USD 13.25 Billion
Global 3D IC Market Size, Share, Growth Analysis, By Type(Stacked 3D, and Monolithic 3D), By Component(Through-Silicon Via (TSV), Through Glass Via (TGV)) - Industry Forecast 2024-2031
Report ID:
SQMIG45K2097 |
Region:
Global |
Published Date: April, 2024
Pages:
197
|
Tables:
62 |
Figures:
72
Global 3D IC Market Insights
Global 3D IC Market size was valued at USD 13.25 Billion in 2022 and is poised to grow from USD 15.91 Billion in 2023 to USD 68.88 Billion by 2031, at a CAGR of 20.10% during the forecast period (2024-2031).
The global 3D IC (Integrated Circuit) market is experiencing a significant surge, marked by technological advancements. This is due to the use of new technology and the demand for tiny, strong electronic items that others wish to purchase.
The market has become much bigger because more and more people are starting to use 3D ICs in things like smartphones, tablets, and other electronic devices. The main goal of the 3D IC market is to make electronic devices work better and use power more efficiently by putting many layers of integrated circuits on top of each other.
This new method allows us to use energy more effectively, make signals stronger and create smaller items. It meets the changing needs of people who buy electronics like phones or computers in a good way. One main reason making the world 3D IC market grow is that people keep wanting smaller, lighter, and more power-saving electronic things.
The 3D IC tech fixes these needs by putting many layers of silicon wafers on top of each other. This way, we can use space better and add more features in a small area. Also, the technology helps move data quicker and uses less power. This makes it a good choice for different kinds of businesses.
But, the market has some limiting factors. These include the high starting costs needed for using 3D IC technology. The complicated methods and the need for special tools cause high production costs, stopping many from using them.
Moreover, worries about controlling heat and possible problems with mixing things up make it harder for the market to grow. Problems with the 3D IC market also include getting everyone to agree on standards and working together as an industry to make sure design and production rules are the same for everybody.
Making different 3D IC products work well together is still hard. This makes it tough to fit them into a variety of uses smoothly. However, even with these difficulties, there are big chances for the 3D IC market. The need for artificial intelligence (AI) and machine learning (ML) tools, as well as the introduction of 5G technology, is a great chance to use 3D ICs. 3D ICs can make data processing faster and meet the needs of these advanced technologies.
This makes them very important in the changing digital world. Lastly, the world's 3D IC market is pushed by demand for small, efficient, and fast electronics.
Problems like high first costs and making everything the same are still there. But the opportunity is big because more people want new stuff like AI and 5G technology. As the 3D IC industry keeps improving and solving these issues, the market is set to grow a lot in future years.
Market snapshot - 2024-2031
Global Market Size
Largest Segment
Stacked 3D and Monolithic 3D
Fastest Growth
Stacked 3D and Monolithic 3D
Growth Rate
20.10% CAGR
Global 3D IC Market 2021-2030 ($ Bn)
Country Share for North America Region- 2021 (%)
Global 3D IC Market Size By type 2021-2030 ($ Bn)
Global 3D IC Market Size By type 2021-2030 (%)
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Global 3D IC Market Segmental Analysis
Global 3D IC market is segmented based on type, component, and region. By type, the market is segmented into stacked 3D and monolithic 3D. By component, the market is segmented into through-silicon via (TSV), through glass via (TGV), and silicon interposer. By region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.
Analysis By Type
Stacked 3D technology emerges as the largest segment, commanding a significant share due to its transformative capabilities. 3D ICs that are stacked together make performance and size better by putting many semiconductor layers on top of each other. This tech lets us put lots of different features in a tight area. It's a big answer to the need for smaller and better working electronic gadgets. The Stacked 3D part has a big portion of the market. It makes up around 65% of the total money made from 3D ICs. This lead is caused by the wide range of uses for technology. It helps with things like toys, gadgets, and places where lots of data is stored. There it's important to save space and make things better.
The monolithic 3D segment stands out as the fastest-growing segment within the 3D IC market, showcasing an impressive CAGR over the last few years. 3D technology for making big computer chips creates many layers together on one chip. This makes it use less power and transfer data faster. The fast rise is because more people want fancy chip answers in new things like smart machines and quick-use computing. The Monolithic 3D way not only fits the need for smallness but also matches what modern users need. This makes it a major source of innovation in the worldwide 3D IC market. As companies keep looking for good and fast answers, the Monolithic 3D part is set to keep growing quickly. It will change how technology looks in a big way.
Analysis By Component
The Through-Silicon Via (TSV) segment stands out as the largest and most pivotal component. This part has a big share in the market because it is excellent at making chips work better and faster. The TSV technology is used a lot because it helps to move data faster, use less power, and make signals better. As technology keeps asking for quicker speeds and better functions in small gadgets, the TSV part has become an important part of the 3D IC market. It offers a key answer to match these changing needs in our industry. With a strong lead, the TSV part is ready for continuous growth. It gives an impressive way for the global 3D chip market to meet the growing needs of today's electronics.
The fastest-growing component in the 3D IC market is the Through Glass Via (TGV) technology. TGV means making connections up and down through glass layers, giving a good choice to old silicon-based interposers. This part is growing fast because it has special benefits like better electrical performance, better heat control, and improved scaling up. As electronic devices get smaller and more complicated, the ability of TGV technology to handle heat problems and provide better electrical features makes it the leader in growth. As more apps see the advantages of TGV, its share in the market is going to grow a lot. This will make it one of the fastest-developing parts of 3D IC worldwide. The mix of new ideas and useful methods helps TGV lead the way in a growing market. It makes them an important part of the 3D IC world.
Global 3D IC Market Size By type 2021(%), 2023 (%)
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Global 3D IC Market Regional Insights
Asia-Pacific is emerging as a dominating region in terms of market share. Fast economic growth, along with a busy electronics-making community in places like China, South Korea, and Taiwan have made Asia-Pacific an essential place for using 3D IC technology. The area uses strong technology for making computer chips. The growing need for smartphones, everyday gadgets, and car use drives the use of 3D ICs. Big chip makers and new technology make Asia-Pacific a key player in the world market for 3D IC. They help shape its future.
North America stands out as one of the fastest-growing regions in the 3D IC market. This area is known for its big focus on inventing new technology and has a healthy group of top chip makers. In the United States, they mostly focus on research and development related to 3D ICs. People want more and better artificial intelligence, computer speed, and the Internet of things. This has made 3D IC technology more popular. North America pays a lot to do research and develop new technology. This makes it an exciting and fast-changing place for 3D ICs (chips in a flat design). As 3D IC technology gets better, North America is ready to help decide what the world's market for it will look like.
Global 3D IC Market Size By Geography, 2021-2030, 2024-2031
- Largest
- Fastest
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Global 3D IC Market Dynamics
Drivers
Increasing demand for compact and high-performance electronic devices
- One big reason for the worldwide 3D IC market growing is that more people want small and fast electronic devices. As people prefer smaller, lighter, and more powerful gadgets like smartphones, tablets, or wearables the 3D IC technology gives a way to stack several layers of integrated circuits. This method makes our things work better, lets us use less power, and makes them smaller. It helps meet the changing needs of users buying gadgets.
Performance Enhancement
- As the demand for higher overall performance and processing speed will increase in diverse digital devices, 3D IC technology offers an answer by way of stacking multiple layers of integrated circuits (ICs) vertically. This vertical integration permits for shorter interconnection lengths, decreased signal delays, and improved ordinary overall performance, making 3-D ICs appealing for packages in computing, telecommunications, and other high-overall performance structures.
Restraints
High initial costs associated with the implementation of 3D IC technology
- The high start-up costs for 3D IC technology act as a big barrier for the market. The complex making processes and need for special tools make production costs higher. The first cost of using 3D IC technology can be an obstacle for some factories. It may stop the big use of this new tech in different businesses.
Complex Manufacturing Processes
- The fabrication of 3D ICs includes problematic production approaches consisting of through-silicon via (TSV) formation, wafer bonding, and thin wafer handling. These methods are more complex than those used for conventional 2D ICs, leading to better manufacturing prices and technological demanding situations. As a result, the adoption of 3-D IC era may be hindered with the aid of the difficulty and price associated with the manufacturing approaches.
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Global 3D IC Market Competitive Landscape
The competitive landscape of the global 3D IC market is characterized by intense rivalry among key players striving to gain a significant market share in this rapidly evolving industry. Major companies in the market always spend money on inventing and improving technology to stay up-to-date with new tech stuff. Players are working on new ways to design 3D ICs, make things, and use materials. They want better performance at a lower cost while managing heat well. In the market, companies often join with or buy other businesses to grow their offerings and become stronger. This helps them serve many types of uses. More and more competition has arisen in the market recently due to many new companies joining, especially startups and small businesses. They are introducing fresh ideas and solutions into the world of 3D IC technology. As more people want 3D IC tech in many areas, big companies keep fighting to stand out. They do this with new technology, making different products, and forming alliances to be better in the global market for 3D ICs.
Top Player’s Company Profiles
- AMKOR TECHNOLOGY
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- STMicroelectronics N.V.
- Toshiba Corporation
- United Microelectronics Corporation.
- Xilinx Inc.
- ASE GROUP
- Micron Technology, Inc.
- INTEL CORPORATION
- Samsung Electronics Co. Ltd.
- Cadence
- Tezzaron Semiconductor Conductor Corporation
- 3M Company Besang Inc.
- IBM Corporation
- Monolithic 3D Inc.
- Intel Corporation
- Samsung Electronics Co. Ltd.
Recent Developments
- In March 2022, Amkor Technology, a company based in South Korea teamed up with the TSMC OIP 3D Fabric. With a first chance to use TSMC's 3D Fabric tech, new partners of the 3D Fabric Alliance can move their products forward at the same time as TSMC. They can also suggest a regular supply of top-notch 2.5 ICs and 3D ICs.
- In October 2021, Cadence Design Systems, Inc. said they gave out the Integrity 3D-IC platform. It is the first 3D IC platform available that combines system checking, design planning, and high-capacity 3D actions all in one place.
- In May 2021, Intel plans to spend $3.5 billion on improving its Rio Rancho site. This is one of Intel's key plants in the US and will help over 35% of its workers there. It's growing its plants in New Mexico to make new types of chips using its Foveros 3D packaging technology. This may help their business regain its top spot in the semiconductor market.
Global 3D IC Key Market Trends
- Growing integration of 3D ICs in artificial intelligence (AI) and machine learning (ML) applications: One of the changes in the 3D IC market around the world is more and more use of 3D ICs in artificial intelligence (AI) and machine learning (ML) works. As these fancy technologies become more common, we need faster ways to process data and better performance. This is where 3D IC technology can help. The pattern shows that 3D ICs are becoming more important in making and using AI and ML. This makes the market for this technology grow.
- Advanced Packaging Technologies: Innovations in advanced packaging technology, including fan-out wafer-level packaging (FOWLP) and system-in-package deals (SiP), are driving the evolution of 3D ICs. These packaging strategies beautify thermal control, enhance electrical overall performance, and offer value-effective solutions for integrating multiple capabilities right into an unmarried bundle. Advanced packaging is a key trend shaping the destiny of three-D ICs, particularly in programs requiring compact and energy-green designs.
Global 3D IC Market SkyQuest Analysis
SkyQuest’s ABIRAW (Advanced Business Intelligence, Research & Analysis Wing) is our Business Information Component types team that Collects, Collates, Co-relates, and Analyses the Data collected by means of Primary Exploratory Research backed by robust Secondary Desk research.
According to our global 3D IC market analyses, the worldwide 3D IC market is growing fast because more and more people want small electronic devices that work well in many fields. The market is pushed by using 3D IC technology in things like smartphones, tablets, and wearables. It's important here to have less space but still work better. The main reason for the market is always wanting new technology to make gadgets lighter and stronger, which consumers like. But there are problems in the market too. A big limit is the high cost at first for starting to use 3D IC. The complex making methods and the need for special tools can make it expensive to produce things, which might stop many people from using them. Even with these problems, a big change in the market is that 3D ICs are being used more and more in AI and ML applications. The need for quick data processing and better performance in modern technologies is getting bigger. This makes 3D ICs very important, ensuring the market keeps growing. In short, the world's 3D IC market is a changing mix of things that help it grow and slow down. Technology advancements and using 3D ICs in new applications go a long way with how this market moves.
| Report Metric | Details |
|---|---|
| Market size value in 2023 | USD 13.25 Billion |
| Market size value in 2031 | USD 68.88 Billion |
| Growth Rate | 20.10% |
| Forecast period | 2024-2031 |
| Forecast Unit (Value) | USD Billion |
| Segments covered |
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| Regions covered | North America (US, Canada), Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe), Asia Pacific (China, India, Japan, Rest of Asia-Pacific), Latin America (Brazil, Rest of Latin America), Middle East & Africa (South Africa, GCC Countries, Rest of MEA) |
| Companies covered |
|
| Customization scope | Free report customization with purchase. Customization includes:-
|
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Table Of Content
Executive Summary
Market overview
- Exhibit: Executive Summary – Chart on Market Overview
- Exhibit: Executive Summary – Data Table on Market Overview
- Exhibit: Executive Summary – Chart on Global 3D IC Market Characteristics
- Exhibit: Executive Summary – Chart on Market by Geography
- Exhibit: Executive Summary – Chart on Market Segmentation
- Exhibit: Executive Summary – Chart on Incremental Growth
- Exhibit: Executive Summary – Data Table on Incremental Growth
- Exhibit: Executive Summary – Chart on Vendor Market Positioning
Parent Market Analysis
Market overview
Market size
- Market Dynamics
- Exhibit: Impact analysis of DROC, 2021
- Drivers
- Opportunities
- Restraints
- Challenges
- Exhibit: Impact analysis of DROC, 2021
- SWOT Analysis
KEY MARKET INSIGHTS
- Technology Analysis
- (Exhibit: Data Table: Name of technology and details)
- Pricing Analysis
- (Exhibit: Data Table: Name of technology and pricing details)
- Supply Chain Analysis
- (Exhibit: Detailed Supply Chain Presentation)
- Value Chain Analysis
- (Exhibit: Detailed Value Chain Presentation)
- Ecosystem Of the Market
- Exhibit: Parent Market Ecosystem Market Analysis
- Exhibit: Market Characteristics of Parent Market
- IP Analysis
- (Exhibit: Data Table: Name of product/technology, patents filed, inventor/company name, acquiring firm)
- Trade Analysis
- (Exhibit: Data Table: Import and Export data details)
- Startup Analysis
- (Exhibit: Data Table: Emerging startups details)
- Raw Material Analysis
- (Exhibit: Data Table: Mapping of key raw materials)
- Innovation Matrix
- (Exhibit: Positioning Matrix: Mapping of new and existing technologies)
- Pipeline product Analysis
- (Exhibit: Data Table: Name of companies and pipeline products, regional mapping)
- Macroeconomic Indicators
COVID IMPACT
- Introduction
- Impact On Economy—scenario Assessment
- Exhibit: Data on GDP - Year-over-year growth 2016-2022 (%)
- Revised Market Size
- Exhibit: Data Table on Global 3D IC Market size and forecast 2021-2027 ($ million)
- Impact Of COVID On Key Segments
- Exhibit: Data Table on Segment Market size and forecast 2021-2027 ($ million)
- COVID Strategies By Company
- Exhibit: Analysis on key strategies adopted by companies
MARKET DYNAMICS & OUTLOOK
- Market Dynamics
- Exhibit: Impact analysis of DROC, 2021
- Drivers
- Opportunities
- Restraints
- Challenges
- Exhibit: Impact analysis of DROC, 2021
- Regulatory Landscape
- Exhibit: Data Table on regulation from different region
- SWOT Analysis
- Porters Analysis
- Competitive rivalry
- Exhibit: Competitive rivalry Impact of key factors, 2021
- Threat of substitute products
- Exhibit: Threat of Substitute Products Impact of key factors, 2021
- Bargaining power of buyers
- Exhibit: buyers bargaining power Impact of key factors, 2021
- Threat of new entrants
- Exhibit: Threat of new entrants Impact of key factors, 2021
- Bargaining power of suppliers
- Exhibit: Threat of suppliers bargaining power Impact of key factors, 2021
- Competitive rivalry
- Skyquest special insights on future disruptions
- Political Impact
- Economic impact
- Social Impact
- Technical Impact
- Environmental Impact
- Legal Impact
Market Size by Region
- Chart on Market share by geography 2021-2027 (%)
- Data Table on Market share by geography 2021-2027(%)
- North America
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- USA
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Canada
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Europe
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- Germany
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Spain
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- France
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- UK
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of Europe
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Asia Pacific
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- China
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- India
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Japan
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- South Korea
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of Asia Pacific
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Latin America
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- Brazil
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of South America
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Middle East & Africa (MEA)
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- GCC Countries
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- South Africa
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of MEA
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
KEY COMPANY PROFILES
- Competitive Landscape
- Total number of companies covered
- Exhibit: companies covered in the report, 2021
- Top companies market positioning
- Exhibit: company positioning matrix, 2021
- Top companies market Share
- Exhibit: Pie chart analysis on company market share, 2021(%)
- Total number of companies covered
Methodology
For the Global 3D IC Market, our research methodology involved a mixture of primary and secondary data sources. Key steps involved in the research process are listed below:
1. Information Procurement: This stage involved the procurement of Market data or related information via primary and secondary sources. The various secondary sources used included various company websites, annual reports, trade databases, and paid databases such as Hoover's, Bloomberg Business, Factiva, and Avention. Our team did 45 primary interactions Globally which included several stakeholders such as manufacturers, customers, key opinion leaders, etc. Overall, information procurement was one of the most extensive stages in our research process.
2. Information Analysis: This step involved triangulation of data through bottom-up and top-down approaches to estimate and validate the total size and future estimate of the Global 3D IC Market.
3. Report Formulation: The final step entailed the placement of data points in appropriate Market spaces in an attempt to deduce viable conclusions.
4. Validation & Publishing: Validation is the most important step in the process. Validation & re-validation via an intricately designed process helped us finalize data points to be used for final calculations. The final Market estimates and forecasts were then aligned and sent to our panel of industry experts for validation of data. Once the validation was done the report was sent to our Quality Assurance team to ensure adherence to style guides, consistency & design.
Analyst Support
Customization Options
With the given market data, our dedicated team of analysts can offer you the following customization options are available for the Global 3D IC Market:
Product Analysis: Product matrix, which offers a detailed comparison of the product portfolio of companies.
Regional Analysis: Further analysis of the Global 3D IC Market for additional countries.
Competitive Analysis: Detailed analysis and profiling of additional Market players & comparative analysis of competitive products.
Go to Market Strategy: Find the high-growth channels to invest your marketing efforts and increase your customer base.
Innovation Mapping: Identify racial solutions and innovation, connected to deep ecosystems of innovators, start-ups, academics, and strategic partners.
Category Intelligence: Customized intelligence that is relevant to their supply Markets will enable them to make smarter sourcing decisions and improve their category management.
Public Company Transcript Analysis: To improve the investment performance by generating new alpha and making better-informed decisions.
Social Media Listening: To analyze the conversations and trends happening not just around your brand, but around your industry as a whole, and use those insights to make better Marketing decisions.
Global 3D IC Market Report Snapshots
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