler dispersants market is segmented into Asia Pacific, North America, Europe, South America, and the Middle East & Africa. Currently, Asia Pacific is the fastest growing market for thermally conductive filler dispersants. The region has a large and growing population with increasing disposable income, a rising awareness of health and wellness, and the expanding middle-class population and changing lifestyles have led to a surge in demand for electronic products, and electric vehicles. Additionally, advancements in technologies and increased R&D activities in the thermally conductive filler dispersants market have further fueled the growth of the market in Asia Pacific.
  • Recent Developments
  • In December 2019, the specialty chemicals group ALTANA acquired Schmid Rhyner AG, a Swiss overprint varnish specialist to generate value-creating growth through targeted acquisitions. The acquisition helped ALTANA ALTANA to expand its product portfolio and offer new solutions to its customers in various industries.
  • In October 2022, BYK launched BYK-MAX CT 4275, is a specially developed additives that can be used in a wide variety of polyamides and thermoplastic. BYK-MAX CT 4275 is used to enhance the performance of thermal interface materials by improving the dispersion and incorporation of the additive into the thermoplastic matrix, resulting in improved thermal conductivity and mechanical properties.
  • In April 2022, Shin-Etsu Co. Ltd. developed thermal interface silicone rubber sheet series (TC-BGI Series) for use in components of electric vehicles as the technology for high voltage devices advances. It is a hard, thermal-interface silicone rubber sheet that combines good levels of voltage resistance and heat dissipation.
  • In January 2021, Momentive Performance Materials acquired KCC Corporation's Silicones business in Korea and the UK, as well as its sales operations in China. KCC Corporation offers silicone and silicone-based products. The acquisition strengthens Momentive's global capabilities in advanced silicones and enhances its ability to serve customers in the Asia-Pacific region.
  • In February 2023, Evonik Industries invested USD 1 miilion into fumed aluminum oxide production plant expansion for battery applications in Yokkaichi, Japan. The investment helped Evonik Industries to meet the growing demand for fumed aluminum oxide in the battery industry and strengthen its position in the market. It also expanded Evonik's presence in Asia, where the demand for lithium-ion batteries was high.
  • KEY MARKET SEGMENTS
  • On the basis of dispersant type
  • Silicone-based
  • Non-silicone based
  • Others
  • On the basis of filler material
  • Ceramic
  • Metal
  • Carbon-based
  • Others
  • On the basis of application
  • Thermal Insulation Glue
  • Potting Glue
  • Plastic
  • Rubber
  • Heat Dissipation Ceramic
  • Coatings
  • Others
  • On the basis of the end-use industry
  • Electronics
  • Automotive
  • Energy
  • Building & Construction
  • Industrial
  • Aerospace
  • Others
  • On the basis of region
  • North America
  • Asia Pacific
  • Europe
  • South America
  • Middle East & Africa
  • Key Market Players
  • BYK
  • Shin-Etsu Chemical
  • Dow Chemical Company
  • JNC Corporation
  • Momentive Performance Materials
  • Kusumoto Chemicals
  • Evonik
  • Croda International
  • Lubrizol Corporation
  • Wacker Chemie

SkyQuest's Expertise:

The Thermally Conductive Filler Dispersants Market is being analyzed by SkyQuest's analysts with the help of 20+ scheduled Primary interviews from both the demand and supply sides. We have already invested more than 250 hours on this report and are still refining our date to provide authenticated data to your readers and clients. Exhaustive primary and secondary research is conducted to collect information on the market, peer market, and parent market.

Our cross-industry experts and revenue-impact consultants at SkyQuest enable our clients to convert market intelligence into actionable, quantifiable results through personalized engagement.

Scope Of Report

Report Attribute Details
The base year for estimation 2021
Historical data 2016 – 2022
Forecast period 2022 – 2028
Report coverage Revenue forecast, volume forecast, company ranking, competitive landscape, growth factors, and trends, Pricing Analysis
Segments covered
  • By K - Shin-Etsu Chemical, Dow Chemical Company, JNC Corporation, Momentive Performance Materials, Kusumoto Chemicals, Evonik, Croda International, Lubrizol Corporation, Wacker Chemie
Regional scope North America, Europe, Asia-Pacific (APAC), Latin America (LATAM), Middle East & Africa (MEA)
Country scope U.S., Canada, Germany, France, UK, Italy, Spain, China, India, Japan, Brazil, GCC Countries, South Africa
Key companies profiled
  • thermally conductive filler dispersants market size is projected to reach USD 0.4 billion by 2028 from USD 0.3 billion in 2023, at a CAGR of 10.2% during the forecast period. The growth of the global thermally conductive filler dispersants market can be attributed to the increasing demand for high-performance and lightweight products. Thermally conductive filler dispersants play a crucial role in achieving the desired thermal properties in these high-performance products. Additionally, ongoing research and development activities aimed at improving the thermal conductivity of polymer composites drive the demand for thermally conductive filler dispersants.
  • Thermally Conductive Filler Dispersants Market Dynamics
  • Driver: Increasing demand for consumer electronics products
  • Consumer electronics, such as smartphones, tablets, laptops, and gaming consoles, generate significant amounts of heat during operation. Efficient heat dissipation is crucial to ensure the optimal performance and longevity of these devices. Thermally conductive filler dispersants play a vital role in enhancing the thermal conductivity of polymer composites used in electronic components and heat sinks. Effective heat dissipation through the use of thermally conductive filler dispersants helps to prevent overheating, which can lead to performance degradation and reduced reliability of electronic components.
  • Restraint: Higher cost consideration
  • Cost is a significant factor that impacts on the thermally conductive filler dispersants market. The cost of thermally conductive filler dispersants can be a restraint for some applications. Certain high-performance fillers, such as silver or graphene, can be expensive, which can increase the overall cost of the thermally conductive polymer composites. The cost of high-performance fillers like silver or graphene is influenced by factors such as production methods, availability, and demand. These fillers often require specialized manufacturing processes and have limited availability, which can drive up their cost. Additionally, the demand for these high-performance fillers in various industries, including electronics and automotive, can further contribute to their higher price.
  • Opportunity: Increasing demand for fuel-efficient and high-end home appliance products
  • The demand for high-performance and lightweight products is driving the growth of the thermally conductive polymer composites market. Thermally conductive filler dispersants play a crucial role in achieving the desired thermal properties in these high-performance products. Polymer-based thermal interface materials consisting of polymer and thermally conductive fillers occupy the most commercial markets because of their thermal conductivity and mechanical properties. Thermally conductive filler dispersants play a crucial role in achieving optimal thermal conductivity in these materials. In addition, the demand for fuel-efficient products is driving the development of high-thermal-conductivity fillers such as aluminum nitride for use in polymer/ceramic composites. These fillers can be used in conjunction with thermally conductive filler dispersants to achieve optimal thermal conductivity.
  • Challenges: Compatibility with different polymers
  • Thermally conductive filler dispersants need to be compatible with a wide range of polymer matrices to ensure effective dispersion and interfacial interaction. Achieving compatibility with different polymers can be a challenge due to differences in chemical composition and processing conditions. The interfacial compatibility between fillers and the polymer matrix is crucial for effective dispersion and interfacial interaction, which ultimately affects the heat transfer efficiency of the composites. Surface modification techniques can be employed to improve the interface compatibility, but their effectiveness in improving overall thermal conductivity is limited. The thermal conductivity of polymer composites with dispersed fillers is influenced by several factors, including filler type, size, and aspect ratios. These factors need to be considered when selecting the appropriate thermally conductive filler dispersants for different polymer matrices. In addition, the quality of dispersion plays a significant role in achieving compatibility between fillers and polymers. For a single polymer, the dispersion quality may influence the outcome with the same filler.
  • By dispersant type, non-silicone is the largest in thermally conductive filler dispersants market, in 2022.
  • The rising demand for non-silicone thermally conductive filler dispersants is driven by their compatibility with different polymers, form-in-place gap fillers, enhanced thermal conductivity, high thermal conductivity paste, and improved mechanical properties. These advantages make non-silicone thermally conductive filler dispersants a preferred choice for various industries, including electronics, automotive, healthcare, aerospace, and telecommunication.
  • By filler material, carbon-based are the second largest in thermally conductive filler dispersants market, in 2022.
  • Carbon-based fillers, such as carbon black, carbon fibers, synthetic graphite particles, and carbon nanotubes, exhibit high thermal conductivity. This makes them attractive for enhancing the thermal conductivity of polymer composites. Carbon-based fillers, particularly carbon fibers, offer a high strength-to-weight ratio, making them suitable for applications where weight reduction is important. In addition, surface modification techniques can be employed to enhance the interfacial compatibility between carbon-based fillers and the polymer matrix, improving dispersion and interfacial interaction. All these factors contribute to the growth of carbon-based filler materials in the thermally conductive filler dispersants market.
  • By application, heat dissipation accounts for the largest share in the thermally conductive filler dispersants market, in 2022.
  • In general, higher filler loadings are needed to achieve higher thermal conductivity in pastes used for heat transfer applications. This highlights the importance of thermally conductive filler dispersants in achieving efficient heat dissipation. High thermal conductivity pastes, which serve as heat transfer means for cooling electronic components like VLSI chips, rely on thermally conductive filler dispersants to enhance their thermal conductivity. Adding high thermal conductivity fillers into polymer matrices is an effective way to improve the heat transfer performance of polymer materials. Thermally conductive filler dispersants facilitate the dispersion and interaction of these fillers, contributing to enhanced heat dissipation.
  • By end-use industry, electronics is the largest in thermally conductive filler dispersants market, in 2022.
  • Electronics is the largest end-use segment. TIMs are commonly used for transferring thermal conductivity from the CPU or GPU to heat sink coolers. Electronic products such as CPUs, chipsets, graphics cards, and hard disk drives, are susceptible to failure in case of overheating. Thermally conductive filler dispersants for TIMs are used in computers to remove the excess heat to maintain the components operating temperature limits. They are used in computers to optimize performance and reliability for smooth functioning. They are used for improving the heat flow in computers by filling voids or irregularities between the heat sink and SSE base plate mounting surfaces. The increased demand for electronic products is driving the market for thermally conductive filler dispersants.
  • Asia Pacific is projected to be fastest growing amongst other regions in the thermally conductive filler dispersants market, in terms of value.
  • Based on the region, the thermally conductive filler dispersants market is segmented into Asia Pacific, North America, Europe, South America, and the Middle East & Africa. Currently, Asia Pacific is the fastest growing market for thermally conductive filler dispersants. The region has a large and growing population with increasing disposable income, a rising awareness of health and wellness, and the expanding middle-class population and changing lifestyles have led to a surge in demand for electronic products, and electric vehicles. Additionally, advancements in technologies and increased R&D activities in the thermally conductive filler dispersants market have further fueled the growth of the market in Asia Pacific.
  • Recent Developments
  • In December 2019, the specialty chemicals group ALTANA acquired Schmid Rhyner AG, a Swiss overprint varnish specialist to generate value-creating growth through targeted acquisitions. The acquisition helped ALTANA ALTANA to expand its product portfolio and offer new solutions to its customers in various industries.
  • In October 2022, BYK launched BYK-MAX CT 4275, is a specially developed additives that can be used in a wide variety of polyamides and thermoplastic. BYK-MAX CT 4275 is used to enhance the performance of thermal interface materials by improving the dispersion and incorporation of the additive into the thermoplastic matrix, resulting in improved thermal conductivity and mechanical properties.
  • In April 2022, Shin-Etsu Co. Ltd. developed thermal interface silicone rubber sheet series (TC-BGI Series) for use in components of electric vehicles as the technology for high voltage devices advances. It is a hard, thermal-interface silicone rubber sheet that combines good levels of voltage resistance and heat dissipation.
  • In January 2021, Momentive Performance Materials acquired KCC Corporation's Silicones business in Korea and the UK, as well as its sales operations in China. KCC Corporation offers silicone and silicone-based products. The acquisition strengthens Momentive's global capabilities in advanced silicones and enhances its ability to serve customers in the Asia-Pacific region.
  • In February 2023, Evonik Industries invested USD 1 miilion into fumed aluminum oxide production plant expansion for battery applications in Yokkaichi, Japan. The investment helped Evonik Industries to meet the growing demand for fumed aluminum oxide in the battery industry and strengthen its position in the market. It also expanded Evonik's presence in Asia, where the demand for lithium-ion batteries was high.
  • KEY MARKET SEGMENTS
  • On the basis of dispersant type
  • Silicone-based
  • Non-silicone based
  • Others
  • On the basis of filler material
  • Ceramic
  • Metal
  • Carbon-based
  • Others
  • On the basis of application
  • Thermal Insulation Glue
  • Potting Glue
  • Plastic
  • Rubber
  • Heat Dissipation Ceramic
  • Coatings
  • Others
  • On the basis of the end-use industry
  • Electronics
  • Automotive
  • Energy
  • Building & Construction
  • Industrial
  • Aerospace
  • Others
  • On the basis of region
  • North America
  • Asia Pacific
  • Europe
  • South America
  • Middle East & Africa
  • Key Market Players
  • BYK
  • Shin-Etsu Chemical
  • Dow Chemical Company
  • JNC Corporation
  • Momentive Performance Materials
  • Kusumoto Chemicals
  • Evonik
  • Croda International
  • Lubrizol Corporation
  • Wacker Chemie
Customization scope Free report customization (15% Free customization) with purchase. Addition or alteration to country, regional & segment scope.
Pricing and purchase options Reap the benefits of customized purchase options to fit your specific research requirements.

Objectives of the Study

  • To forecast the market size, in terms of value, for various segments with respect to five main regions, namely, North America, Europe, Asia-Pacific (APAC), Latin America (LATAM), Middle East & Africa (MEA)
  • To provide detailed information regarding the major factors influencing the growth of the Market (drivers, restraints, opportunities, and challenges)
  • To strategically analyze the micro markets with respect to the individual growth trends, future prospects, and contribution to the total market
  • To provide a detailed overview of the value chain and analyze market trends with the Porter's five forces analysis
  • To analyze the opportunities in the market for various stakeholders by identifying the high-growth Segments
  • To identify the key players and comprehensively analyze their market position in terms of ranking and core competencies, along with detailing the competitive landscape for the market leaders
  • To analyze competitive development such as joint ventures, mergers and acquisitions, new product launches and development, and research and development in the market

What does this Report Deliver?

  • Market Estimation for 20+ Countries
  • Historical data coverage: 2016 to 2022
  • Growth projections: 2022 to 2028
  • SkyQuest's premium market insights: Innovation matrix, IP analysis, Production Analysis, Value chain analysis, Technological trends, and Trade analysis
  • Customization on Segments, Regions, and Company Profiles
  • 100+ tables, 150+ Figures, 10+ matrix
  • Global and Country Market Trends
  • Comprehensive Mapping of Industry Parameters
  • Attractive Investment Proposition
  • Competitive Strategies Adopted by Leading Market Participants
  • Market drivers, restraints, opportunities, and its impact on the market
  • Regulatory scenario, regional dynamics, and insights of leading countries in each region
  • Segment trends analysis, opportunity, and growth
  • Opportunity analysis by region and country
  • Porter's five force analysis to know the market's condition
  • Pricing analysis
  • Parent market analysis
  • Product portfolio benchmarking

Table Of Content

Executive Summary

Market overview

  • Exhibit: Executive Summary – Chart on Market Overview
  • Exhibit: Executive Summary – Data Table on Market Overview
  • Exhibit: Executive Summary – Chart on Thermally Conductive Filler Dispersants Market Characteristics
  • Exhibit: Executive Summary – Chart on Market by Geography
  • Exhibit: Executive Summary – Chart on Market Segmentation
  • Exhibit: Executive Summary – Chart on Incremental Growth
  • Exhibit: Executive Summary – Data Table on Incremental Growth
  • Exhibit: Executive Summary – Chart on Vendor Market Positioning

Parent Market Analysis

Market overview

Market size

  • Market Dynamics
    • Exhibit: Impact analysis of DROC, 2021
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
  • SWOT Analysis

KEY MARKET INSIGHTS

  • Technology Analysis
    • (Exhibit: Data Table: Name of technology and details)
  • Pricing Analysis
    • (Exhibit: Data Table: Name of technology and pricing details)
  • Supply Chain Analysis
    • (Exhibit: Detailed Supply Chain Presentation)
  • Value Chain Analysis
    • (Exhibit: Detailed Value Chain Presentation)
  • Ecosystem Of the Market
    • Exhibit: Parent Market Ecosystem Market Analysis
    • Exhibit: Market Characteristics of Parent Market
  • IP Analysis
    • (Exhibit: Data Table: Name of product/technology, patents filed, inventor/company name, acquiring firm)
  • Trade Analysis
    • (Exhibit: Data Table: Import and Export data details)
  • Startup Analysis
    • (Exhibit: Data Table: Emerging startups details)
  • Raw Material Analysis
    • (Exhibit: Data Table: Mapping of key raw materials)
  • Innovation Matrix
    • (Exhibit: Positioning Matrix: Mapping of new and existing technologies)
  • Pipeline product Analysis
    • (Exhibit: Data Table: Name of companies and pipeline products, regional mapping)
  • Macroeconomic Indicators

COVID IMPACT

  • Introduction
  • Impact On Economy—scenario Assessment
    • Exhibit: Data on GDP - Year-over-year growth 2016-2022 (%)
  • Revised Market Size
    • Exhibit: Data Table on Thermally Conductive Filler Dispersants Market size and forecast 2021-2027 ($ million)
  • Impact Of COVID On Key Segments
    • Exhibit: Data Table on Segment Market size and forecast 2021-2027 ($ million)
  • COVID Strategies By Company
    • Exhibit: Analysis on key strategies adopted by companies

MARKET DYNAMICS & OUTLOOK

  • Market Dynamics
    • Exhibit: Impact analysis of DROC, 2021
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
  • Regulatory Landscape
    • Exhibit: Data Table on regulation from different region
  • SWOT Analysis
  • Porters Analysis
    • Competitive rivalry
      • Exhibit: Competitive rivalry Impact of key factors, 2021
    • Threat of substitute products
      • Exhibit: Threat of Substitute Products Impact of key factors, 2021
    • Bargaining power of buyers
      • Exhibit: buyers bargaining power Impact of key factors, 2021
    • Threat of new entrants
      • Exhibit: Threat of new entrants Impact of key factors, 2021
    • Bargaining power of suppliers
      • Exhibit: Threat of suppliers bargaining power Impact of key factors, 2021
  • Skyquest special insights on future disruptions
    • Political Impact
    • Economic impact
    • Social Impact
    • Technical Impact
    • Environmental Impact
    • Legal Impact

Market Size by Region

  • Chart on Market share by geography 2021-2027 (%)
  • Data Table on Market share by geography 2021-2027(%)
  • North America
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • USA
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Canada
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Europe
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • Germany
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Spain
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • France
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • UK
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of Europe
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Asia Pacific
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • China
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • India
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Japan
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • South Korea
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of Asia Pacific
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Latin America
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • Brazil
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of South America
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Middle East & Africa (MEA)
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • GCC Countries
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • South Africa
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of MEA
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)

KEY COMPANY PROFILES

  • Competitive Landscape
    • Total number of companies covered
      • Exhibit: companies covered in the report, 2021
    • Top companies market positioning
      • Exhibit: company positioning matrix, 2021
    • Top companies market Share
      • Exhibit: Pie chart analysis on company market share, 2021(%)
  • thermally conductive filler dispersants market size is projected to reach USD 0.4 billion by 2028 from USD 0.3 billion in 2023, at a CAGR of 10.2% during the forecast period. The growth of the global thermally conductive filler dispersants market can be attributed to the increasing demand for high-performance and lightweight products. Thermally conductive filler dispersants play a crucial role in achieving the desired thermal properties in these high-performance products. Additionally, ongoing research and development activities aimed at improving the thermal conductivity of polymer composites drive the demand for thermally conductive filler dispersants.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Thermally Conductive Filler Dispersants Market Dynamics
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Driver: Increasing demand for consumer electronics products
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Consumer electronics, such as smartphones, tablets, laptops, and gaming consoles, generate significant amounts of heat during operation. Efficient heat dissipation is crucial to ensure the optimal performance and longevity of these devices. Thermally conductive filler dispersants play a vital role in enhancing the thermal conductivity of polymer composites used in electronic components and heat sinks. Effective heat dissipation through the use of thermally conductive filler dispersants helps to prevent overheating, which can lead to performance degradation and reduced reliability of electronic components.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Restraint: Higher cost consideration
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Cost is a significant factor that impacts on the thermally conductive filler dispersants market. The cost of thermally conductive filler dispersants can be a restraint for some applications. Certain high-performance fillers, such as silver or graphene, can be expensive, which can increase the overall cost of the thermally conductive polymer composites. The cost of high-performance fillers like silver or graphene is influenced by factors such as production methods, availability, and demand. These fillers often require specialized manufacturing processes and have limited availability, which can drive up their cost. Additionally, the demand for these high-performance fillers in various industries, including electronics and automotive, can further contribute to their higher price.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Opportunity: Increasing demand for fuel-efficient and high-end home appliance products
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • The demand for high-performance and lightweight products is driving the growth of the thermally conductive polymer composites market. Thermally conductive filler dispersants play a crucial role in achieving the desired thermal properties in these high-performance products. Polymer-based thermal interface materials consisting of polymer and thermally conductive fillers occupy the most commercial markets because of their thermal conductivity and mechanical properties. Thermally conductive filler dispersants play a crucial role in achieving optimal thermal conductivity in these materials. In addition, the demand for fuel-efficient products is driving the development of high-thermal-conductivity fillers such as aluminum nitride for use in polymer/ceramic composites. These fillers can be used in conjunction with thermally conductive filler dispersants to achieve optimal thermal conductivity.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Challenges: Compatibility with different polymers
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Thermally conductive filler dispersants need to be compatible with a wide range of polymer matrices to ensure effective dispersion and interfacial interaction. Achieving compatibility with different polymers can be a challenge due to differences in chemical composition and processing conditions. The interfacial compatibility between fillers and the polymer matrix is crucial for effective dispersion and interfacial interaction, which ultimately affects the heat transfer efficiency of the composites. Surface modification techniques can be employed to improve the interface compatibility, but their effectiveness in improving overall thermal conductivity is limited. The thermal conductivity of polymer composites with dispersed fillers is influenced by several factors, including filler type, size, and aspect ratios. These factors need to be considered when selecting the appropriate thermally conductive filler dispersants for different polymer matrices. In addition, the quality of dispersion plays a significant role in achieving compatibility between fillers and polymers. For a single polymer, the dispersion quality may influence the outcome with the same filler.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • By dispersant type, non-silicone is the largest in thermally conductive filler dispersants market, in 2022.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • The rising demand for non-silicone thermally conductive filler dispersants is driven by their compatibility with different polymers, form-in-place gap fillers, enhanced thermal conductivity, high thermal conductivity paste, and improved mechanical properties. These advantages make non-silicone thermally conductive filler dispersants a preferred choice for various industries, including electronics, automotive, healthcare, aerospace, and telecommunication.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • By filler material, carbon-based are the second largest in thermally conductive filler dispersants market, in 2022.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Carbon-based fillers, such as carbon black, carbon fibers, synthetic graphite particles, and carbon nanotubes, exhibit high thermal conductivity. This makes them attractive for enhancing the thermal conductivity of polymer composites. Carbon-based fillers, particularly carbon fibers, offer a high strength-to-weight ratio, making them suitable for applications where weight reduction is important. In addition, surface modification techniques can be employed to enhance the interfacial compatibility between carbon-based fillers and the polymer matrix, improving dispersion and interfacial interaction. All these factors contribute to the growth of carbon-based filler materials in the thermally conductive filler dispersants market.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • By application, heat dissipation accounts for the largest share in the thermally conductive filler dispersants market, in 2022.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • In general, higher filler loadings are needed to achieve higher thermal conductivity in pastes used for heat transfer applications. This highlights the importance of thermally conductive filler dispersants in achieving efficient heat dissipation. High thermal conductivity pastes, which serve as heat transfer means for cooling electronic components like VLSI chips, rely on thermally conductive filler dispersants to enhance their thermal conductivity. Adding high thermal conductivity fillers into polymer matrices is an effective way to improve the heat transfer performance of polymer materials. Thermally conductive filler dispersants facilitate the dispersion and interaction of these fillers, contributing to enhanced heat dissipation.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • By end-use industry, electronics is the largest in thermally conductive filler dispersants market, in 2022.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Electronics is the largest end-use segment. TIMs are commonly used for transferring thermal conductivity from the CPU or GPU to heat sink coolers. Electronic products such as CPUs, chipsets, graphics cards, and hard disk drives, are susceptible to failure in case of overheating. Thermally conductive filler dispersants for TIMs are used in computers to remove the excess heat to maintain the components operating temperature limits. They are used in computers to optimize performance and reliability for smooth functioning. They are used for improving the heat flow in computers by filling voids or irregularities between the heat sink and SSE base plate mounting surfaces. The increased demand for electronic products is driving the market for thermally conductive filler dispersants.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Asia Pacific is projected to be fastest growing amongst other regions in the thermally conductive filler dispersants market, in terms of value.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Based on the region, the thermally conductive filler dispersants market is segmented into Asia Pacific, North America, Europe, South America, and the Middle East & Africa. Currently, Asia Pacific is the fastest growing market for thermally conductive filler dispersants. The region has a large and growing population with increasing disposable income, a rising awareness of health and wellness, and the expanding middle-class population and changing lifestyles have led to a surge in demand for electronic products, and electric vehicles. Additionally, advancements in technologies and increased R&D activities in the thermally conductive filler dispersants market have further fueled the growth of the market in Asia Pacific.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Recent Developments
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • In December 2019, the specialty chemicals group ALTANA acquired Schmid Rhyner AG, a Swiss overprint varnish specialist to generate value-creating growth through targeted acquisitions. The acquisition helped ALTANA ALTANA to expand its product portfolio and offer new solutions to its customers in various industries.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • In October 2022, BYK launched BYK-MAX CT 4275, is a specially developed additives that can be used in a wide variety of polyamides and thermoplastic. BYK-MAX CT 4275 is used to enhance the performance of thermal interface materials by improving the dispersion and incorporation of the additive into the thermoplastic matrix, resulting in improved thermal conductivity and mechanical properties.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • In April 2022, Shin-Etsu Co. Ltd. developed thermal interface silicone rubber sheet series (TC-BGI Series) for use in components of electric vehicles as the technology for high voltage devices advances. It is a hard, thermal-interface silicone rubber sheet that combines good levels of voltage resistance and heat dissipation.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • In January 2021, Momentive Performance Materials acquired KCC Corporation's Silicones business in Korea and the UK, as well as its sales operations in China. KCC Corporation offers silicone and silicone-based products. The acquisition strengthens Momentive's global capabilities in advanced silicones and enhances its ability to serve customers in the Asia-Pacific region.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • In February 2023, Evonik Industries invested USD 1 miilion into fumed aluminum oxide production plant expansion for battery applications in Yokkaichi, Japan. The investment helped Evonik Industries to meet the growing demand for fumed aluminum oxide in the battery industry and strengthen its position in the market. It also expanded Evonik's presence in Asia, where the demand for lithium-ion batteries was high.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • KEY MARKET SEGMENTS
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • On the basis of dispersant type
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Silicone-based
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Non-silicone based
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Others
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • On the basis of filler material
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Ceramic
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Metal
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Carbon-based
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Others
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • On the basis of application
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Thermal Insulation Glue
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Potting Glue
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Plastic
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Rubber
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Heat Dissipation Ceramic
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Coatings
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Others
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • On the basis of the end-use industry
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Electronics
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Automotive
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Energy
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Building & Construction
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Industrial
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Aerospace
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Others
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • On the basis of region
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • North America
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Asia Pacific
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Europe
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • South America
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Middle East & Africa
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Key Market Players
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • BYK
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Shin-Etsu Chemical
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Dow Chemical Company
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • JNC Corporation
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Momentive Performance Materials
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Kusumoto Chemicals
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Evonik
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Croda International
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Lubrizol Corporation
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Wacker Chemie
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments

Methodology

For the Thermally Conductive Filler Dispersants Market, our research methodology involved a mixture of primary and secondary data sources. Key steps involved in the research process are listed below:

1. Information Procurement: This stage involved the procurement of Market data or related information via primary and secondary sources. The various secondary sources used included various company websites, annual reports, trade databases, and paid databases such as Hoover's, Bloomberg Business, Factiva, and Avention. Our team did 45 primary interactions Globally which included several stakeholders such as manufacturers, customers, key opinion leaders, etc. Overall, information procurement was one of the most extensive stages in our research process.

2. Information Analysis: This step involved triangulation of data through bottom-up and top-down approaches to estimate and validate the total size and future estimate of the Thermally Conductive Filler Dispersants Market.

3. Report Formulation: The final step entailed the placement of data points in appropriate Market spaces in an attempt to deduce viable conclusions.

4. Validation & Publishing: Validation is the most important step in the process. Validation & re-validation via an intricately designed process helped us finalize data points to be used for final calculations. The final Market estimates and forecasts were then aligned and sent to our panel of industry experts for validation of data. Once the validation was done the report was sent to our Quality Assurance team to ensure adherence to style guides, consistency & design.

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Customization Options

With the given market data, our dedicated team of analysts can offer you the following customization options are available for the Thermally Conductive Filler Dispersants Market:

Product Analysis: Product matrix, which offers a detailed comparison of the product portfolio of companies.

Regional Analysis: Further analysis of the Thermally Conductive Filler Dispersants Market for additional countries.

Competitive Analysis: Detailed analysis and profiling of additional Market players & comparative analysis of competitive products.

Go to Market Strategy: Find the high-growth channels to invest your marketing efforts and increase your customer base.

Innovation Mapping: Identify racial solutions and innovation, connected to deep ecosystems of innovators, start-ups, academics, and strategic partners.

Category Intelligence: Customized intelligence that is relevant to their supply Markets will enable them to make smarter sourcing decisions and improve their category management.

Public Company Transcript Analysis: To improve the investment performance by generating new alpha and making better-informed decisions.

Social Media Listening: To analyze the conversations and trends happening not just around your brand, but around your industry as a whole, and use those insights to make better Marketing decisions.

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FAQs

The global market for Thermally Conductive Filler Dispersants was estimated to be valued at US$ XX Mn in 2021.

The global Thermally Conductive Filler Dispersants Market is estimated to grow at a CAGR of XX% by 2028.

The global Thermally Conductive Filler Dispersants Market is segmented on the basis of K.

Based on region, the global Thermally Conductive Filler Dispersants Market is segmented into North America, Europe, Asia Pacific, Middle East & Africa and Latin America.

The key players operating in the global Thermally Conductive Filler Dispersants Market are thermally conductive filler dispersants market size is projected to reach USD 0.4 billion by 2028 from USD 0.3 billion in 2023, at a CAGR of 10.2% during the forecast period. The growth of the global thermally conductive filler dispersants market can be attributed to the increasing demand for high-performance and lightweight products. Thermally conductive filler dispersants play a crucial role in achieving the desired thermal properties in these high-performance products. Additionally, ongoing research and development activities aimed at improving the thermal conductivity of polymer composites drive the demand for thermally conductive filler dispersants. , Thermally Conductive Filler Dispersants Market Dynamics , Driver: Increasing demand for consumer electronics products , Consumer electronics, such as smartphones, tablets, laptops, and gaming consoles, generate significant amounts of heat during operation. Efficient heat dissipation is crucial to ensure the optimal performance and longevity of these devices. Thermally conductive filler dispersants play a vital role in enhancing the thermal conductivity of polymer composites used in electronic components and heat sinks. Effective heat dissipation through the use of thermally conductive filler dispersants helps to prevent overheating, which can lead to performance degradation and reduced reliability of electronic components. , Restraint: Higher cost consideration , Cost is a significant factor that impacts on the thermally conductive filler dispersants market. The cost of thermally conductive filler dispersants can be a restraint for some applications. Certain high-performance fillers, such as silver or graphene, can be expensive, which can increase the overall cost of the thermally conductive polymer composites. The cost of high-performance fillers like silver or graphene is influenced by factors such as production methods, availability, and demand. These fillers often require specialized manufacturing processes and have limited availability, which can drive up their cost. Additionally, the demand for these high-performance fillers in various industries, including electronics and automotive, can further contribute to their higher price. , Opportunity: Increasing demand for fuel-efficient and high-end home appliance products , The demand for high-performance and lightweight products is driving the growth of the thermally conductive polymer composites market. Thermally conductive filler dispersants play a crucial role in achieving the desired thermal properties in these high-performance products. Polymer-based thermal interface materials consisting of polymer and thermally conductive fillers occupy the most commercial markets because of their thermal conductivity and mechanical properties. Thermally conductive filler dispersants play a crucial role in achieving optimal thermal conductivity in these materials. In addition, the demand for fuel-efficient products is driving the development of high-thermal-conductivity fillers such as aluminum nitride for use in polymer/ceramic composites. These fillers can be used in conjunction with thermally conductive filler dispersants to achieve optimal thermal conductivity. , Challenges: Compatibility with different polymers , Thermally conductive filler dispersants need to be compatible with a wide range of polymer matrices to ensure effective dispersion and interfacial interaction. Achieving compatibility with different polymers can be a challenge due to differences in chemical composition and processing conditions. The interfacial compatibility between fillers and the polymer matrix is crucial for effective dispersion and interfacial interaction, which ultimately affects the heat transfer efficiency of the composites. Surface modification techniques can be employed to improve the interface compatibility, but their effectiveness in improving overall thermal conductivity is limited. The thermal conductivity of polymer composites with dispersed fillers is influenced by several factors, including filler type, size, and aspect ratios. These factors need to be considered when selecting the appropriate thermally conductive filler dispersants for different polymer matrices. In addition, the quality of dispersion plays a significant role in achieving compatibility between fillers and polymers. For a single polymer, the dispersion quality may influence the outcome with the same filler. , By dispersant type, non-silicone is the largest in thermally conductive filler dispersants market, in 2022. , The rising demand for non-silicone thermally conductive filler dispersants is driven by their compatibility with different polymers, form-in-place gap fillers, enhanced thermal conductivity, high thermal conductivity paste, and improved mechanical properties. These advantages make non-silicone thermally conductive filler dispersants a preferred choice for various industries, including electronics, automotive, healthcare, aerospace, and telecommunication. , By filler material, carbon-based are the second largest in thermally conductive filler dispersants market, in 2022. , Carbon-based fillers, such as carbon black, carbon fibers, synthetic graphite particles, and carbon nanotubes, exhibit high thermal conductivity. This makes them attractive for enhancing the thermal conductivity of polymer composites. Carbon-based fillers, particularly carbon fibers, offer a high strength-to-weight ratio, making them suitable for applications where weight reduction is important. In addition, surface modification techniques can be employed to enhance the interfacial compatibility between carbon-based fillers and the polymer matrix, improving dispersion and interfacial interaction. All these factors contribute to the growth of carbon-based filler materials in the thermally conductive filler dispersants market. , By application, heat dissipation accounts for the largest share in the thermally conductive filler dispersants market, in 2022. , In general, higher filler loadings are needed to achieve higher thermal conductivity in pastes used for heat transfer applications. This highlights the importance of thermally conductive filler dispersants in achieving efficient heat dissipation. High thermal conductivity pastes, which serve as heat transfer means for cooling electronic components like VLSI chips, rely on thermally conductive filler dispersants to enhance their thermal conductivity. Adding high thermal conductivity fillers into polymer matrices is an effective way to improve the heat transfer performance of polymer materials. Thermally conductive filler dispersants facilitate the dispersion and interaction of these fillers, contributing to enhanced heat dissipation. , By end-use industry, electronics is the largest in thermally conductive filler dispersants market, in 2022. , Electronics is the largest end-use segment. TIMs are commonly used for transferring thermal conductivity from the CPU or GPU to heat sink coolers. Electronic products such as CPUs, chipsets, graphics cards, and hard disk drives, are susceptible to failure in case of overheating. Thermally conductive filler dispersants for TIMs are used in computers to remove the excess heat to maintain the components operating temperature limits. They are used in computers to optimize performance and reliability for smooth functioning. They are used for improving the heat flow in computers by filling voids or irregularities between the heat sink and SSE base plate mounting surfaces. The increased demand for electronic products is driving the market for thermally conductive filler dispersants. , Asia Pacific is projected to be fastest growing amongst other regions in the thermally conductive filler dispersants market, in terms of value. , Based on the region, the thermally conductive filler dispersants market is segmented into Asia Pacific, North America, Europe, South America, and the Middle East & Africa. Currently, Asia Pacific is the fastest growing market for thermally conductive filler dispersants. The region has a large and growing population with increasing disposable income, a rising awareness of health and wellness, and the expanding middle-class population and changing lifestyles have led to a surge in demand for electronic products, and electric vehicles. Additionally, advancements in technologies and increased R&D activities in the thermally conductive filler dispersants market have further fueled the growth of the market in Asia Pacific. , Recent Developments , In December 2019, the specialty chemicals group ALTANA acquired Schmid Rhyner AG, a Swiss overprint varnish specialist to generate value-creating growth through targeted acquisitions. The acquisition helped ALTANA ALTANA to expand its product portfolio and offer new solutions to its customers in various industries. , In October 2022, BYK launched BYK-MAX CT 4275, is a specially developed additives that can be used in a wide variety of polyamides and thermoplastic. BYK-MAX CT 4275 is used to enhance the performance of thermal interface materials by improving the dispersion and incorporation of the additive into the thermoplastic matrix, resulting in improved thermal conductivity and mechanical properties. , In April 2022, Shin-Etsu Co. Ltd. developed thermal interface silicone rubber sheet series (TC-BGI Series) for use in components of electric vehicles as the technology for high voltage devices advances. It is a hard, thermal-interface silicone rubber sheet that combines good levels of voltage resistance and heat dissipation. , In January 2021, Momentive Performance Materials acquired KCC Corporation's Silicones business in Korea and the UK, as well as its sales operations in China. KCC Corporation offers silicone and silicone-based products. The acquisition strengthens Momentive's global capabilities in advanced silicones and enhances its ability to serve customers in the Asia-Pacific region. , In February 2023, Evonik Industries invested USD 1 miilion into fumed aluminum oxide production plant expansion for battery applications in Yokkaichi, Japan. The investment helped Evonik Industries to meet the growing demand for fumed aluminum oxide in the battery industry and strengthen its position in the market. It also expanded Evonik's presence in Asia, where the demand for lithium-ion batteries was high. , KEY MARKET SEGMENTS , On the basis of dispersant type , Silicone-based , Non-silicone based , Others , On the basis of filler material , Ceramic , Metal , Carbon-based , Others , On the basis of application , Thermal Insulation Glue , Potting Glue , Plastic , Rubber , Heat Dissipation Ceramic , Coatings , Others , On the basis of the end-use industry , Electronics , Automotive , Energy , Building & Construction , Industrial , Aerospace , Others , On the basis of region , North America , Asia Pacific , Europe , South America , Middle East & Africa , Key Market Players , BYK , Shin-Etsu Chemical , Dow Chemical Company , JNC Corporation , Momentive Performance Materials , Kusumoto Chemicals , Evonik , Croda International , Lubrizol Corporation , Wacker Chemie.

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Thermally Conductive Filler Dispersants Market

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