
Report ID: SQMIG45O2029
Skyquest Technology's expert advisors have carried out comprehensive research and identified these companies as industry leaders in the Semiconductor Foundry Market. This Analysis is based on comprehensive primary and secondary research on the corporate strategies, financial and operational performance, product portfolio, market share and brand analysis of all the leading Semiconductor Foundry industry players.
The major companies are entering strategic partnerships with other key market leaders for the purpose of expanding their portfolio so that they can provide the most effective low-code and no-code solutions to serve the application needs of their clients. In addition, in partnership, the companies improve their know-how and reach out to a large consumer base, and thus they expand. The large companies produce innovative solutions to consumers and industries so that they cater to the increasing needs of holding on to customers.
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Semiconductor Foundry Market size was valued at USD 115.6 Billion in 2023 and is poised to grow from USD 124.99 Billion in 2024 to USD 233.41 Billion by 2032, growing at a CAGR of 8.12% during the forecast period (2025-2032).
'Taiwan Semiconductor Manufacturing Company Limited ', 'United Microelectronics Corporation ', 'GlobalFoundries ', 'SMIC ', 'Tower Semiconductor ', 'Powerchip Semiconductor Manufacturing Corp. ', 'Vanguard International Semiconductor Corporation ', 'Hua Hong Semiconductor Limited ', 'DB HITEK ', 'Intel Corporation ', 'Samsung Group ', 'Dongbu HiTek ', 'Hua Hong Semiconductor Limited ', 'Infineon Technologies AG ', 'Renesas Electronics ', 'Microchip Technology Inc. ', 'Silicon Labs ', 'Broadcom, Inc. ', 'Cypress Semiconductor ', 'AnSem N.V. ', 'Maxim Integrated ', 'NXP Semiconductors'
Transition to More Advanced Packaging and Smaller Nodes: Major moves in the semiconductor foundry include more advanced packaging techniques as well as reduced process nodes (5nm, 3nm). Reduced nodes offer higher transistor density, and better performance along with higher application efficiency in areas such as artificial intelligence, 5G, and high-performance computing. Packaging innovation in forms of chiplets and 3D stacking is rapidly gaining popularity since they exhibit better functionality as well as greater integration for applications facing reduced space.
The size and share of the semiconductor foundry market are maximum in Asia Pacific. Region has become a super place for semiconductor manufacturing particularly by China, Taiwan and South Korea. Strong foundries in this region with major share and years of semiconductor fabrications, such as TSMC, Samsung Foundry and SMIC support these countries. Taiwanese chip maker TSMC announced in April 2024 that it will be building its third semiconductor production facility in Phoenix, Arizona, in the United States. TSMC Arizona and the U.S. Department of Commerce have signed a memorandum of agreement under the CHIPS and Science Act, which may result in up to USD 6.6 billion in direct funding.
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Report ID: SQMIG45O2029
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