
Report ID: SQSG45K2010
Skyquest Technology's expert advisors continuously track and analyze the latest developments and updates related to printed circuit board market. Our team of analysts stay abreast of all the recent news stories shaping the industry including new product launches by major companies, strategic partnerships, M&As, Patent filings and industry and regulatory developments.
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Printed Circuit Board Market size was valued at USD 84.4 Billion in 2023 and is poised to grow from USD 89.21 Billion in 2024 to USD 139.63 Billion by 2032, growing at a CAGR of 5.7% during the forecast period (2025-2032).
Key vendors in Printed Circuit Board Market are : 'Nippon Mektron Ltd. (Japan) ', 'TTM Technologies, Inc. (United States) ', 'Unimicron Technology Corporation (Taiwan) ', 'Zhen Ding Technology Holding Limited (Hong Kong) ', 'Young Poong Electronics Co., Ltd. (South Korea) ', 'Samsung Electro-Mechanics Co., Ltd. (South Korea) ', 'Ibiden Co., Ltd. (Japan) ', 'Compeq Manufacturing Co., Ltd. (Taiwan) ', 'Tripod Technology Corporation (Taiwan) ', 'Daeduck GDS Co., Ltd. (South Korea) ', 'Fujikura Ltd. (Japan) ', 'Sumitomo Electric Industries, Ltd. (Japan) ', 'CMK Corporation (Taiwan) ', 'AT&S Austria Technologie & Systemtechnik AG (Austria) ', 'Chin-Poon Industrial Co., Ltd. (Taiwan) ', 'Kingboard Laminates Holdings Limited (Hong Kong) ', 'Shennan Circuits Co., Ltd. (China) ', 'WUS Printed Circuit Co., Ltd. (China) ', 'KCE Electronics Public Company Limited (Thailand) ', 'Multek Corporation (United States)'
The micro sensors, which enable automotive manufacturers to embed new, more advanced technology for safety and telecommunications, is expected to drive demand for high-end PCBs. Many electronic components exist in modern cars such as sensors, cameras, different radar systems (ARRAD), an infotainment system, and commercial vehicle advanced driver assistance system (ADAS).
Growing Application of Advanced Electronic Products: One of the trends in the market will be increased market penetration by miniaturized electronic components. The market is experiencing a rising demand for power efficient low data transfer. Therefore, this trend for miniaturization of electronic components is becoming popular in the market resulting in high density of circuit so a complex interconnection between components. As high-density circuits constitute HDI substrates, it facilitates the mounting of electronic components on the PCB and sends and receives signals to other components as well.
Asia-Pacific accounted for the largest printed circuit board market share in terms of region in 2023. This is mainly due to the growing application of PCB in electronic devices and also the presence of a large number of semiconductor manufacturers in the region. In addition, rising acceptance of smart electronic implements in the region especially among developing countries such as India, China, Japan is also accounting for growth of printed circuit board market in this region. Furthermore, growth of APAC printed circuit boards will increase the deployment in 5G network in countries like South Korea, China & Japan thereby driving the growth of this market.
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Report ID: SQSG45K2010
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