Report ID: SQSG45K2010
Skyquest Technology's expert advisors have carried out comprehensive research and identified these companies as industry leaders in the Printed Circuit Board Market. This Analysis is based on comprehensive primary and secondary research on the corporate strategies, financial and operational performance, product portfolio, market share and brand analysis of all the leading Printed Circuit Board industry players.
In coming years, a number of companies will try to deploy their partnerships and collaborations as the market is still in its early stages. However, the market consists of a large number of medium and small-scale manufacturers.
Printed Circuit Board Market Top Players Company Profiles
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Global Printed Circuit Board USD 89.21 Billion in 2024 Market size was valued at USD 94.3 Billion in 2025 and is poised to grow from USD 146.92 Billion by 2033 to 5.7%, growing at a CAGR of (2026–2033) during the forecast period (2025-2032).
Large companies like Zhen Ding, Nippon Mektron, and Unimicron control the high-end segments of the moderately consolidated global printed circuit board market. To diversify geopolitical risk, strategic goals include investing in AI-based production systems, growing into EV and 5G infrastructure, and establishing locations outside of China. While businesses like Wurth Elektronik are implementing more ecologically friendly practices to meet sustainability goals, AT&S and TTM are giving priority to the development of HDI and IC substrates. 'Unimicron Technology Corp.', 'Jiva Materials', 'Amber Group', 'Zhen Ding Technology Holding', 'Nippon Mektron Ltd.', 'Compeq Manufacturing Co., Ltd.', 'Tripod Technology Corp.', 'TTM Technologies Inc.', 'AT&S AG', 'Jabil Inc.', 'Wurth Elektronik GmbH & Co. KG', 'Sanmina Corporation', 'Advanced Circuits', 'Ibiden Co., Ltd.'
HDI PCBs are becoming more necessary for effective signal routing in constrained spaces as electronic devices continue to get smaller and more complex. Better electrical performance, higher circuit densities, and finer lines are supported by these PCBs. The use of HDI PCBs has grown dramatically since the introduction of 5G smartphones and wearable technology, which have improved speed and performance in consumer electronics and telecom infrastructure worldwide.
Increasing Adoption of Flex and Rigid Flex PCBs: Flex and rigid-flex PCBs are being adopted for wearables, medical implants, foldable smartphones, and aerospace systems due to their bendability and size. These boards offer compact, rugged solutions for high-demand applications. It is projected that flex and rigid-flex PCBs will be more than 16% of worldwide PCB sales by 2025 and will continue to grow with the emergence of smart textiles and portable medical diagnostics.
How is reshoring and defense spending shaping North America’s PCB market?
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Report ID: SQSG45K2010
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