3D IC and 2.5D IC Packaging Market

3D IC and 2.5D IC Packaging Market Size, Share, Growth Analysis, By Packaging Technology(3D wafer-level chip-scale packaging (WLCSP), 3D Through-silicon via (TSV)), By Application(Logic, Imaging & Optoelectronics), By End User(Consumer Electronics, Industrial), By Region(North America, Europe) - Industry Forecast 2024-2031

Report ID: UCMIG45J2175 | Region: Global | Published Date: Upcoming |
Pages: 165 | Tables: 55 | Figures: 60

3D IC and 2.5D IC Packaging Market Insights

Market Overview:

The market for 3D IC and 2.5D IC packaging is anticipated to be valued USD 49.3 billion in 2022 and to grow to USD 82.0 billion by 2028 at a CAGR of 10.7%. Due to the global expansion of smart city projects, growing safety concerns, and increasing need for better high-level access control systems, the logic segment is the expanding application of 3D IC and 2.5D IC Packaging.

3D IC and 2.5D IC Packaging Market, Forecast & Y-O-Y Growth Rate, 2020 - 2028
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This report is being written to illustrate the market opportunity by region and by segments, indicating opportunity areas for the vendors to tap upon. To estimate the opportunity, it was very important to understand the current market scenario and the way it will grow in future.

Production and consumption patterns are being carefully compared to forecast the market. Other factors considered to forecast the market are the growth of the adjacent market, revenue growth of the key market vendors, scenario-based analysis, and market segment growth.

The market size was determined by estimating the market through a top-down and bottom-up approach, which was further validated with industry interviews. Considering the nature of the market we derived the Electronic Equipment & Instruments by segment aggregation, the contribution of the Electronic Equipment & Instruments in Technology Hardware & Equipment and vendor share.

To determine the growth of the market factors such as drivers, trends, restraints, and opportunities were identified, and the impact of these factors was analyzed to determine the market growth. To understand the market growth in detail, we have analyzed the year-on-year growth of the market. Also, historic growth rates were compared to determine growth patterns.

Segmentation Analysis:

The 3D IC and 2.5D IC Packaging Market is segmented by Packaging Technology, Application, End User, Region. We are analyzing the market of these segments to identify which segment is the largest now and in the future, which segment has the highest growth rate, and the segment which offers the opportunity in the future.

3D IC and 2.5D IC Packaging Market Basis Point Share Analysis, 2021 Vs. 2028
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  • Based on Packaging Technology the market is segmented as, 3D wafer-level chip-scale packaging (WLCSP), 3D Through-silicon via (TSV), 2.5D
  • Based on Application the market is segmented as, Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Others (Power, Analog & Mixed Signals, RF, Photonics)
  • Based on End User the market is segmented as, Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices
  • Based on Region the market is segmented as, North America, Europe, Asia Pacific, Rest of the World, Key Market Players, Taiwan Semiconductor Manufacturing Company, Ltd., Intel Corporation, ASE Technology Holding Co., Ltd., Amkor Technology, Broadcom, Texas Instruments Inc, United Microelectronics Corporation, JCET Group Co., Ltd.

Regional Analysis:

3D IC and 2.5D IC Packaging Market is being analyzed by North America, Europe, Asia-Pacific (APAC), Latin America (LATAM), Middle East & Africa (MEA) regions. Key countries including the U.S., Canada, Germany, France, UK, Italy, Spain, China, India, Japan, Brazil, GCC Countries, and South Africa among others were analyzed considering various micro and macro trends.

3D IC and 2.5D IC Packaging Market Attractiveness Analysis, By Region 2020-2028
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3D IC and 2.5D IC Packaging Market : Risk Analysis

SkyQuest's expert analysts have conducted a risk analysis to understand the impact of external extremities on 3D IC and 2.5D IC Packaging Market. We analyzed how geopolitical influence, natural disasters, climate change, legal scenario, economic impact, trade & economic policies, social & ethnic concerns, and demographic changes might affect 3D IC and 2.5D IC Packaging Market's supply chain, distribution, and total revenue growth.

Competitive landscaping:

To understand the competitive landscape, we are analyzing key 3D IC and 2.5D IC Packaging Market vendors in the market. To understand the competitive rivalry, we are comparing the revenue, expenses, resources, product portfolio, region coverage, market share, key initiatives, product launches, and any news related to the 3D IC and 2.5D IC Packaging Market.

To validate our hypothesis and validate our findings on the market ecosystem, we are also conducting a detailed porter's five forces analysis. Competitive Rivalry, Supplier Power, Buyer Power, Threat of Substitution, and Threat of New Entry each force is analyzed by various parameters governing those forces.

Key Players Covered in the Report:

  • nd 2.5D IC packaging market is estimated to be worth USD 49.3 billion in 2022 and is projected to reach USD 82.0 billion by 2028, at a CAGR of 10.7% during the forecast period. Growing adoption of high-end computing, servers, and data centers and miniaturization of IoT Devices are some of the major opportunities that lie ahead for the market.
  • 3D IC and 2.5D IC Packaging Market Dynamics
  • Driver: Growing demand for consumer electronics and gaming devices
  • With the latest technological advancements, there are many new gadgets coming up in the market, such as e-book readers, gaming devices, tablet computers, 3D smart glass, augmented reality, and virtual reality products which demand high-performance electronic components. 3D IC packaging technology has helped bridge the processor memory performance gap by shortening the critical path and reducing the latency. It also allows scaling to continue efficiently by moving the focus from device-level scaling to circuit- and system-level scaling.
  • In addition, the advent of 5G technology has fueled the demand for 5G-enabled smartphones. According to Samsung, the demand for smartphones and 5G smartphones is expected to grow at a CAGR of 6% and 37%, respectively, from 2021 to 2025, due to the rising commercialization of 5G technology. Smartphone manufacturers such as Apple Inc., Samsung, Huawei, Vivo, Honor, OPPO, Xiaomi, and OnePlus have commercialized their 5G smartphones worldwide. Thus, the increase in the shipment of 5G smartphones is expected to fuel the demand for 3D IC and 2.5D IC packaging industry during the forecast period.
  • Restraint: Thermal issues resulting from higher level of integration
  • 3D IC offers highly dense multi-level integration per unit footprint. Though this is attractive for many applications where miniaturization is a concern, it also creates challenges for thermal management; increased integration leads to high on-chip temperature. 3D ICs have several issues that must be resolved, including a larger form factor, the requirement for a larger silicon interposer, and longer design cycles. Overheating is observed during the production of 3D ICs with TSVs. Elevated temperatures result in a drop in threshold voltage and degradation of mobility. The resistance and power dissipation increases as a major part of the component is made up of metal.
  • Opportunity: Rising number of smart infrastructure and smart city projects
  • 3D IC packaging can play a significant role in the development and implementation of smart city technology. Smart cities rely on a variety of electronic devices, sensors, and systems to collect and analyze data in real time, enabling better decision-making and more efficient resource management. By using 3D IC packaging, these devices and systems can be made smaller and more powerful and energy efficient. This helps reduce the overall cost and size of smart city infrastructure while improving performance and reliability.
  • Challenge: Reliability challenges with 3D IC packaging
  • The semiconductor industry business is primarily driven by applications such as data centers/cloud, mobility, and the Internet of Things (IoT). The packaging technique must advance alongside the scaling of integrated circuit (IC) technology in order to fulfill the demands of next-generation information and communication technology (ICT) systems. Package design and development must simultaneously meet cost, performance, form factor, and reliability objectives. In terms of powering the design, the power density is higher for a given footprint than for traditional 2D chips. However, answering reliability issues will be crucial.
  • 3D IC and 2.5D IC Packaging Market Ecosystem
  • The 3D IC and 2.5D IC packaging technology market is marked by the presence of a few tier-1 companies, such as Samsung Electronics Co. Ltd (South Korea), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), and many more. These companies have created a competitive ecosystem by investing in research and development activities to launch highly efficient and reliable 3D IC and 2.5D IC packaging solutions.
  • Consumer electronics to hold largest market share among end users in 3D IC and 2.5D IC packaging market
  • Consumer electronics, by end user, is expected to hold the largest market share of the 3D IC and 2.5D IC packaging market. Increasing memory requirements in consumer products such as smartphones and tablets are driving the need for various advanced memories such as double-data-rate (DDR) dynamic random-access memory (DRAM), flash memory, and so on to be integrated. The advanced memory architectures are driving the demand for the 3D IC and 2.5D IC packaging market to offer high-performing, large-capacity, and compact products.
  • MEMS/Sensors to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period
  • The functional components of MEMS are micro sensors, micro actuators, and microelectronics. The advanced elements of MEMS are accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, microphones, and smart sensors, among others. The key requirement in all these elements and sensors is a miniaturized structure. Therefore, many sensors have started adopting 3D IC and 2.5D IC packages.
  • 3D WLCSP to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period
  • 3D WLCSP is one of the most compact package types, with increased functionality and improved thermal performance in printed circuit boards compared to 3D TSV and 2.5D IC. 3D WLCSP has a simplified process design for manufacturing 3D ICs, which uses polymers that can sustain high temperatures, thus addressing the thermal issue, which is the major challenge for this market. 3D WLCSP has gained popularity in space-constrained consumer electronic applications and other portable consumer devices as well as industrial products as it offers cost-effective, small, lightweight, high-performance semiconductor solutions.
  • Asia Pacific held to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period
  • The Asia Pacific region is one of the key markets for 3D IC and 2.5D IC packaging owing to its broad scope in various consumer electronics applications, particularly in smartphones and tablets. This is mainly because of the high population density in the region, making it the largest potential market for 3D IC and 2.5D IC packaging among the four major regions.
  • Recent Developments
  • In February 2023, Amkor Technology (US) has partnered with GlobalFoundries (US), a semiconductor manufacturer. Under the arrangement, foundry chipmaker GlobalFoundries will transfer bump and sort lines for 300 mm wafers from its Dresden wafer fab to Amkor’s facility in Porto, Portugal. This strategic partnership with GlobalFoundries will enhance Amkor's advanced semiconductor packaging supply chain.
  • In February 2023, UMC (Taiwan) and Cadence (US) collaborated on 3D-IC Hybrid Bonding Reference Flow. This technology supports the integration across a broad range of technology nodes suitable for edge AI, image processing, and wireless communication applications. Cost-effectiveness and design reliability are the pillars of UMC’s hybrid bonding technologies, and this collaboration with Cadence provides mutual customers with both, helping them reap the benefits of 3D structures while also accelerating the time needed to complete their integrated designs.
  • In June 2022, Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., launched VIPack, an advanced packaging platform designed to enable vertically integrated package solutions. The platform leverages advanced re-distribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package.
  • KEY MARKET SEGMENTS
  • By Packaging Technology
  • 3D wafer-level chip-scale packaging (WLCSP)
  • 3D Through-silicon via (TSV)
  • 2.5D
  • By Application
  • Logic
  • Imaging & Optoelectronics
  • Memory
  • MEMS/Sensors
  • LED
  • Others (Power, Analog & Mixed Signals, RF, Photonics)
  • By End User
  • Consumer Electronics
  • Industrial
  • Telecommunications
  • Automotive
  • Military & Aerospace
  • Medical Devices
  • By Region
  • North America
  • Europe
  • Asia Pacific
  • Rest of the World
  • Key Market Players
  • Taiwan Semiconductor Manufacturing Company, Ltd.
  • Intel Corporation
  • ASE Technology Holding Co., Ltd.
  • Amkor Technology
  • Broadcom
  • Texas Instruments Inc
  • United Microelectronics Corporation
  • JCET Group Co., Ltd.
  • Powertech Technology Inc.

SkyQuest's Expertise:

The 3D IC and 2.5D IC Packaging Market is being analyzed by SkyQuest's analysts with the help of 20+ scheduled Primary interviews from both the demand and supply sides. We have already invested more than 250 hours on this report and are still refining our date to provide authenticated data to your readers and clients. Exhaustive primary and secondary research is conducted to collect information on the market, peer market, and parent market.

Our cross-industry experts and revenue-impact consultants at SkyQuest enable our clients to convert market intelligence into actionable, quantifiable results through personalized engagement.

Scope Of Report

Report Attribute Details
The base year for estimation 2021
Historical data 2016 – 2022
Forecast period 2022 – 2028
Report coverage Revenue forecast, volume forecast, company ranking, competitive landscape, growth factors, and trends, Pricing Analysis
Segments covered
  • By Packaging Technology - 3D wafer-level chip-scale packaging (WLCSP), 3D Through-silicon via (TSV), 2.5D
  • By Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Others (Power, Analog & Mixed Signals, RF, Photonics)
  • By End User - Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices
  • By Region - North America, Europe, Asia Pacific, Rest of the World, Key Market Players, Taiwan Semiconductor Manufacturing Company, Ltd., Intel Corporation, ASE Technology Holding Co., Ltd., Amkor Technology, Broadcom, Texas Instruments Inc, United Microelectronics Corporation, JCET Group Co., Ltd.
Regional scope North America, Europe, Asia-Pacific (APAC), Latin America (LATAM), Middle East & Africa (MEA)
Country scope U.S., Canada, Germany, France, UK, Italy, Spain, China, India, Japan, Brazil, GCC Countries, South Africa
Key companies profiled
  • nd 2.5D IC packaging market is estimated to be worth USD 49.3 billion in 2022 and is projected to reach USD 82.0 billion by 2028, at a CAGR of 10.7% during the forecast period. Growing adoption of high-end computing, servers, and data centers and miniaturization of IoT Devices are some of the major opportunities that lie ahead for the market.
  • 3D IC and 2.5D IC Packaging Market Dynamics
  • Driver: Growing demand for consumer electronics and gaming devices
  • With the latest technological advancements, there are many new gadgets coming up in the market, such as e-book readers, gaming devices, tablet computers, 3D smart glass, augmented reality, and virtual reality products which demand high-performance electronic components. 3D IC packaging technology has helped bridge the processor memory performance gap by shortening the critical path and reducing the latency. It also allows scaling to continue efficiently by moving the focus from device-level scaling to circuit- and system-level scaling.
  • In addition, the advent of 5G technology has fueled the demand for 5G-enabled smartphones. According to Samsung, the demand for smartphones and 5G smartphones is expected to grow at a CAGR of 6% and 37%, respectively, from 2021 to 2025, due to the rising commercialization of 5G technology. Smartphone manufacturers such as Apple Inc., Samsung, Huawei, Vivo, Honor, OPPO, Xiaomi, and OnePlus have commercialized their 5G smartphones worldwide. Thus, the increase in the shipment of 5G smartphones is expected to fuel the demand for 3D IC and 2.5D IC packaging industry during the forecast period.
  • Restraint: Thermal issues resulting from higher level of integration
  • 3D IC offers highly dense multi-level integration per unit footprint. Though this is attractive for many applications where miniaturization is a concern, it also creates challenges for thermal management; increased integration leads to high on-chip temperature. 3D ICs have several issues that must be resolved, including a larger form factor, the requirement for a larger silicon interposer, and longer design cycles. Overheating is observed during the production of 3D ICs with TSVs. Elevated temperatures result in a drop in threshold voltage and degradation of mobility. The resistance and power dissipation increases as a major part of the component is made up of metal.
  • Opportunity: Rising number of smart infrastructure and smart city projects
  • 3D IC packaging can play a significant role in the development and implementation of smart city technology. Smart cities rely on a variety of electronic devices, sensors, and systems to collect and analyze data in real time, enabling better decision-making and more efficient resource management. By using 3D IC packaging, these devices and systems can be made smaller and more powerful and energy efficient. This helps reduce the overall cost and size of smart city infrastructure while improving performance and reliability.
  • Challenge: Reliability challenges with 3D IC packaging
  • The semiconductor industry business is primarily driven by applications such as data centers/cloud, mobility, and the Internet of Things (IoT). The packaging technique must advance alongside the scaling of integrated circuit (IC) technology in order to fulfill the demands of next-generation information and communication technology (ICT) systems. Package design and development must simultaneously meet cost, performance, form factor, and reliability objectives. In terms of powering the design, the power density is higher for a given footprint than for traditional 2D chips. However, answering reliability issues will be crucial.
  • 3D IC and 2.5D IC Packaging Market Ecosystem
  • The 3D IC and 2.5D IC packaging technology market is marked by the presence of a few tier-1 companies, such as Samsung Electronics Co. Ltd (South Korea), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), and many more. These companies have created a competitive ecosystem by investing in research and development activities to launch highly efficient and reliable 3D IC and 2.5D IC packaging solutions.
  • Consumer electronics to hold largest market share among end users in 3D IC and 2.5D IC packaging market
  • Consumer electronics, by end user, is expected to hold the largest market share of the 3D IC and 2.5D IC packaging market. Increasing memory requirements in consumer products such as smartphones and tablets are driving the need for various advanced memories such as double-data-rate (DDR) dynamic random-access memory (DRAM), flash memory, and so on to be integrated. The advanced memory architectures are driving the demand for the 3D IC and 2.5D IC packaging market to offer high-performing, large-capacity, and compact products.
  • MEMS/Sensors to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period
  • The functional components of MEMS are micro sensors, micro actuators, and microelectronics. The advanced elements of MEMS are accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, microphones, and smart sensors, among others. The key requirement in all these elements and sensors is a miniaturized structure. Therefore, many sensors have started adopting 3D IC and 2.5D IC packages.
  • 3D WLCSP to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period
  • 3D WLCSP is one of the most compact package types, with increased functionality and improved thermal performance in printed circuit boards compared to 3D TSV and 2.5D IC. 3D WLCSP has a simplified process design for manufacturing 3D ICs, which uses polymers that can sustain high temperatures, thus addressing the thermal issue, which is the major challenge for this market. 3D WLCSP has gained popularity in space-constrained consumer electronic applications and other portable consumer devices as well as industrial products as it offers cost-effective, small, lightweight, high-performance semiconductor solutions.
  • Asia Pacific held to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period
  • The Asia Pacific region is one of the key markets for 3D IC and 2.5D IC packaging owing to its broad scope in various consumer electronics applications, particularly in smartphones and tablets. This is mainly because of the high population density in the region, making it the largest potential market for 3D IC and 2.5D IC packaging among the four major regions.
  • Recent Developments
  • In February 2023, Amkor Technology (US) has partnered with GlobalFoundries (US), a semiconductor manufacturer. Under the arrangement, foundry chipmaker GlobalFoundries will transfer bump and sort lines for 300 mm wafers from its Dresden wafer fab to Amkor’s facility in Porto, Portugal. This strategic partnership with GlobalFoundries will enhance Amkor's advanced semiconductor packaging supply chain.
  • In February 2023, UMC (Taiwan) and Cadence (US) collaborated on 3D-IC Hybrid Bonding Reference Flow. This technology supports the integration across a broad range of technology nodes suitable for edge AI, image processing, and wireless communication applications. Cost-effectiveness and design reliability are the pillars of UMC’s hybrid bonding technologies, and this collaboration with Cadence provides mutual customers with both, helping them reap the benefits of 3D structures while also accelerating the time needed to complete their integrated designs.
  • In June 2022, Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., launched VIPack, an advanced packaging platform designed to enable vertically integrated package solutions. The platform leverages advanced re-distribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package.
  • KEY MARKET SEGMENTS
  • By Packaging Technology
  • 3D wafer-level chip-scale packaging (WLCSP)
  • 3D Through-silicon via (TSV)
  • 2.5D
  • By Application
  • Logic
  • Imaging & Optoelectronics
  • Memory
  • MEMS/Sensors
  • LED
  • Others (Power, Analog & Mixed Signals, RF, Photonics)
  • By End User
  • Consumer Electronics
  • Industrial
  • Telecommunications
  • Automotive
  • Military & Aerospace
  • Medical Devices
  • By Region
  • North America
  • Europe
  • Asia Pacific
  • Rest of the World
  • Key Market Players
  • Taiwan Semiconductor Manufacturing Company, Ltd.
  • Intel Corporation
  • ASE Technology Holding Co., Ltd.
  • Amkor Technology
  • Broadcom
  • Texas Instruments Inc
  • United Microelectronics Corporation
  • JCET Group Co., Ltd.
  • Powertech Technology Inc.
Customization scope Free report customization (15% Free customization) with purchase. Addition or alteration to country, regional & segment scope.
Pricing and purchase options Reap the benefits of customized purchase options to fit your specific research requirements.

Objectives of the Study

  • To forecast the market size, in terms of value, for various segments with respect to five main regions, namely, North America, Europe, Asia-Pacific (APAC), Latin America (LATAM), Middle East & Africa (MEA)
  • To provide detailed information regarding the major factors influencing the growth of the Market (drivers, restraints, opportunities, and challenges)
  • To strategically analyze the micro markets with respect to the individual growth trends, future prospects, and contribution to the total market
  • To provide a detailed overview of the value chain and analyze market trends with the Porter's five forces analysis
  • To analyze the opportunities in the market for various stakeholders by identifying the high-growth Segments
  • To identify the key players and comprehensively analyze their market position in terms of ranking and core competencies, along with detailing the competitive landscape for the market leaders
  • To analyze competitive development such as joint ventures, mergers and acquisitions, new product launches and development, and research and development in the market

What does this Report Deliver?

  • Market Estimation for 20+ Countries
  • Historical data coverage: 2016 to 2022
  • Growth projections: 2022 to 2028
  • SkyQuest's premium market insights: Innovation matrix, IP analysis, Production Analysis, Value chain analysis, Technological trends, and Trade analysis
  • Customization on Segments, Regions, and Company Profiles
  • 100+ tables, 150+ Figures, 10+ matrix
  • Global and Country Market Trends
  • Comprehensive Mapping of Industry Parameters
  • Attractive Investment Proposition
  • Competitive Strategies Adopted by Leading Market Participants
  • Market drivers, restraints, opportunities, and its impact on the market
  • Regulatory scenario, regional dynamics, and insights of leading countries in each region
  • Segment trends analysis, opportunity, and growth
  • Opportunity analysis by region and country
  • Porter's five force analysis to know the market's condition
  • Pricing analysis
  • Parent market analysis
  • Product portfolio benchmarking

Table Of Content

Executive Summary

Market overview

  • Exhibit: Executive Summary – Chart on Market Overview
  • Exhibit: Executive Summary – Data Table on Market Overview
  • Exhibit: Executive Summary – Chart on 3D IC and 2.5D IC Packaging Market Characteristics
  • Exhibit: Executive Summary – Chart on Market by Geography
  • Exhibit: Executive Summary – Chart on Market Segmentation
  • Exhibit: Executive Summary – Chart on Incremental Growth
  • Exhibit: Executive Summary – Data Table on Incremental Growth
  • Exhibit: Executive Summary – Chart on Vendor Market Positioning

Parent Market Analysis

Market overview

Market size

  • Market Dynamics
    • Exhibit: Impact analysis of DROC, 2021
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
  • SWOT Analysis

KEY MARKET INSIGHTS

  • Technology Analysis
    • (Exhibit: Data Table: Name of technology and details)
  • Pricing Analysis
    • (Exhibit: Data Table: Name of technology and pricing details)
  • Supply Chain Analysis
    • (Exhibit: Detailed Supply Chain Presentation)
  • Value Chain Analysis
    • (Exhibit: Detailed Value Chain Presentation)
  • Ecosystem Of the Market
    • Exhibit: Parent Market Ecosystem Market Analysis
    • Exhibit: Market Characteristics of Parent Market
  • IP Analysis
    • (Exhibit: Data Table: Name of product/technology, patents filed, inventor/company name, acquiring firm)
  • Trade Analysis
    • (Exhibit: Data Table: Import and Export data details)
  • Startup Analysis
    • (Exhibit: Data Table: Emerging startups details)
  • Raw Material Analysis
    • (Exhibit: Data Table: Mapping of key raw materials)
  • Innovation Matrix
    • (Exhibit: Positioning Matrix: Mapping of new and existing technologies)
  • Pipeline product Analysis
    • (Exhibit: Data Table: Name of companies and pipeline products, regional mapping)
  • Macroeconomic Indicators

COVID IMPACT

  • Introduction
  • Impact On Economy—scenario Assessment
    • Exhibit: Data on GDP - Year-over-year growth 2016-2022 (%)
  • Revised Market Size
    • Exhibit: Data Table on 3D IC and 2.5D IC Packaging Market size and forecast 2021-2027 ($ million)
  • Impact Of COVID On Key Segments
    • Exhibit: Data Table on Segment Market size and forecast 2021-2027 ($ million)
  • COVID Strategies By Company
    • Exhibit: Analysis on key strategies adopted by companies

MARKET DYNAMICS & OUTLOOK

  • Market Dynamics
    • Exhibit: Impact analysis of DROC, 2021
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
  • Regulatory Landscape
    • Exhibit: Data Table on regulation from different region
  • SWOT Analysis
  • Porters Analysis
    • Competitive rivalry
      • Exhibit: Competitive rivalry Impact of key factors, 2021
    • Threat of substitute products
      • Exhibit: Threat of Substitute Products Impact of key factors, 2021
    • Bargaining power of buyers
      • Exhibit: buyers bargaining power Impact of key factors, 2021
    • Threat of new entrants
      • Exhibit: Threat of new entrants Impact of key factors, 2021
    • Bargaining power of suppliers
      • Exhibit: Threat of suppliers bargaining power Impact of key factors, 2021
  • Skyquest special insights on future disruptions
    • Political Impact
    • Economic impact
    • Social Impact
    • Technical Impact
    • Environmental Impact
    • Legal Impact

Market Size by Region

  • Chart on Market share by geography 2021-2027 (%)
  • Data Table on Market share by geography 2021-2027(%)
  • North America
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • USA
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Canada
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Europe
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • Germany
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Spain
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • France
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • UK
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of Europe
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Asia Pacific
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • China
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • India
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Japan
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • South Korea
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of Asia Pacific
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Latin America
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • Brazil
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of South America
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
  • Middle East & Africa (MEA)
    • Chart on Market share by country 2021-2027 (%)
    • Data Table on Market share by country 2021-2027(%)
    • GCC Countries
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • South Africa
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)
    • Rest of MEA
      • Exhibit: Chart on Market share 2021-2027 (%)
      • Exhibit: Market size and forecast 2021-2027 ($ million)

KEY COMPANY PROFILES

  • Competitive Landscape
    • Total number of companies covered
      • Exhibit: companies covered in the report, 2021
    • Top companies market positioning
      • Exhibit: company positioning matrix, 2021
    • Top companies market Share
      • Exhibit: Pie chart analysis on company market share, 2021(%)
  • nd 2.5D IC packaging market is estimated to be worth USD 49.3 billion in 2022 and is projected to reach USD 82.0 billion by 2028, at a CAGR of 10.7% during the forecast period. Growing adoption of high-end computing, servers, and data centers and miniaturization of IoT Devices are some of the major opportunities that lie ahead for the market.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • 3D IC and 2.5D IC Packaging Market Dynamics
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Driver: Growing demand for consumer electronics and gaming devices
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • With the latest technological advancements, there are many new gadgets coming up in the market, such as e-book readers, gaming devices, tablet computers, 3D smart glass, augmented reality, and virtual reality products which demand high-performance electronic components. 3D IC packaging technology has helped bridge the processor memory performance gap by shortening the critical path and reducing the latency. It also allows scaling to continue efficiently by moving the focus from device-level scaling to circuit- and system-level scaling.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • In addition, the advent of 5G technology has fueled the demand for 5G-enabled smartphones. According to Samsung, the demand for smartphones and 5G smartphones is expected to grow at a CAGR of 6% and 37%, respectively, from 2021 to 2025, due to the rising commercialization of 5G technology. Smartphone manufacturers such as Apple Inc., Samsung, Huawei, Vivo, Honor, OPPO, Xiaomi, and OnePlus have commercialized their 5G smartphones worldwide. Thus, the increase in the shipment of 5G smartphones is expected to fuel the demand for 3D IC and 2.5D IC packaging industry during the forecast period.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Restraint: Thermal issues resulting from higher level of integration
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • 3D IC offers highly dense multi-level integration per unit footprint. Though this is attractive for many applications where miniaturization is a concern, it also creates challenges for thermal management; increased integration leads to high on-chip temperature. 3D ICs have several issues that must be resolved, including a larger form factor, the requirement for a larger silicon interposer, and longer design cycles. Overheating is observed during the production of 3D ICs with TSVs. Elevated temperatures result in a drop in threshold voltage and degradation of mobility. The resistance and power dissipation increases as a major part of the component is made up of metal.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Opportunity: Rising number of smart infrastructure and smart city projects
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • 3D IC packaging can play a significant role in the development and implementation of smart city technology. Smart cities rely on a variety of electronic devices, sensors, and systems to collect and analyze data in real time, enabling better decision-making and more efficient resource management. By using 3D IC packaging, these devices and systems can be made smaller and more powerful and energy efficient. This helps reduce the overall cost and size of smart city infrastructure while improving performance and reliability.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Challenge: Reliability challenges with 3D IC packaging
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • The semiconductor industry business is primarily driven by applications such as data centers/cloud, mobility, and the Internet of Things (IoT). The packaging technique must advance alongside the scaling of integrated circuit (IC) technology in order to fulfill the demands of next-generation information and communication technology (ICT) systems. Package design and development must simultaneously meet cost, performance, form factor, and reliability objectives. In terms of powering the design, the power density is higher for a given footprint than for traditional 2D chips. However, answering reliability issues will be crucial.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • 3D IC and 2.5D IC Packaging Market Ecosystem
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • The 3D IC and 2.5D IC packaging technology market is marked by the presence of a few tier-1 companies, such as Samsung Electronics Co. Ltd (South Korea), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), and many more. These companies have created a competitive ecosystem by investing in research and development activities to launch highly efficient and reliable 3D IC and 2.5D IC packaging solutions.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Consumer electronics to hold largest market share among end users in 3D IC and 2.5D IC packaging market
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Consumer electronics, by end user, is expected to hold the largest market share of the 3D IC and 2.5D IC packaging market. Increasing memory requirements in consumer products such as smartphones and tablets are driving the need for various advanced memories such as double-data-rate (DDR) dynamic random-access memory (DRAM), flash memory, and so on to be integrated. The advanced memory architectures are driving the demand for the 3D IC and 2.5D IC packaging market to offer high-performing, large-capacity, and compact products.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • MEMS/Sensors to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • The functional components of MEMS are micro sensors, micro actuators, and microelectronics. The advanced elements of MEMS are accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, microphones, and smart sensors, among others. The key requirement in all these elements and sensors is a miniaturized structure. Therefore, many sensors have started adopting 3D IC and 2.5D IC packages.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • 3D WLCSP to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • 3D WLCSP is one of the most compact package types, with increased functionality and improved thermal performance in printed circuit boards compared to 3D TSV and 2.5D IC. 3D WLCSP has a simplified process design for manufacturing 3D ICs, which uses polymers that can sustain high temperatures, thus addressing the thermal issue, which is the major challenge for this market. 3D WLCSP has gained popularity in space-constrained consumer electronic applications and other portable consumer devices as well as industrial products as it offers cost-effective, small, lightweight, high-performance semiconductor solutions.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Asia Pacific held to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • The Asia Pacific region is one of the key markets for 3D IC and 2.5D IC packaging owing to its broad scope in various consumer electronics applications, particularly in smartphones and tablets. This is mainly because of the high population density in the region, making it the largest potential market for 3D IC and 2.5D IC packaging among the four major regions.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Recent Developments
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • In February 2023, Amkor Technology (US) has partnered with GlobalFoundries (US), a semiconductor manufacturer. Under the arrangement, foundry chipmaker GlobalFoundries will transfer bump and sort lines for 300 mm wafers from its Dresden wafer fab to Amkor’s facility in Porto, Portugal. This strategic partnership with GlobalFoundries will enhance Amkor's advanced semiconductor packaging supply chain.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • In February 2023, UMC (Taiwan) and Cadence (US) collaborated on 3D-IC Hybrid Bonding Reference Flow. This technology supports the integration across a broad range of technology nodes suitable for edge AI, image processing, and wireless communication applications. Cost-effectiveness and design reliability are the pillars of UMC’s hybrid bonding technologies, and this collaboration with Cadence provides mutual customers with both, helping them reap the benefits of 3D structures while also accelerating the time needed to complete their integrated designs.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • In June 2022, Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., launched VIPack, an advanced packaging platform designed to enable vertically integrated package solutions. The platform leverages advanced re-distribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • KEY MARKET SEGMENTS
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • By Packaging Technology
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • 3D wafer-level chip-scale packaging (WLCSP)
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • 3D Through-silicon via (TSV)
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • 2.5D
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • By Application
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Logic
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Imaging & Optoelectronics
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Memory
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • MEMS/Sensors
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • LED
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Others (Power, Analog & Mixed Signals, RF, Photonics)
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • By End User
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Consumer Electronics
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Industrial
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Telecommunications
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Automotive
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Military & Aerospace
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Medical Devices
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • By Region
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • North America
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Europe
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Asia Pacific
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Rest of the World
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Key Market Players
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Intel Corporation
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • ASE Technology Holding Co., Ltd.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Amkor Technology
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Broadcom
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Texas Instruments Inc
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • United Microelectronics Corporation
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • JCET Group Co., Ltd.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments
  • Powertech Technology Inc.
    • Exhibit Company Overview
    • Exhibit Business Segment Overview
    • Exhibit Financial Updates
    • Exhibit Key Developments

Methodology

For the 3D IC and 2.5D IC Packaging Market, our research methodology involved a mixture of primary and secondary data sources. Key steps involved in the research process are listed below:

1. Information Procurement: This stage involved the procurement of Market data or related information via primary and secondary sources. The various secondary sources used included various company websites, annual reports, trade databases, and paid databases such as Hoover's, Bloomberg Business, Factiva, and Avention. Our team did 45 primary interactions Globally which included several stakeholders such as manufacturers, customers, key opinion leaders, etc. Overall, information procurement was one of the most extensive stages in our research process.

2. Information Analysis: This step involved triangulation of data through bottom-up and top-down approaches to estimate and validate the total size and future estimate of the 3D IC and 2.5D IC Packaging Market.

3. Report Formulation: The final step entailed the placement of data points in appropriate Market spaces in an attempt to deduce viable conclusions.

4. Validation & Publishing: Validation is the most important step in the process. Validation & re-validation via an intricately designed process helped us finalize data points to be used for final calculations. The final Market estimates and forecasts were then aligned and sent to our panel of industry experts for validation of data. Once the validation was done the report was sent to our Quality Assurance team to ensure adherence to style guides, consistency & design.

Analyst Support

Customization Options

With the given market data, our dedicated team of analysts can offer you the following customization options are available for the 3D IC and 2.5D IC Packaging Market:

Product Analysis: Product matrix, which offers a detailed comparison of the product portfolio of companies.

Regional Analysis: Further analysis of the 3D IC and 2.5D IC Packaging Market for additional countries.

Competitive Analysis: Detailed analysis and profiling of additional Market players & comparative analysis of competitive products.

Go to Market Strategy: Find the high-growth channels to invest your marketing efforts and increase your customer base.

Innovation Mapping: Identify racial solutions and innovation, connected to deep ecosystems of innovators, start-ups, academics, and strategic partners.

Category Intelligence: Customized intelligence that is relevant to their supply Markets will enable them to make smarter sourcing decisions and improve their category management.

Public Company Transcript Analysis: To improve the investment performance by generating new alpha and making better-informed decisions.

Social Media Listening: To analyze the conversations and trends happening not just around your brand, but around your industry as a whole, and use those insights to make better Marketing decisions.

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FAQs

The global market for 3D IC and 2.5D IC Packaging was estimated to be valued at US$ XX Mn in 2021.

The global 3D IC and 2.5D IC Packaging Market is estimated to grow at a CAGR of XX% by 2028.

The global 3D IC and 2.5D IC Packaging Market is segmented on the basis of Packaging Technology, Application, End User, Region.

Based on region, the global 3D IC and 2.5D IC Packaging Market is segmented into North America, Europe, Asia Pacific, Middle East & Africa and Latin America.

The key players operating in the global 3D IC and 2.5D IC Packaging Market are nd 2.5D IC packaging market is estimated to be worth USD 49.3 billion in 2022 and is projected to reach USD 82.0 billion by 2028, at a CAGR of 10.7% during the forecast period. Growing adoption of high-end computing, servers, and data centers and miniaturization of IoT Devices are some of the major opportunities that lie ahead for the market., 3D IC and 2.5D IC Packaging Market Dynamics, Driver: Growing demand for consumer electronics and gaming devices, With the latest technological advancements, there are many new gadgets coming up in the market, such as e-book readers, gaming devices, tablet computers, 3D smart glass, augmented reality, and virtual reality products which demand high-performance electronic components. 3D IC packaging technology has helped bridge the processor memory performance gap by shortening the critical path and reducing the latency. It also allows scaling to continue efficiently by moving the focus from device-level scaling to circuit- and system-level scaling., In addition, the advent of 5G technology has fueled the demand for 5G-enabled smartphones. According to Samsung, the demand for smartphones and 5G smartphones is expected to grow at a CAGR of 6% and 37%, respectively, from 2021 to 2025, due to the rising commercialization of 5G technology. Smartphone manufacturers such as Apple Inc., Samsung, Huawei, Vivo, Honor, OPPO, Xiaomi, and OnePlus have commercialized their 5G smartphones worldwide. Thus, the increase in the shipment of 5G smartphones is expected to fuel the demand for 3D IC and 2.5D IC packaging industry during the forecast period., Restraint: Thermal issues resulting from higher level of integration, 3D IC offers highly dense multi-level integration per unit footprint. Though this is attractive for many applications where miniaturization is a concern, it also creates challenges for thermal management; increased integration leads to high on-chip temperature. 3D ICs have several issues that must be resolved, including a larger form factor, the requirement for a larger silicon interposer, and longer design cycles. Overheating is observed during the production of 3D ICs with TSVs. Elevated temperatures result in a drop in threshold voltage and degradation of mobility. The resistance and power dissipation increases as a major part of the component is made up of metal., Opportunity: Rising number of smart infrastructure and smart city projects, 3D IC packaging can play a significant role in the development and implementation of smart city technology. Smart cities rely on a variety of electronic devices, sensors, and systems to collect and analyze data in real time, enabling better decision-making and more efficient resource management. By using 3D IC packaging, these devices and systems can be made smaller and more powerful and energy efficient. This helps reduce the overall cost and size of smart city infrastructure while improving performance and reliability., Challenge: Reliability challenges with 3D IC packaging, The semiconductor industry business is primarily driven by applications such as data centers/cloud, mobility, and the Internet of Things (IoT). The packaging technique must advance alongside the scaling of integrated circuit (IC) technology in order to fulfill the demands of next-generation information and communication technology (ICT) systems. Package design and development must simultaneously meet cost, performance, form factor, and reliability objectives. In terms of powering the design, the power density is higher for a given footprint than for traditional 2D chips. However, answering reliability issues will be crucial., 3D IC and 2.5D IC Packaging Market Ecosystem, The 3D IC and 2.5D IC packaging technology market is marked by the presence of a few tier-1 companies, such as Samsung Electronics Co. Ltd (South Korea), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), and many more. These companies have created a competitive ecosystem by investing in research and development activities to launch highly efficient and reliable 3D IC and 2.5D IC packaging solutions., Consumer electronics to hold largest market share among end users in 3D IC and 2.5D IC packaging market, Consumer electronics, by end user, is expected to hold the largest market share of the 3D IC and 2.5D IC packaging market. Increasing memory requirements in consumer products such as smartphones and tablets are driving the need for various advanced memories such as double-data-rate (DDR) dynamic random-access memory (DRAM), flash memory, and so on to be integrated. The advanced memory architectures are driving the demand for the 3D IC and 2.5D IC packaging market to offer high-performing, large-capacity, and compact products., MEMS/Sensors to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period, The functional components of MEMS are micro sensors, micro actuators, and microelectronics. The advanced elements of MEMS are accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, microphones, and smart sensors, among others. The key requirement in all these elements and sensors is a miniaturized structure. Therefore, many sensors have started adopting 3D IC and 2.5D IC packages., 3D WLCSP to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period, 3D WLCSP is one of the most compact package types, with increased functionality and improved thermal performance in printed circuit boards compared to 3D TSV and 2.5D IC. 3D WLCSP has a simplified process design for manufacturing 3D ICs, which uses polymers that can sustain high temperatures, thus addressing the thermal issue, which is the major challenge for this market. 3D WLCSP has gained popularity in space-constrained consumer electronic applications and other portable consumer devices as well as industrial products as it offers cost-effective, small, lightweight, high-performance semiconductor solutions., Asia Pacific held to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period, The Asia Pacific region is one of the key markets for 3D IC and 2.5D IC packaging owing to its broad scope in various consumer electronics applications, particularly in smartphones and tablets. This is mainly because of the high population density in the region, making it the largest potential market for 3D IC and 2.5D IC packaging among the four major regions., Recent Developments, In February 2023, Amkor Technology (US) has partnered with GlobalFoundries (US), a semiconductor manufacturer. Under the arrangement, foundry chipmaker GlobalFoundries will transfer bump and sort lines for 300 mm wafers from its Dresden wafer fab to Amkor’s facility in Porto, Portugal. This strategic partnership with GlobalFoundries will enhance Amkor's advanced semiconductor packaging supply chain., In February 2023, UMC (Taiwan) and Cadence (US) collaborated on 3D-IC Hybrid Bonding Reference Flow. This technology supports the integration across a broad range of technology nodes suitable for edge AI, image processing, and wireless communication applications. Cost-effectiveness and design reliability are the pillars of UMC’s hybrid bonding technologies, and this collaboration with Cadence provides mutual customers with both, helping them reap the benefits of 3D structures while also accelerating the time needed to complete their integrated designs., In June 2022, Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., launched VIPack, an advanced packaging platform designed to enable vertically integrated package solutions. The platform leverages advanced re-distribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package., KEY MARKET SEGMENTS, By Packaging Technology, 3D wafer-level chip-scale packaging (WLCSP), 3D Through-silicon via (TSV), 2.5D, By Application, Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Others (Power, Analog & Mixed Signals, RF, Photonics), By End User, Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, By Region, North America, Europe, Asia Pacific, Rest of the World, Key Market Players, Taiwan Semiconductor Manufacturing Company, Ltd. , Intel Corporation , ASE Technology Holding Co., Ltd., Amkor Technology , Broadcom, Texas Instruments Inc, United Microelectronics Corporation, JCET Group Co., Ltd., Powertech Technology Inc..

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